JPS6437854A - Manufacture of lead frame for semiconductor device - Google Patents

Manufacture of lead frame for semiconductor device

Info

Publication number
JPS6437854A
JPS6437854A JP19463187A JP19463187A JPS6437854A JP S6437854 A JPS6437854 A JP S6437854A JP 19463187 A JP19463187 A JP 19463187A JP 19463187 A JP19463187 A JP 19463187A JP S6437854 A JPS6437854 A JP S6437854A
Authority
JP
Japan
Prior art keywords
section
lead
lead frame
island
working
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19463187A
Other languages
Japanese (ja)
Inventor
Kenji Suetake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP19463187A priority Critical patent/JPS6437854A/en
Publication of JPS6437854A publication Critical patent/JPS6437854A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To form a lead frame without deformation in a short time by conducting plating as an island section and the nose of an inner lead section are left as they are connected and detaching the island section and the nose of the inner lead section. CONSTITUTION:The noses of inner lead sections and an island section are connected through press working or etching working, and a lead frame 10 in which inner-lead forming predetermined sections 1A and an island forming prearranged section are unified is manufactured. A required section including the inner-lead forming predetermined sections 1A and the island forming prearranged section 2A is plated 3. The unnecessary section of the plated lead frame 10 is removed through press working or etching working. The finished product of the lead frame 10 is acquired through cutting by press working, etc., by cutting lines 4.
JP19463187A 1987-08-03 1987-08-03 Manufacture of lead frame for semiconductor device Pending JPS6437854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19463187A JPS6437854A (en) 1987-08-03 1987-08-03 Manufacture of lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19463187A JPS6437854A (en) 1987-08-03 1987-08-03 Manufacture of lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS6437854A true JPS6437854A (en) 1989-02-08

Family

ID=16327727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19463187A Pending JPS6437854A (en) 1987-08-03 1987-08-03 Manufacture of lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS6437854A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998002919A1 (en) * 1996-07-12 1998-01-22 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device
US6881611B1 (en) 1996-07-12 2005-04-19 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998002919A1 (en) * 1996-07-12 1998-01-22 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the device
US6881611B1 (en) 1996-07-12 2005-04-19 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device

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