JPH11251365A5 - - Google Patents

Info

Publication number
JPH11251365A5
JPH11251365A5 JP1998047113A JP4711398A JPH11251365A5 JP H11251365 A5 JPH11251365 A5 JP H11251365A5 JP 1998047113 A JP1998047113 A JP 1998047113A JP 4711398 A JP4711398 A JP 4711398A JP H11251365 A5 JPH11251365 A5 JP H11251365A5
Authority
JP
Japan
Prior art keywords
metal layer
protruding
manufacturing
protruding electrode
insulating resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998047113A
Other languages
English (en)
Japanese (ja)
Other versions
JP3780688B2 (ja
JPH11251365A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP04711398A priority Critical patent/JP3780688B2/ja
Priority claimed from JP04711398A external-priority patent/JP3780688B2/ja
Publication of JPH11251365A publication Critical patent/JPH11251365A/ja
Publication of JPH11251365A5 publication Critical patent/JPH11251365A5/ja
Application granted granted Critical
Publication of JP3780688B2 publication Critical patent/JP3780688B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP04711398A 1998-02-27 1998-02-27 Ｃｓｐ用基板の製造法 Expired - Fee Related JP3780688B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04711398A JP3780688B2 (ja) 1998-02-27 1998-02-27 Ｃｓｐ用基板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04711398A JP3780688B2 (ja) 1998-02-27 1998-02-27 Ｃｓｐ用基板の製造法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006013969A Division JP2006165592A (ja) 2006-01-23 2006-01-23 エッチングバンプ群を有する部材の製造法

Publications (3)

Publication Number Publication Date
JPH11251365A JPH11251365A (ja) 1999-09-17
JPH11251365A5 true JPH11251365A5 (enExample) 2005-07-14
JP3780688B2 JP3780688B2 (ja) 2006-05-31

Family

ID=12766133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP04711398A Expired - Fee Related JP3780688B2 (ja) 1998-02-27 1998-02-27 Ｃｓｐ用基板の製造法

Country Status (1)

Country Link
JP (1) JP3780688B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW512467B (en) 1999-10-12 2002-12-01 North Kk Wiring circuit substrate and manufacturing method therefor
KR100973287B1 (ko) 2003-07-18 2010-07-30 삼성테크윈 주식회사 범프들이 형성되는 반도체 패키지용 기판, 이 반도체패키지용 기판에 의하여 형성된 반도체 패키지, 및 이반도체 패키지의 제조 방법
JP4105202B2 (ja) * 2006-09-26 2008-06-25 新光電気工業株式会社 半導体装置の製造方法
JP5152601B2 (ja) * 2010-06-01 2013-02-27 日立化成工業株式会社 薄板状物品を用いた接続基板の製造方法と多層配線板の製造方法
US9365947B2 (en) 2013-10-04 2016-06-14 Invensas Corporation Method for preparing low cost substrates

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