JPS5144385B2 - - Google Patents

Info

Publication number
JPS5144385B2
JPS5144385B2 JP48019670A JP1967073A JPS5144385B2 JP S5144385 B2 JPS5144385 B2 JP S5144385B2 JP 48019670 A JP48019670 A JP 48019670A JP 1967073 A JP1967073 A JP 1967073A JP S5144385 B2 JPS5144385 B2 JP S5144385B2
Authority
JP
Japan
Prior art keywords
leads
frame
strip
plate
feb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP48019670A
Other languages
Japanese (ja)
Other versions
JPS49107674A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48019670A priority Critical patent/JPS5144385B2/ja
Priority to DE19742406086 priority patent/DE2406086A1/en
Priority to GB614574A priority patent/GB1406207A/en
Priority to FR7405267A priority patent/FR2218654A1/fr
Priority to NL7402112A priority patent/NL7402112A/xx
Priority to IT48410/74A priority patent/IT1008848B/en
Publication of JPS49107674A publication Critical patent/JPS49107674A/ja
Publication of JPS5144385B2 publication Critical patent/JPS5144385B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

1406207 Making lead frames MATSUSHITA ELECTRONICS CORP 11 Feb 1974 [16 Feb 1973] 06145/74 Heading B3A [Also in Division H1] A metallic lead frame for a semiconductor is made by plating a strip 10 of precious metal, e.g. gold on a metallic plate and punching out the frame from the plate such that the tips of leads 2, 3, 4 are positioned on the strip 10. The metallic plate may be plated with nickel or cobalt before plating the precious strip 10, which may be positioned in the middle of, as shown, or at the side edge of the plate. After a frame having sets of leads, 2, 3, 4 has been punched out, transistor bodies are mounted on the leads 3 and electrodes of the transistors are connected to the leads 2, 4. The transistors are encapsulated with plastics whereupon each set of leads 2, 3, 4 is separated from the remainder of the frame.
JP48019670A 1973-02-16 1973-02-16 Expired JPS5144385B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP48019670A JPS5144385B2 (en) 1973-02-16 1973-02-16
DE19742406086 DE2406086A1 (en) 1973-02-16 1974-02-08 METHOD OF MANUFACTURING A METAL FRAME FOR A SEMICONDUCTOR DEVICE
GB614574A GB1406207A (en) 1973-02-16 1974-02-11 Method of manufacturing a metallic lead frame for a semiconductor device
FR7405267A FR2218654A1 (en) 1973-02-16 1974-02-15
NL7402112A NL7402112A (en) 1973-02-16 1974-02-15
IT48410/74A IT1008848B (en) 1973-02-16 1974-02-15 PROCEDURE FOR THE MANUFACTURE OF METAL FRAMES FOR SEMICONDUCTOR DEVICES

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48019670A JPS5144385B2 (en) 1973-02-16 1973-02-16

Publications (2)

Publication Number Publication Date
JPS49107674A JPS49107674A (en) 1974-10-12
JPS5144385B2 true JPS5144385B2 (en) 1976-11-27

Family

ID=12005666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48019670A Expired JPS5144385B2 (en) 1973-02-16 1973-02-16

Country Status (6)

Country Link
JP (1) JPS5144385B2 (en)
DE (1) DE2406086A1 (en)
FR (1) FR2218654A1 (en)
GB (1) GB1406207A (en)
IT (1) IT1008848B (en)
NL (1) NL7402112A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5519001Y2 (en) * 1975-08-15 1980-05-06
JPS5299069A (en) * 1976-02-16 1977-08-19 Hitachi Ltd Production of lead frame
JPS5322660U (en) * 1976-08-05 1978-02-25
DE3040676A1 (en) * 1980-10-29 1982-05-27 Philips Patentverwaltung Gmbh, 2000 Hamburg Semiconductor devices made using metal lead frame strip - where leads are coated with tin prior to assembling semiconductor chips into strip
JPS5832439A (en) * 1982-03-01 1983-02-25 Nec Corp Lead frame
US5038453A (en) * 1988-07-22 1991-08-13 Rohm Co., Ltd. Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor
GB8910685D0 (en) * 1989-05-10 1989-06-28 Moran Peter Integrated circuit package

Also Published As

Publication number Publication date
NL7402112A (en) 1974-08-20
DE2406086A1 (en) 1974-09-05
FR2218654A1 (en) 1974-09-13
JPS49107674A (en) 1974-10-12
IT1008848B (en) 1976-11-30
GB1406207A (en) 1975-09-17

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