JPH1129710A5 - - Google Patents

Info

Publication number
JPH1129710A5
JPH1129710A5 JP1997200861A JP20086197A JPH1129710A5 JP H1129710 A5 JPH1129710 A5 JP H1129710A5 JP 1997200861 A JP1997200861 A JP 1997200861A JP 20086197 A JP20086197 A JP 20086197A JP H1129710 A5 JPH1129710 A5 JP H1129710A5
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JP
Japan
Prior art keywords
units
groups
mol
polymer
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997200861A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1129710A (ja
JP3765444B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP20086197A priority Critical patent/JP3765444B2/ja
Priority claimed from JP20086197A external-priority patent/JP3765444B2/ja
Priority to US09/110,633 priority patent/US6001918A/en
Priority to DE69826370T priority patent/DE69826370T2/de
Priority to EP98112629A priority patent/EP0890617B1/en
Publication of JPH1129710A publication Critical patent/JPH1129710A/ja
Publication of JPH1129710A5 publication Critical patent/JPH1129710A5/ja
Application granted granted Critical
Publication of JP3765444B2 publication Critical patent/JP3765444B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP20086197A 1997-07-10 1997-07-10 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル Expired - Lifetime JP3765444B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP20086197A JP3765444B2 (ja) 1997-07-10 1997-07-10 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
US09/110,633 US6001918A (en) 1997-07-10 1998-07-06 Silicone gel composition for use as a sealant and a filler for electrical and electronic components and a gel prepared from this composition
DE69826370T DE69826370T2 (de) 1997-07-10 1998-07-08 Silikongel-Zusammensetzung zur Versiegelung und Füllung von elektrischen und elektronischen Bauelementen
EP98112629A EP0890617B1 (en) 1997-07-10 1998-07-08 Silicone gel composition for sealing and filling electrical and electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20086197A JP3765444B2 (ja) 1997-07-10 1997-07-10 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル

Publications (3)

Publication Number Publication Date
JPH1129710A JPH1129710A (ja) 1999-02-02
JPH1129710A5 true JPH1129710A5 (https=) 2005-05-12
JP3765444B2 JP3765444B2 (ja) 2006-04-12

Family

ID=16431450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20086197A Expired - Lifetime JP3765444B2 (ja) 1997-07-10 1997-07-10 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル

Country Status (4)

