JPS49107674A - - Google Patents

Info

Publication number
JPS49107674A
JPS49107674A JP48019670A JP1967073A JPS49107674A JP S49107674 A JPS49107674 A JP S49107674A JP 48019670 A JP48019670 A JP 48019670A JP 1967073 A JP1967073 A JP 1967073A JP S49107674 A JPS49107674 A JP S49107674A
Authority
JP
Japan
Prior art keywords
leads
frame
strip
plate
feb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48019670A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5144385B2 (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48019670A priority Critical patent/JPS5144385B2/ja
Priority to DE19742406086 priority patent/DE2406086A1/de
Priority to GB614574A priority patent/GB1406207A/en
Priority to NL7402112A priority patent/NL7402112A/xx
Priority to FR7405267A priority patent/FR2218654A1/fr
Priority to IT48410/74A priority patent/IT1008848B/it
Publication of JPS49107674A publication Critical patent/JPS49107674A/ja
Publication of JPS5144385B2 publication Critical patent/JPS5144385B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electroplating Methods And Accessories (AREA)
JP48019670A 1973-02-16 1973-02-16 Expired JPS5144385B2 (OSRAM)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP48019670A JPS5144385B2 (OSRAM) 1973-02-16 1973-02-16
DE19742406086 DE2406086A1 (de) 1973-02-16 1974-02-08 Verfahren zur herstellung eines metallrahmens fuer eine halbleitervorrichtung
GB614574A GB1406207A (en) 1973-02-16 1974-02-11 Method of manufacturing a metallic lead frame for a semiconductor device
NL7402112A NL7402112A (OSRAM) 1973-02-16 1974-02-15
FR7405267A FR2218654A1 (OSRAM) 1973-02-16 1974-02-15
IT48410/74A IT1008848B (it) 1973-02-16 1974-02-15 Procedimento per la fabbricazione di intelaiature metalliche per di spositivi a semiconduttori

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48019670A JPS5144385B2 (OSRAM) 1973-02-16 1973-02-16

Publications (2)

Publication Number Publication Date
JPS49107674A true JPS49107674A (OSRAM) 1974-10-12
JPS5144385B2 JPS5144385B2 (OSRAM) 1976-11-27

Family

ID=12005666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48019670A Expired JPS5144385B2 (OSRAM) 1973-02-16 1973-02-16

Country Status (6)

Country Link
JP (1) JPS5144385B2 (OSRAM)
DE (1) DE2406086A1 (OSRAM)
FR (1) FR2218654A1 (OSRAM)
GB (1) GB1406207A (OSRAM)
IT (1) IT1008848B (OSRAM)
NL (1) NL7402112A (OSRAM)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227779U (OSRAM) * 1975-08-15 1977-02-26
JPS5299069A (en) * 1976-02-16 1977-08-19 Hitachi Ltd Production of lead frame
JPS5322660U (OSRAM) * 1976-08-05 1978-02-25
JPS5832439A (ja) * 1982-03-01 1983-02-25 Nec Corp リ−ドフレ−ム

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3040676A1 (de) * 1980-10-29 1982-05-27 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zum herstellen von halbleiteranordnugen
US5038453A (en) * 1988-07-22 1991-08-13 Rohm Co., Ltd. Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor
GB8910685D0 (en) * 1989-05-10 1989-06-28 Moran Peter Integrated circuit package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227779U (OSRAM) * 1975-08-15 1977-02-26
JPS5299069A (en) * 1976-02-16 1977-08-19 Hitachi Ltd Production of lead frame
JPS5322660U (OSRAM) * 1976-08-05 1978-02-25
JPS5832439A (ja) * 1982-03-01 1983-02-25 Nec Corp リ−ドフレ−ム

Also Published As

Publication number Publication date
NL7402112A (OSRAM) 1974-08-20
IT1008848B (it) 1976-11-30
FR2218654A1 (OSRAM) 1974-09-13
DE2406086A1 (de) 1974-09-05
GB1406207A (en) 1975-09-17
JPS5144385B2 (OSRAM) 1976-11-27

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