JPS6447062A - Partial plating - Google Patents

Partial plating

Info

Publication number
JPS6447062A
JPS6447062A JP20474487A JP20474487A JPS6447062A JP S6447062 A JPS6447062 A JP S6447062A JP 20474487 A JP20474487 A JP 20474487A JP 20474487 A JP20474487 A JP 20474487A JP S6447062 A JPS6447062 A JP S6447062A
Authority
JP
Japan
Prior art keywords
plating
dam bar
patterns
rubber mask
prevented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20474487A
Other languages
Japanese (ja)
Inventor
Yoichi Oya
Koichi Ishido
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP20474487A priority Critical patent/JPS6447062A/en
Publication of JPS6447062A publication Critical patent/JPS6447062A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To enable plating to be high in accuracy by a method wherein a lead frame is utilized, where paired patterns are processed in such a manner that a surplus section, which is removed by punching after plating is completed, is made to be broad extending from the inside of dam bar to inside the package line and a plating process is performed onto the position required to be plated using a rubber mask. CONSTITUTION:Paired patterns are contrived which are previously processed in such a manner that the patterns are made to be broad extending from the inside of a dam bar to a surplus section 10 which protrudes into a package line 2, and a plating process is performed onto the position required to be platedusign a rubber mask, and then the dam bar 4 is cut off through a press work. By these processes, a plating solution is prevented from leaking out from a prescribed position partially covered with a rubber mask and the lead frame is prevented from being sent to a final process with the plating attached to a unwanted part.
JP20474487A 1987-08-18 1987-08-18 Partial plating Pending JPS6447062A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20474487A JPS6447062A (en) 1987-08-18 1987-08-18 Partial plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20474487A JPS6447062A (en) 1987-08-18 1987-08-18 Partial plating

Publications (1)

Publication Number Publication Date
JPS6447062A true JPS6447062A (en) 1989-02-21

Family

ID=16495606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20474487A Pending JPS6447062A (en) 1987-08-18 1987-08-18 Partial plating

Country Status (1)

Country Link
JP (1) JPS6447062A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01144661A (en) * 1987-11-30 1989-06-06 Mitsui High Tec Inc Manufacture of lead frame

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6214451A (en) * 1985-07-12 1987-01-23 Hitachi Cable Ltd Lead frame
JPS62248246A (en) * 1986-04-21 1987-10-29 Nec Corp Lead frame for semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6214451A (en) * 1985-07-12 1987-01-23 Hitachi Cable Ltd Lead frame
JPS62248246A (en) * 1986-04-21 1987-10-29 Nec Corp Lead frame for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01144661A (en) * 1987-11-30 1989-06-06 Mitsui High Tec Inc Manufacture of lead frame

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