Country Link
US (1) US6001918A (https=)
EP (1) EP0890617B1 (https=)
JP (1) JP3765444B2 (https=)
DE (1) DE69826370T2 (https=)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3746394B2 (ja) * 1999-04-14 2006-02-15 東レ・ダウコーニング株式会社 シリコーンゲル組成物
US6458461B1 (en) 2000-12-06 2002-10-01 Lexmark International, Inc Release agent composition
JP4530137B2 (ja) 2003-09-17 2010-08-25 信越化学工業株式会社 精密電子部品封止・シール用オルガノポリシロキサン組成物、精密電子部品の腐蝕防止又は遅延方法、並びに銀含有精密電子部品
JP4908736B2 (ja) * 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
US7767754B2 (en) * 2005-11-08 2010-08-03 Momentive Performance Materials Inc. Silicone composition and process of making same
US20100224386A1 (en) * 2006-12-18 2010-09-09 Tam-Lim Oh Electronic parts
JP2009054983A (ja) * 2007-01-17 2009-03-12 Mitsubishi Pencil Co Ltd 電波吸収材およびその製造方法
WO2009044960A1 (en) * 2007-10-02 2009-04-09 Cheil Industries Inc. Gap-filling composition with excellent shelf life by end-capping
JP2009191119A (ja) * 2008-02-13 2009-08-27 Kaneka Corp シリコーン系重合体粒子を含有するシリコーン系硬化性組成物
WO2012053526A1 (ja) * 2010-10-20 2012-04-26 旭化成イーマテリアルズ株式会社 酸化物ナノ粒子反応生成物及びシリコーン組成物
CN103547632A (zh) * 2011-07-14 2014-01-29 积水化学工业株式会社 光半导体装置用密封剂及光半导体装置
EP2764055B1 (en) 2011-10-06 2018-03-21 Dow Corning Corporation Method of forming a gel having improved thermal stability
JP2014534295A (ja) * 2011-10-06 2014-12-18 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 改善された熱安定性を有するゲル
US9096032B2 (en) * 2012-04-24 2015-08-04 Shin-Etsu Chemical Co., Ltd. Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method
JP5975528B2 (ja) * 2012-10-11 2016-08-23 信越化学工業株式会社 ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
JP6213257B2 (ja) * 2013-01-25 2017-10-18 セントラル硝子株式会社 シリコーンを含む硬化性組成物およびその硬化物
WO2014160112A1 (en) 2013-03-14 2014-10-02 Dow Corning Corporation Metal thermal stabilization of polydiethylsiloxane and copolymers thereof
US9951186B2 (en) * 2013-09-03 2018-04-24 Dow Corning Toray Co., Ltd Silicone gel composition and use thereof
EP3099746B1 (en) 2014-01-27 2021-05-05 Dow Toray Co., Ltd. Silicone gel composition
JP2015212318A (ja) * 2014-05-01 2015-11-26 信越化学工業株式会社 熱伝導性シリコーン組成物
PL3239004T3 (pl) * 2015-06-23 2019-04-30 Pma/Tools Ag Elastomer silikonowy, mieszanka i optyczny element łączący
US20250092283A1 (en) * 2022-01-12 2025-03-20 Shin-Etsu Chemical Co., Ltd. Thixotropic silicone gel composition for spot potting, cured product thereof, and photocoupler
JP2024087720A (ja) * 2022-12-19 2024-07-01 信越化学工業株式会社 導電性シリコーン組成物及びその製造方法、並びに、接着剤及び導電性シリコーン硬化物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4340709A (en) * 1980-07-16 1982-07-20 General Electric Company Addition curing silicone compositions
JPS587452A (ja) * 1981-07-06 1983-01-17 ダウ　コ−ニング　コ−ポレ−ション 硬化性シロキサン組成物
JPS59204259A (ja) * 1983-05-06 1984-11-19 Hitachi Ltd 半導体装置の封止方法
JPS6148945A (ja) * 1984-08-16 1986-03-10 Toshiba Corp ハイプリツドｉｃモジユ−ル
US4584361A (en) * 1985-06-03 1986-04-22 Dow Corning Corporation Storage stable, one part polyorganosiloxane compositions
JPS62104145A (ja) * 1985-10-31 1987-05-14 Mitsubishi Electric Corp 半導体装置
US4801642A (en) * 1987-12-28 1989-01-31 Dow Corning Corporation Thermally stable organosiloxane compositions and method for preparing same
JPH0319269A (ja) * 1989-06-15 1991-01-28 Fujitsu Ltd 半導体装置の製造方法
US5334687A (en) * 1989-09-08 1994-08-02 Shin-Etsu Chemical Co., Ltd. Organopolysiloxane composition
US5059649A (en) * 1989-11-08 1991-10-22 Dow Corning Corporation Storage stable one-part fluorosilicone gel compositions exhibiting improved thermal stability
JP2582690B2 (ja) * 1991-09-13 1997-02-19 信越化学工業株式会社 防振特性に優れたシリコーンゲル組成物
JPH05204259A (ja) * 1992-01-28 1993-08-13 Sharp Corp 電子写真装置
US5270422A (en) * 1992-07-02 1993-12-14 Dow Corning Corporation Curing catalyst compositions and method for preparing same
US5371162A (en) * 1992-07-09 1994-12-06 Minnesota Mining And Manufacturing Company Storage-stable silicone composition
JP2864944B2 (ja) * 1993-04-30 1999-03-08 信越化学工業株式会社 難燃性シリコーン組成物

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