JPH11330257A - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法

Info

Publication number
JPH11330257A
JPH11330257A JP10153819A JP15381998A JPH11330257A JP H11330257 A JPH11330257 A JP H11330257A JP 10153819 A JP10153819 A JP 10153819A JP 15381998 A JP15381998 A JP 15381998A JP H11330257 A JPH11330257 A JP H11330257A
Authority
JP
Japan
Prior art keywords
semiconductor
chip
semiconductor chips
chips
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10153819A
Other languages
English (en)
Japanese (ja)
Inventor
Koichi Ikeda
孝市 池田
Takeshi Ikeda
毅 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TIF KK
Original Assignee
TIF KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TIF KK filed Critical TIF KK
Priority to JP10153819A priority Critical patent/JPH11330257A/ja
Priority to PCT/JP1999/002565 priority patent/WO1999060619A1/fr
Priority to TW88108079A priority patent/TW436683B/zh
Publication of JPH11330257A publication Critical patent/JPH11330257A/ja
Priority to US09/716,843 priority patent/US6969623B1/en
Priority to US09/716,165 priority patent/US6479306B1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP10153819A 1998-05-19 1998-05-19 半導体装置およびその製造方法 Pending JPH11330257A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP10153819A JPH11330257A (ja) 1998-05-19 1998-05-19 半導体装置およびその製造方法
PCT/JP1999/002565 WO1999060619A1 (fr) 1998-05-19 1999-05-18 Dispositif a semi-conducteurs et procede de fabrication dudit dispositif
TW88108079A TW436683B (en) 1998-05-19 1999-05-18 Semiconductor device and process of producing the same
US09/716,843 US6969623B1 (en) 1998-05-19 2000-11-17 Semiconductor device and method for manufacturing the same
US09/716,165 US6479306B1 (en) 1998-05-19 2000-11-17 Method for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10153819A JPH11330257A (ja) 1998-05-19 1998-05-19 半導体装置およびその製造方法

Publications (1)

Publication Number Publication Date
JPH11330257A true JPH11330257A (ja) 1999-11-30

Family

ID=15570793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10153819A Pending JPH11330257A (ja) 1998-05-19 1998-05-19 半導体装置およびその製造方法

Country Status (3)

Country Link
JP (1) JPH11330257A (fr)
TW (1) TW436683B (fr)
WO (1) WO1999060619A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1301062A3 (fr) * 2001-10-02 2006-08-09 Sony Computer Entertainment Inc. Dispositif semi-conducteur, empaquetage semi-conducteur, dispositif électronique, et procédé d'établissement d'un environnement de traitement d'information
US7675181B2 (en) 2006-12-05 2010-03-09 Samsung Electronics Co., Ltd. Planar multi semiconductor chip package and method of manufacturing the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4935586B1 (fr) * 1968-12-14 1974-09-24
JPH06334034A (ja) * 1993-05-21 1994-12-02 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH09199450A (ja) * 1996-01-22 1997-07-31 Oki Electric Ind Co Ltd ウエハ上の半導体素子ダイシング方法及び装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1301062A3 (fr) * 2001-10-02 2006-08-09 Sony Computer Entertainment Inc. Dispositif semi-conducteur, empaquetage semi-conducteur, dispositif électronique, et procédé d'établissement d'un environnement de traitement d'information
US7276791B2 (en) 2001-10-02 2007-10-02 Sony Computer Entertainment Inc. Board having alternating rows of processors and memories
US7675181B2 (en) 2006-12-05 2010-03-09 Samsung Electronics Co., Ltd. Planar multi semiconductor chip package and method of manufacturing the same
US8319351B2 (en) 2006-12-05 2012-11-27 Samsung Electronics Co., Ltd. Planar multi semiconductor chip package

Also Published As

Publication number Publication date
TW436683B (en) 2001-05-28
WO1999060619A1 (fr) 1999-11-25

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