JP2009540608A5 - - Google Patents

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Publication number
JP2009540608A5
JP2009540608A5 JP2009515489A JP2009515489A JP2009540608A5 JP 2009540608 A5 JP2009540608 A5 JP 2009540608A5 JP 2009515489 A JP2009515489 A JP 2009515489A JP 2009515489 A JP2009515489 A JP 2009515489A JP 2009540608 A5 JP2009540608 A5 JP 2009540608A5
Authority
JP
Japan
Prior art keywords
tape layer
release tape
subassembly
applying
providing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2009515489A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009540608A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2007/013963 external-priority patent/WO2007149298A2/en
Publication of JP2009540608A publication Critical patent/JP2009540608A/ja
Publication of JP2009540608A5 publication Critical patent/JP2009540608A5/ja
Withdrawn legal-status Critical Current

Links

JP2009515489A 2006-06-16 2007-06-13 表面回路パターンを備えた低温同時焼成セラミックの無加圧拘束焼結のための改善プロセス Withdrawn JP2009540608A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81415506P 2006-06-16 2006-06-16
PCT/US2007/013963 WO2007149298A2 (en) 2006-06-16 2007-06-13 Improved process for pressureless constrained sintering of low temperature co-fired ceramic with surface circuit patterns

Publications (2)

Publication Number Publication Date
JP2009540608A JP2009540608A (ja) 2009-11-19
JP2009540608A5 true JP2009540608A5 (enExample) 2010-07-01

Family

ID=38770006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009515489A Withdrawn JP2009540608A (ja) 2006-06-16 2007-06-13 表面回路パターンを備えた低温同時焼成セラミックの無加圧拘束焼結のための改善プロセス

Country Status (7)

Country Link
US (1) US20110027539A1 (enExample)
EP (1) EP2036411A2 (enExample)
JP (1) JP2009540608A (enExample)
KR (1) KR20090023487A (enExample)
CN (1) CN101480115A (enExample)
TW (1) TW200815311A (enExample)
WO (1) WO2007149298A2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2847143B1 (en) * 2012-05-11 2020-08-12 Keranor AS Method for the fabrication of green ceramic tapes
CN110706913A (zh) * 2019-10-21 2020-01-17 娄建勇 一种厚膜磁元件的制备方法及基于该磁元件的变压器和电感器
TW202335992A (zh) * 2021-11-11 2023-09-16 美商博隆能源股份有限公司 包含經改良介電層的燃料電池堆疊
CN115557795A (zh) * 2022-09-07 2023-01-03 广东环波新材料有限责任公司 一种低温共烧陶瓷基板烧平方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4536535A (en) * 1983-06-07 1985-08-20 E. I. Du Pont De Nemours And Company Castable ceramic compositions
US4654095A (en) * 1985-03-25 1987-03-31 E. I. Du Pont De Nemours And Company Dielectric composition
JPH02141479A (ja) * 1988-11-22 1990-05-30 Toshiba Corp セラミックス多層基板の製造方法
JPH0670940B2 (ja) * 1988-12-15 1994-09-07 株式会社村田製作所 セラミック積層成形体の製造方法
US5085720A (en) * 1990-01-18 1992-02-04 E. I. Du Pont De Nemours And Company Method for reducing shrinkage during firing of green ceramic bodies
US5254191A (en) * 1990-10-04 1993-10-19 E. I. Du Pont De Nemours And Company Method for reducing shrinkage during firing of ceramic bodies
US5628850A (en) * 1995-07-20 1997-05-13 Motorola, Inc. Method for producing input/output connections in a ceramic device
US5882455A (en) * 1997-09-25 1999-03-16 International Business Machines Corporation Apparatus and method for forming isotropic multilayer ceramic substrates
US6205032B1 (en) * 1999-03-16 2001-03-20 Cts Corporation Low temperature co-fired ceramic with improved registration
US6139666A (en) * 1999-05-26 2000-10-31 International Business Machines Corporation Method for producing ceramic surfaces with easily removable contact sheets
JP4138211B2 (ja) * 2000-07-06 2008-08-27 株式会社村田製作所 電子部品およびその製造方法、集合電子部品、電子部品の実装構造、ならびに電子装置
TW562737B (en) * 2000-11-27 2003-11-21 Murata Manufacturing Co Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body
US6776861B2 (en) * 2002-06-04 2004-08-17 E. I. Du Pont De Nemours And Company Tape composition and process for internally constrained sintering of low temperature co-fired ceramic
TWI345938B (en) * 2003-10-17 2011-07-21 Hitachi Metals Ltd Multi-layered ceramic substrate and its production method, and electronic device comprising same
JP2006123510A (ja) * 2004-09-29 2006-05-18 Yamauchi Corp プレス成形用クッション材およびその製造方法
US7068492B2 (en) * 2004-11-22 2006-06-27 E. I. Du Pont De Nemours And Company Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure

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