JPS6447062A - Partial plating - Google Patents
Partial platingInfo
- Publication number
- JPS6447062A JPS6447062A JP20474487A JP20474487A JPS6447062A JP S6447062 A JPS6447062 A JP S6447062A JP 20474487 A JP20474487 A JP 20474487A JP 20474487 A JP20474487 A JP 20474487A JP S6447062 A JPS6447062 A JP S6447062A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- dam bar
- patterns
- rubber mask
- prevented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To enable plating to be high in accuracy by a method wherein a lead frame is utilized, where paired patterns are processed in such a manner that a surplus section, which is removed by punching after plating is completed, is made to be broad extending from the inside of dam bar to inside the package line and a plating process is performed onto the position required to be plated using a rubber mask. CONSTITUTION:Paired patterns are contrived which are previously processed in such a manner that the patterns are made to be broad extending from the inside of a dam bar to a surplus section 10 which protrudes into a package line 2, and a plating process is performed onto the position required to be platedusign a rubber mask, and then the dam bar 4 is cut off through a press work. By these processes, a plating solution is prevented from leaking out from a prescribed position partially covered with a rubber mask and the lead frame is prevented from being sent to a final process with the plating attached to a unwanted part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20474487A JPS6447062A (en) | 1987-08-18 | 1987-08-18 | Partial plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20474487A JPS6447062A (en) | 1987-08-18 | 1987-08-18 | Partial plating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6447062A true JPS6447062A (en) | 1989-02-21 |
Family
ID=16495606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20474487A Pending JPS6447062A (en) | 1987-08-18 | 1987-08-18 | Partial plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6447062A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01144661A (en) * | 1987-11-30 | 1989-06-06 | Mitsui High Tec Inc | Manufacture of lead frame |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6214451A (en) * | 1985-07-12 | 1987-01-23 | Hitachi Cable Ltd | Lead frame |
JPS62248246A (en) * | 1986-04-21 | 1987-10-29 | Nec Corp | Lead frame for semiconductor device |
-
1987
- 1987-08-18 JP JP20474487A patent/JPS6447062A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6214451A (en) * | 1985-07-12 | 1987-01-23 | Hitachi Cable Ltd | Lead frame |
JPS62248246A (en) * | 1986-04-21 | 1987-10-29 | Nec Corp | Lead frame for semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01144661A (en) * | 1987-11-30 | 1989-06-06 | Mitsui High Tec Inc | Manufacture of lead frame |
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