JP2005520273A5 - - Google Patents

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Publication number
JP2005520273A5
JP2005520273A5 JP2003575683A JP2003575683A JP2005520273A5 JP 2005520273 A5 JP2005520273 A5 JP 2005520273A5 JP 2003575683 A JP2003575683 A JP 2003575683A JP 2003575683 A JP2003575683 A JP 2003575683A JP 2005520273 A5 JP2005520273 A5 JP 2005520273A5
Authority
JP
Japan
Prior art keywords
treated surface
etchant
film
liquid crystal
crystal polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003575683A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005520273A (ja
Filing date
Publication date
Priority claimed from US10/093,119 external-priority patent/US6696163B2/en
Application filed filed Critical
Publication of JP2005520273A publication Critical patent/JP2005520273A/ja
Publication of JP2005520273A5 publication Critical patent/JP2005520273A5/ja
Pending legal-status Critical Current

Links

JP2003575683A 2002-03-07 2003-03-04 フレキシブル回路用液晶ポリマー Pending JP2005520273A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/093,119 US6696163B2 (en) 2000-07-18 2002-03-07 Liquid crystal polymers for flexible circuits
PCT/US2003/006423 WO2003077622A1 (en) 2002-03-07 2003-03-04 Liquid crystal polymers for flexible circuits

Publications (2)

Publication Number Publication Date
JP2005520273A JP2005520273A (ja) 2005-07-07
JP2005520273A5 true JP2005520273A5 (enExample) 2006-04-20

Family

ID=27804196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003575683A Pending JP2005520273A (ja) 2002-03-07 2003-03-04 フレキシブル回路用液晶ポリマー

Country Status (7)

Country Link
US (1) US6696163B2 (enExample)
EP (1) EP1481576A1 (enExample)
JP (1) JP2005520273A (enExample)
KR (1) KR20040097149A (enExample)
CN (1) CN1640215A (enExample)
AU (1) AU2003213681A1 (enExample)
WO (1) WO2003077622A1 (enExample)

Families Citing this family (29)

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Publication number Priority date Publication date Assignee Title
US6867948B1 (en) * 1999-01-22 2005-03-15 Seagate Technology Llc Disc drives having flexible circuits with liquid crystal polymer dielectric
US20040247921A1 (en) * 2000-07-18 2004-12-09 Dodsworth Robert S. Etched dielectric film in hard disk drives
US20040258885A1 (en) * 2002-09-05 2004-12-23 Kreutter Nathan P. Etched dielectric film in microfluidic devices
US20060234042A1 (en) * 2002-09-05 2006-10-19 Rui Yang Etched dielectric film in microfluidic devices
US6933013B2 (en) * 2003-10-14 2005-08-23 Photon Dynamics, Inc. Vacuum deposition of dielectric coatings on volatile material
US7012017B2 (en) * 2004-01-29 2006-03-14 3M Innovative Properties Company Partially etched dielectric film with conductive features
US20050186404A1 (en) * 2004-02-23 2005-08-25 Guoping Mao Etched polycarbonate films
JP4846711B2 (ja) * 2004-04-08 2011-12-28 フォトン・ダイナミクス・インコーポレーテッド 変調器製造用の高分子分散型液晶製剤
US7425276B2 (en) * 2004-06-30 2008-09-16 University Of South Florida Method for etching microchannel networks within liquid crystal polymer substrates
US7343675B2 (en) * 2004-11-12 2008-03-18 Harris Corporation Method of constructing a structural circuit
US7523549B1 (en) * 2005-04-15 2009-04-28 Magnecomp Corporation Dimensionally stabilized flexible circuit fabrication method and product
US8553364B1 (en) 2005-09-09 2013-10-08 Magnecomp Corporation Low impedance, high bandwidth disk drive suspension circuit
US7829793B2 (en) * 2005-09-09 2010-11-09 Magnecomp Corporation Additive disk drive suspension manufacturing using tie layers for vias and product thereof
US8395866B1 (en) 2005-09-09 2013-03-12 Magnecomp Corporation Resilient flying lead and terminus for disk drive suspension
US7781679B1 (en) * 2005-09-09 2010-08-24 Magnecomp Corporation Disk drive suspension via formation using a tie layer and product
US20070120089A1 (en) * 2005-11-28 2007-05-31 3M Innovative Properties Company Polymer etchant and method of using same
US8014167B2 (en) * 2007-09-07 2011-09-06 Seagate Technology Llc Liquid crystal material sealed housing
US8213120B2 (en) * 2007-09-10 2012-07-03 International Business Machines Corporation Flexible cable comprising liquid crystal polymer
US20110024160A1 (en) 2009-07-31 2011-02-03 Clifton Quan Multi-layer microwave corrugated printed circuit board and method
US8043464B2 (en) * 2009-11-17 2011-10-25 Raytheon Company Systems and methods for assembling lightweight RF antenna structures
US8362856B2 (en) * 2009-11-17 2013-01-29 Raytheon Company RF transition with 3-dimensional molded RF structure
US8127432B2 (en) * 2009-11-17 2012-03-06 Raytheon Company Process for fabricating an origami formed antenna radiating structure
US9072164B2 (en) * 2009-11-17 2015-06-30 Raytheon Company Process for fabricating a three dimensional molded feed structure
JP5856071B2 (ja) 2009-12-18 2016-02-09 スリーエム イノベイティブ プロパティズ カンパニー サーモトロピック液晶ポリマーの成形及びそこから作製される物品
US8801964B2 (en) 2010-12-22 2014-08-12 Photon Dynamics, Inc. Encapsulated polymer network liquid crystal material, device and applications
US9145469B2 (en) 2012-09-27 2015-09-29 Ticona Llc Aromatic polyester containing a biphenyl chain disruptor
WO2016003588A1 (en) 2014-07-01 2016-01-07 Ticona Llc Laser activatable polymer composition
JP6805397B1 (ja) * 2019-04-03 2020-12-23 三菱製紙株式会社 液晶ポリマー用エッチング液及び液晶ポリマーのエッチング方法
CN111499915A (zh) * 2019-12-30 2020-08-07 瑞声科技(新加坡)有限公司 一种lcp薄膜的表面处理方法

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US3448098A (en) 1966-09-27 1969-06-03 Merck & Co Inc Production of guanylic acid
US3469982A (en) 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
US3867153A (en) 1972-09-11 1975-02-18 Du Pont Photohardenable element
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US5066545A (en) 1987-02-24 1991-11-19 Polyonics Corporation Process for forming polyimide-metal laminates
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US6218022B1 (en) 1996-09-20 2001-04-17 Toray Engineering Co., Ltd. Resin etching solution and process for etching polyimide resins
JP3999834B2 (ja) 1996-12-12 2007-10-31 三共化成株式会社 成形回路部品などのめっき部品の製法
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US6114492A (en) 2000-01-14 2000-09-05 Ticona Llc Process for producing liquid crystal polymer
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US6629348B2 (en) * 2001-05-01 2003-10-07 Oak-Mitsui, Inc. Substrate adhesion enhancement to film

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