JPH1125755A5 - - Google Patents

Info

Publication number
JPH1125755A5
JPH1125755A5 JP1998067655A JP6765598A JPH1125755A5 JP H1125755 A5 JPH1125755 A5 JP H1125755A5 JP 1998067655 A JP1998067655 A JP 1998067655A JP 6765598 A JP6765598 A JP 6765598A JP H1125755 A5 JPH1125755 A5 JP H1125755A5
Authority
JP
Japan
Prior art keywords
porous
composite material
axis
conductive
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998067655A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1125755A (ja
Filing date
Publication date
Priority claimed from US08/810,846 external-priority patent/US5910354A/en
Application filed filed Critical
Publication of JPH1125755A publication Critical patent/JPH1125755A/ja
Publication of JPH1125755A5 publication Critical patent/JPH1125755A5/ja
Pending legal-status Critical Current

Links

JP6765598A 1997-03-04 1998-03-04 金属系相互接続性の複合材料 Pending JPH1125755A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/810846 1997-03-04
US08/810,846 US5910354A (en) 1997-03-04 1997-03-04 Metallurgical interconnect composite

Publications (2)

Publication Number Publication Date
JPH1125755A JPH1125755A (ja) 1999-01-29
JPH1125755A5 true JPH1125755A5 (enExample) 2005-09-02

Family

ID=25204858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6765598A Pending JPH1125755A (ja) 1997-03-04 1998-03-04 金属系相互接続性の複合材料

Country Status (4)

Country Link
US (1) US5910354A (enExample)
EP (1) EP0863550A3 (enExample)
JP (1) JPH1125755A (enExample)
KR (1) KR19980079862A (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW322613B (en) * 1997-03-10 1997-12-11 guang-long Lin Continuous method of implementing solder bump on semiconductor wafer electrode
US6372624B1 (en) 1997-08-04 2002-04-16 Micron Technology, Inc. Method for fabricating solder bumps by wave soldering
US6906423B1 (en) 2001-06-05 2005-06-14 Kabushiki Kaisha Toshiba Mask used for exposing a porous substrate
EP1265468B1 (en) 2001-06-05 2011-12-28 Kabushiki Kaisha Toshiba Method for manufacturing a composite member
US6703114B1 (en) * 2002-10-17 2004-03-09 Arlon Laminate structures, methods for production thereof and uses therefor
JP3887337B2 (ja) 2003-03-25 2007-02-28 株式会社東芝 配線部材およびその製造方法
EP1687670B1 (en) 2003-11-19 2014-03-12 University of Florida Research Foundation, Inc. A method to contact patterned electrodes on porous substrates and devices thereby
JP2005191382A (ja) * 2003-12-26 2005-07-14 Toshiba Corp 複合部材の製造方法、および複合部材形成用基材
JP5528250B2 (ja) * 2010-07-30 2014-06-25 日東電工株式会社 配線回路基板の製造方法
US9888584B2 (en) 2014-12-31 2018-02-06 Invensas Corporation Contact structures with porous networks for solder connections, and methods of fabricating same
WO2019216885A1 (en) * 2018-05-08 2019-11-14 W.L. Gore & Associates, Inc. Flexible and stretchable printed circuits on stretchable substrates
KR20230056056A (ko) 2018-05-08 2023-04-26 더블유.엘. 고어 앤드 어소시에이트스, 인코포레이티드 신장성 및 비신장성 기재 상의 내구성 있는 연성 인쇄 회로
JP7089064B2 (ja) 2018-05-08 2022-06-21 ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティド 皮膚適用のためのフレキシブルプリント回路

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3541222A (en) * 1969-01-13 1970-11-17 Bunker Ramo Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making
CA962021A (en) * 1970-05-21 1975-02-04 Robert W. Gore Porous products and process therefor
CA1284523C (en) * 1985-08-05 1991-05-28 Leo G. Svendsen Uniaxially electrically conductive articles with porous insulating substrate
ATE112099T1 (de) * 1988-02-05 1994-10-15 Raychem Ltd Geschichtete polymerfolie.
DE68929282T2 (de) * 1988-11-09 2001-06-07 Nitto Denko Corp., Ibaraki Leitersubstrat, Filmträger, Halbleiteranordnung mit dem Filmträger und Montagestruktur mit der Halbleiteranordnung
US5371404A (en) * 1993-02-04 1994-12-06 Motorola, Inc. Thermally conductive integrated circuit package with radio frequency shielding
US5456004A (en) * 1994-01-04 1995-10-10 Dell Usa, L.P. Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards
US5498467A (en) * 1994-07-26 1996-03-12 W. L. Gore & Associates, Inc. Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom
US5698496A (en) * 1995-02-10 1997-12-16 Lucent Technologies Inc. Method for making an anisotropically conductive composite medium

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