JPH11312857A5 - - Google Patents

Info

Publication number
JPH11312857A5
JPH11312857A5 JP1998120465A JP12046598A JPH11312857A5 JP H11312857 A5 JPH11312857 A5 JP H11312857A5 JP 1998120465 A JP1998120465 A JP 1998120465A JP 12046598 A JP12046598 A JP 12046598A JP H11312857 A5 JPH11312857 A5 JP H11312857A5
Authority
JP
Japan
Prior art keywords
metal layer
bumps
wiring pattern
forming
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1998120465A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11312857A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP12046598A priority Critical patent/JPH11312857A/ja
Priority claimed from JP12046598A external-priority patent/JPH11312857A/ja
Publication of JPH11312857A publication Critical patent/JPH11312857A/ja
Publication of JPH11312857A5 publication Critical patent/JPH11312857A5/ja
Withdrawn legal-status Critical Current

Links

JP12046598A 1998-04-30 1998-04-30 配線板の製造法およびバンプ付配線基板の製造法 Withdrawn JPH11312857A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12046598A JPH11312857A (ja) 1998-04-30 1998-04-30 配線板の製造法およびバンプ付配線基板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12046598A JPH11312857A (ja) 1998-04-30 1998-04-30 配線板の製造法およびバンプ付配線基板の製造法

Publications (2)

Publication Number Publication Date
JPH11312857A JPH11312857A (ja) 1999-11-09
JPH11312857A5 true JPH11312857A5 (OSRAM) 2005-08-11

Family

ID=14786848

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12046598A Withdrawn JPH11312857A (ja) 1998-04-30 1998-04-30 配線板の製造法およびバンプ付配線基板の製造法

Country Status (1)

Country Link
JP (1) JPH11312857A (OSRAM)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3593935B2 (ja) * 1999-11-10 2004-11-24 ソニーケミカル株式会社 バンプ付き配線回路基板の製造方法及びバンプ形成方法
JP2005026598A (ja) 2003-07-01 2005-01-27 Tokyo Electron Ltd 多層配線基板形成用部材およびその製造方法ならびに多層配線基板
JP2006278837A (ja) 2005-03-30 2006-10-12 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板
JP2008135719A (ja) * 2006-10-31 2008-06-12 Sanyo Electric Co Ltd 半導体モジュール、半導体モジュールの製造方法および携帯機器
KR102729788B1 (ko) * 2020-02-11 2024-11-13 솔브레인 주식회사 선택적 식각 방법
JP2024132437A (ja) * 2023-03-17 2024-10-01 Ｄｏｗａメタルテック株式会社 銅－セラミックス回路基板およびその製造方法

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