JPH11150063A5 - - Google Patents

Info

Publication number
JPH11150063A5
JPH11150063A5 JP1997331261A JP33126197A JPH11150063A5 JP H11150063 A5 JPH11150063 A5 JP H11150063A5 JP 1997331261 A JP1997331261 A JP 1997331261A JP 33126197 A JP33126197 A JP 33126197A JP H11150063 A5 JPH11150063 A5 JP H11150063A5
Authority
JP
Japan
Prior art keywords
light
mask
side marks
wafer
diffracted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997331261A
Other languages
English (en)
Japanese (ja)
Other versions
JP4109736B2 (ja
JPH11150063A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP33126197A priority Critical patent/JP4109736B2/ja
Priority claimed from JP33126197A external-priority patent/JP4109736B2/ja
Priority to US09/192,193 priority patent/US6285033B1/en
Publication of JPH11150063A publication Critical patent/JPH11150063A/ja
Priority to US09/879,059 priority patent/US6649923B2/en
Publication of JPH11150063A5 publication Critical patent/JPH11150063A5/ja
Application granted granted Critical
Publication of JP4109736B2 publication Critical patent/JP4109736B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP33126197A 1997-11-14 1997-11-14 位置ずれ検出方法 Expired - Fee Related JP4109736B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP33126197A JP4109736B2 (ja) 1997-11-14 1997-11-14 位置ずれ検出方法
US09/192,193 US6285033B1 (en) 1997-11-14 1998-11-16 Positional deviation detecting method and device manufacturing method using the same
US09/879,059 US6649923B2 (en) 1997-11-14 2001-06-13 Positional deviation detecting method and device manufacturing method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33126197A JP4109736B2 (ja) 1997-11-14 1997-11-14 位置ずれ検出方法

Publications (3)

Publication Number Publication Date
JPH11150063A JPH11150063A (ja) 1999-06-02
JPH11150063A5 true JPH11150063A5 (enExample) 2005-07-07
JP4109736B2 JP4109736B2 (ja) 2008-07-02

Family

ID=18241719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33126197A Expired - Fee Related JP4109736B2 (ja) 1997-11-14 1997-11-14 位置ずれ検出方法

Country Status (2)

Country Link
US (2) US6285033B1 (enExample)
JP (1) JP4109736B2 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3376961B2 (ja) * 1999-06-08 2003-02-17 ウシオ電機株式会社 マスクを移動させて位置合わせを行う露光装置
IT1313154B1 (it) * 1999-08-05 2002-06-17 St Microelectronics Srl Maschera litografica per dispositivi a semiconduttore con finestra discavo a sezione poligonale,in particolare avente una sezione di almeno
US6689519B2 (en) * 2000-05-04 2004-02-10 Kla-Tencor Technologies Corp. Methods and systems for lithography process control
US6708131B1 (en) * 2000-08-30 2004-03-16 Micron Technology, Inc. Wafer alignment system
IL138552A (en) * 2000-09-19 2006-08-01 Nova Measuring Instr Ltd Lateral shift measurement using an optical technique
AU2001295060A1 (en) 2000-09-20 2002-04-02 Kla-Tencor-Inc. Methods and systems for semiconductor fabrication processes
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US7349090B2 (en) 2000-09-20 2008-03-25 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography
US6943429B1 (en) * 2001-03-08 2005-09-13 Amkor Technology, Inc. Wafer having alignment marks extending from a first to a second surface of the wafer
JP3605043B2 (ja) * 2001-04-18 2004-12-22 キヤノン株式会社 位置計測装置、露光装置、デバイス製造方法および位置計測方法
JP3806044B2 (ja) * 2002-02-08 2006-08-09 日本電信電話株式会社 表面形状認識用センサおよびその製造方法
TW200303978A (en) * 2002-03-05 2003-09-16 Nikon Corp Position detection device, exposure device and exposure method
JP3953355B2 (ja) * 2002-04-12 2007-08-08 Ｎｅｃエレクトロニクス株式会社 画像処理アライメント方法及び半導体装置の製造方法
JP4095391B2 (ja) * 2002-09-24 2008-06-04 キヤノン株式会社 位置検出方法
KR100520305B1 (ko) * 2003-04-04 2005-10-13 한국전자통신연구원 레이저 변위 센서를 이용하여 마스크와 기판 사이의간격을 측정하는 간격 측정 장치 및 그 방법
JP2005079929A (ja) 2003-09-01 2005-03-24 Canon Inc 通信装置、通信装置の制御方法、および通信装置の制御プログラム
US7253885B2 (en) * 2003-12-05 2007-08-07 Canon Kabushiki Kaisha Wavelength selecting method, position detecting method and apparatus, exposure method and apparatus, and device manufacturing method
US7113255B2 (en) * 2003-12-19 2006-09-26 Asml Holding N.V. Grating patch arrangement, lithographic apparatus, method of testing, device manufacturing method, and device manufactured thereby
US7337552B2 (en) * 2004-08-24 2008-03-04 Litel Instruments Method and apparatus for registration with integral alignment optics
JP2006165371A (ja) 2004-12-09 2006-06-22 Canon Inc 転写装置およびデバイス製造方法
JP5350012B2 (ja) * 2009-02-27 2013-11-27 株式会社日立製作所 基板表面のパターン検査装置およびパターン検査方法
JP5809409B2 (ja) * 2009-12-17 2015-11-10 キヤノン株式会社 インプリント装置及びパターン転写方法
CN103097956B (zh) * 2010-02-26 2016-01-27 密克罗尼克麦达塔公司 用于执行图案对准的方法和装置
JP5597031B2 (ja) * 2010-05-31 2014-10-01 キヤノン株式会社 リソグラフィ装置及び物品の製造方法
US8605294B2 (en) * 2012-03-09 2013-12-10 Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense Actuating apparatus, actuating system and method for actuating a working stage to move relative to a platform with high-precision positioning capability
US9021952B2 (en) 2013-03-27 2015-05-05 Uni-Pixel Displays, Inc. Laser-assisted alignment of multi-station flexographic printing system
US9132623B2 (en) 2013-03-27 2015-09-15 Unipixel Displays, Inc. Method of marking a transparent substrate for visual alignment
CN104369052A (zh) * 2013-08-14 2015-02-25 鸿富锦精密工业（深圳）有限公司 加工治具、双轮廓加工系统及方法
JP6116456B2 (ja) * 2013-09-25 2017-04-19 株式会社Ｓｃｒｅｅｎホールディングス 描画方法および描画装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2698446B2 (ja) 1988-09-09 1998-01-19 キヤノン株式会社 間隔測定装置
JPH0540013A (ja) * 1991-08-05 1993-02-19 Canon Inc ずれ測定方法及びこの方法を用いた露光装置
US5495336A (en) * 1992-02-04 1996-02-27 Canon Kabushiki Kaisha Position detecting method for detecting a positional relationship between a first object and a second object
US5432603A (en) 1992-11-20 1995-07-11 Canon Kabushiki Kaisha Optical heterodyne interference measuring apparatus and method, and exposing apparatus and device manufacturing method using the same, in which a phase difference between beat signals is detected
US5414514A (en) * 1993-06-01 1995-05-09 Massachusetts Institute Of Technology On-axis interferometric alignment of plates using the spatial phase of interference patterns
US5625453A (en) 1993-10-26 1997-04-29 Canon Kabushiki Kaisha System and method for detecting the relative positional deviation between diffraction gratings and for measuring the width of a line constituting a diffraction grating
JPH0886612A (ja) 1994-09-19 1996-04-02 Canon Inc 光ヘテロダイン干渉を利用した位置ずれ検出装置

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