JP3780688B2 - Ｃｓｐ用基板の製造法 - Google Patents

Ｃｓｐ用基板の製造法 Download PDF

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Publication number
JP3780688B2
JP3780688B2 JP04711398A JP4711398A JP3780688B2 JP 3780688 B2 JP3780688 B2 JP 3780688B2 JP 04711398 A JP04711398 A JP 04711398A JP 4711398 A JP4711398 A JP 4711398A JP 3780688 B2 JP3780688 B2 JP 3780688B2
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JP
Japan
Prior art keywords
metal layer
etching
bump
csp
protruding electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP04711398A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11251365A5 (enExample
JPH11251365A (ja
Inventor
英博 中村
聡夫 山崎
茂樹 市村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP04711398A priority Critical patent/JP3780688B2/ja
Publication of JPH11251365A publication Critical patent/JPH11251365A/ja
Publication of JPH11251365A5 publication Critical patent/JPH11251365A5/ja
Application granted granted Critical
Publication of JP3780688B2 publication Critical patent/JP3780688B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP04711398A 1998-02-27 1998-02-27 Ｃｓｐ用基板の製造法 Expired - Fee Related JP3780688B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04711398A JP3780688B2 (ja) 1998-02-27 1998-02-27 Ｃｓｐ用基板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04711398A JP3780688B2 (ja) 1998-02-27 1998-02-27 Ｃｓｐ用基板の製造法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006013969A Division JP2006165592A (ja) 2006-01-23 2006-01-23 エッチングバンプ群を有する部材の製造法

Publications (3)

Publication Number Publication Date
JPH11251365A JPH11251365A (ja) 1999-09-17
JPH11251365A5 JPH11251365A5 (enExample) 2005-07-14
JP3780688B2 true JP3780688B2 (ja) 2006-05-31

Family

ID=12766133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP04711398A Expired - Fee Related JP3780688B2 (ja) 1998-02-27 1998-02-27 Ｃｓｐ用基板の製造法

Country Status (1)

Country Link
JP (1) JP3780688B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW512467B (en) 1999-10-12 2002-12-01 North Kk Wiring circuit substrate and manufacturing method therefor
KR100973287B1 (ko) 2003-07-18 2010-07-30 삼성테크윈 주식회사 범프들이 형성되는 반도체 패키지용 기판, 이 반도체패키지용 기판에 의하여 형성된 반도체 패키지, 및 이반도체 패키지의 제조 방법
JP4105202B2 (ja) * 2006-09-26 2008-06-25 新光電気工業株式会社 半導体装置の製造方法
JP5152601B2 (ja) * 2010-06-01 2013-02-27 日立化成工業株式会社 薄板状物品を用いた接続基板の製造方法と多層配線板の製造方法
US9365947B2 (en) 2013-10-04 2016-06-14 Invensas Corporation Method for preparing low cost substrates

Also Published As

Publication number Publication date
JPH11251365A (ja) 1999-09-17

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