JPS49107674A - - Google Patents

Info

Publication number
JPS49107674A
JPS49107674A JP48019670A JP1967073A JPS49107674A JP S49107674 A JPS49107674 A JP S49107674A JP 48019670 A JP48019670 A JP 48019670A JP 1967073 A JP1967073 A JP 1967073A JP S49107674 A JPS49107674 A JP S49107674A
Authority
JP
Japan
Prior art keywords
leads
frame
strip
plate
feb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48019670A
Other languages
Japanese (ja)
Other versions
JPS5144385B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48019670A priority Critical patent/JPS5144385B2/ja
Priority to DE19742406086 priority patent/DE2406086A1/en
Priority to GB614574A priority patent/GB1406207A/en
Priority to IT48410/74A priority patent/IT1008848B/en
Priority to NL7402112A priority patent/NL7402112A/xx
Priority to FR7405267A priority patent/FR2218654A1/fr
Publication of JPS49107674A publication Critical patent/JPS49107674A/ja
Publication of JPS5144385B2 publication Critical patent/JPS5144385B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4821Flat leads, e.g. lead frames with or without insulating supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49579Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582Metallic layers on lead frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

1406207 Making lead frames MATSUSHITA ELECTRONICS CORP 11 Feb 1974 [16 Feb 1973] 06145/74 Heading B3A [Also in Division H1] A metallic lead frame for a semiconductor is made by plating a strip 10 of precious metal, e.g. gold on a metallic plate and punching out the frame from the plate such that the tips of leads 2, 3, 4 are positioned on the strip 10. The metallic plate may be plated with nickel or cobalt before plating the precious strip 10, which may be positioned in the middle of, as shown, or at the side edge of the plate. After a frame having sets of leads, 2, 3, 4 has been punched out, transistor bodies are mounted on the leads 3 and electrodes of the transistors are connected to the leads 2, 4. The transistors are encapsulated with plastics whereupon each set of leads 2, 3, 4 is separated from the remainder of the frame.
JP48019670A 1973-02-16 1973-02-16 Expired JPS5144385B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP48019670A JPS5144385B2 (en) 1973-02-16 1973-02-16
DE19742406086 DE2406086A1 (en) 1973-02-16 1974-02-08 METHOD OF MANUFACTURING A METAL FRAME FOR A SEMICONDUCTOR DEVICE
GB614574A GB1406207A (en) 1973-02-16 1974-02-11 Method of manufacturing a metallic lead frame for a semiconductor device
IT48410/74A IT1008848B (en) 1973-02-16 1974-02-15 PROCEDURE FOR THE MANUFACTURE OF METAL FRAMES FOR SEMICONDUCTOR DEVICES
NL7402112A NL7402112A (en) 1973-02-16 1974-02-15
FR7405267A FR2218654A1 (en) 1973-02-16 1974-02-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48019670A JPS5144385B2 (en) 1973-02-16 1973-02-16

Publications (2)

Publication Number Publication Date
JPS49107674A true JPS49107674A (en) 1974-10-12
JPS5144385B2 JPS5144385B2 (en) 1976-11-27

Family

ID=12005666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48019670A Expired JPS5144385B2 (en) 1973-02-16 1973-02-16

Country Status (6)

Country Link
JP (1) JPS5144385B2 (en)
DE (1) DE2406086A1 (en)
FR (1) FR2218654A1 (en)
GB (1) GB1406207A (en)
IT (1) IT1008848B (en)
NL (1) NL7402112A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227779U (en) * 1975-08-15 1977-02-26
JPS5299069A (en) * 1976-02-16 1977-08-19 Hitachi Ltd Production of lead frame
JPS5322660U (en) * 1976-08-05 1978-02-25
JPS5832439A (en) * 1982-03-01 1983-02-25 Nec Corp Lead frame

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3040676A1 (en) * 1980-10-29 1982-05-27 Philips Patentverwaltung Gmbh, 2000 Hamburg Semiconductor devices made using metal lead frame strip - where leads are coated with tin prior to assembling semiconductor chips into strip
US5038453A (en) * 1988-07-22 1991-08-13 Rohm Co., Ltd. Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor
GB8910685D0 (en) * 1989-05-10 1989-06-28 Moran Peter Integrated circuit package

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227779U (en) * 1975-08-15 1977-02-26
JPS5519001Y2 (en) * 1975-08-15 1980-05-06
JPS5299069A (en) * 1976-02-16 1977-08-19 Hitachi Ltd Production of lead frame
JPS5322660U (en) * 1976-08-05 1978-02-25
JPS5832439A (en) * 1982-03-01 1983-02-25 Nec Corp Lead frame
JPS6211785B2 (en) * 1982-03-01 1987-03-14 Nippon Electric Co

Also Published As

Publication number Publication date
NL7402112A (en) 1974-08-20
JPS5144385B2 (en) 1976-11-27
FR2218654A1 (en) 1974-09-13
IT1008848B (en) 1976-11-30
DE2406086A1 (en) 1974-09-05
GB1406207A (en) 1975-09-17

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