JPH11154665A5 - - Google Patents

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Publication number
JPH11154665A5
JPH11154665A5 JP1997338007A JP33800797A JPH11154665A5 JP H11154665 A5 JPH11154665 A5 JP H11154665A5 JP 1997338007 A JP1997338007 A JP 1997338007A JP 33800797 A JP33800797 A JP 33800797A JP H11154665 A5 JPH11154665 A5 JP H11154665A5
Authority
JP
Japan
Prior art keywords
treatment liquid
substrate
treating
specific gravity
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997338007A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11154665A (ja
JP3813716B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP33800797A priority Critical patent/JP3813716B2/ja
Priority claimed from JP33800797A external-priority patent/JP3813716B2/ja
Publication of JPH11154665A publication Critical patent/JPH11154665A/ja
Publication of JPH11154665A5 publication Critical patent/JPH11154665A5/ja
Application granted granted Critical
Publication of JP3813716B2 publication Critical patent/JP3813716B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP33800797A 1997-11-20 1997-11-20 基板の表面処理方法 Expired - Fee Related JP3813716B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33800797A JP3813716B2 (ja) 1997-11-20 1997-11-20 基板の表面処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33800797A JP3813716B2 (ja) 1997-11-20 1997-11-20 基板の表面処理方法

Publications (3)

Publication Number Publication Date
JPH11154665A JPH11154665A (ja) 1999-06-08
JPH11154665A5 true JPH11154665A5 (enExample) 2005-07-14
JP3813716B2 JP3813716B2 (ja) 2006-08-23

Family

ID=18314082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33800797A Expired - Fee Related JP3813716B2 (ja) 1997-11-20 1997-11-20 基板の表面処理方法

Country Status (1)

Country Link
JP (1) JP3813716B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040140365A1 (en) 2002-12-26 2004-07-22 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus
JP2014099480A (ja) * 2012-11-13 2014-05-29 Fujifilm Corp 半導体基板のエッチング方法及び半導体素子の製造方法
JP6994899B2 (ja) * 2017-10-20 2022-01-14 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP7267079B2 (ja) * 2019-04-18 2023-05-01 株式会社Ｓｃｒｅｅｎホールディングス 処理液調製装置、基板処理装置、処理液調製方法および基板処理方法
US11075218B2 (en) 2019-05-22 2021-07-27 Sandisk Technologies Llc Method of making a three-dimensional memory device using silicon nitride etching end point detection
CN114883227A (zh) * 2022-06-14 2022-08-09 赛莱克斯微系统科技（北京）有限公司 一种半导体湿法生产设备
CN117542755B (zh) * 2023-11-13 2024-06-07 苏州恩腾半导体科技有限公司 用于提供加热的蚀刻溶液的系统和方法
CN118221083A (zh) * 2024-01-30 2024-06-21 贵州开磷集团股份有限公司 一种料浆法粉状map生产方法

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