JPH1098075A5 - - Google Patents
Info
- Publication number
- JPH1098075A5 JPH1098075A5 JP1996250036A JP25003696A JPH1098075A5 JP H1098075 A5 JPH1098075 A5 JP H1098075A5 JP 1996250036 A JP1996250036 A JP 1996250036A JP 25003696 A JP25003696 A JP 25003696A JP H1098075 A5 JPH1098075 A5 JP H1098075A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- semiconductor
- wiring board
- insulating resin
- mounting substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25003696A JPH1098075A (ja) | 1996-09-20 | 1996-09-20 | 半導体実装方法、半導体実装装置および半導体実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25003696A JPH1098075A (ja) | 1996-09-20 | 1996-09-20 | 半導体実装方法、半導体実装装置および半導体実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1098075A JPH1098075A (ja) | 1998-04-14 |
| JPH1098075A5 true JPH1098075A5 (enrdf_load_stackoverflow) | 2004-09-09 |
Family
ID=17201882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25003696A Pending JPH1098075A (ja) | 1996-09-20 | 1996-09-20 | 半導体実装方法、半導体実装装置および半導体実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1098075A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10388626B2 (en) | 2000-03-10 | 2019-08-20 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming flipchip interconnect structure |
| JP2006100385A (ja) | 2004-09-28 | 2006-04-13 | Rohm Co Ltd | 半導体装置 |
| US11842972B2 (en) | 2004-09-28 | 2023-12-12 | Rohm Co., Ltd. | Semiconductor device with a semiconductor chip connected in a flip chip manner |
| JP4533248B2 (ja) * | 2005-06-03 | 2010-09-01 | 新光電気工業株式会社 | 電子装置 |
| JP5091418B2 (ja) * | 2006-03-30 | 2012-12-05 | 株式会社東芝 | 部品内蔵プリント配線板、部品内蔵プリント配線板の製造方法および電子機器 |
| JP4924480B2 (ja) * | 2008-03-03 | 2012-04-25 | 日本電気株式会社 | 半導体装置の製造方法および装置 |
| JP2010278480A (ja) * | 2010-09-14 | 2010-12-09 | Rohm Co Ltd | 半導体装置 |
-
1996
- 1996-09-20 JP JP25003696A patent/JPH1098075A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5834848A (en) | Electronic device and semiconductor package | |
| US6177725B1 (en) | Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same | |
| US6448504B1 (en) | Printed circuit board and semiconductor package using the same | |
| US5669137A (en) | Method of making electronic package assembly with protective encapsulant material | |
| JPH10163386A5 (enrdf_load_stackoverflow) | ||
| KR20020065045A (ko) | 확장 패드들을 포함하는 반도체 칩 패키지 | |
| WO2004112129A1 (ja) | 電子装置 | |
| US6781221B2 (en) | Packaging substrate for electronic elements and electronic device having packaged structure | |
| JPH07114248B2 (ja) | 電子装置パッケージおよびその作製方法 | |
| TW365035B (en) | Semiconductor device package having a board, manufacturing method thereof and stack package using the same | |
| KR19980020296A (ko) | 반도체 칩 패키지 | |
| JPH1098075A5 (enrdf_load_stackoverflow) | ||
| US7432601B2 (en) | Semiconductor package and fabrication process thereof | |
| US20020063331A1 (en) | Film carrier semiconductor device | |
| JP3686047B2 (ja) | 半導体装置の製造方法 | |
| JPS622587A (ja) | ハイパワ−用混成集積回路 | |
| KR20050033606A (ko) | 음의 부피 팽창특성을 갖는 무연 전기 접속기 | |
| US6472759B1 (en) | Ball grid array type semiconductor device | |
| KR20100002870A (ko) | 반도체 패키지의 제조 방법 | |
| JP2904154B2 (ja) | 半導体素子を含む電子回路装置 | |
| JP2696122B2 (ja) | 半導体装置 | |
| JPH0974149A (ja) | 小型パッケージ及びその製造方法 | |
| JP3117688B2 (ja) | 表面実装用の半導体パッケージ | |
| JPH0583186B2 (enrdf_load_stackoverflow) | ||
| JP2779843B2 (ja) | 電子部品搭載用基板及び電子部品パッケージ |