JPH1079491A5 - - Google Patents

Info

Publication number
JPH1079491A5
JPH1079491A5 JP1997185264A JP18526497A JPH1079491A5 JP H1079491 A5 JPH1079491 A5 JP H1079491A5 JP 1997185264 A JP1997185264 A JP 1997185264A JP 18526497 A JP18526497 A JP 18526497A JP H1079491 A5 JPH1079491 A5 JP H1079491A5
Authority
JP
Japan
Prior art keywords
insulating film
semiconductor device
film
forming
bit line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997185264A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1079491A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9185264A priority Critical patent/JPH1079491A/ja
Priority claimed from JP9185264A external-priority patent/JPH1079491A/ja
Publication of JPH1079491A publication Critical patent/JPH1079491A/ja
Publication of JPH1079491A5 publication Critical patent/JPH1079491A5/ja
Pending legal-status Critical Current

Links

JP9185264A 1996-07-10 1997-07-10 半導体装置およびその製造方法 Pending JPH1079491A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9185264A JPH1079491A (ja) 1996-07-10 1997-07-10 半導体装置およびその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP18105796 1996-07-10
JP8-181057 1996-07-10
JP9185264A JPH1079491A (ja) 1996-07-10 1997-07-10 半導体装置およびその製造方法

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2005100900A Division JP2005252283A (ja) 1996-07-10 2005-03-31 半導体装置とその製造方法
JP2005100899A Division JP2005244251A (ja) 1996-07-10 2005-03-31 半導体装置とその製造方法
JP2005100898A Division JP4391438B2 (ja) 1996-07-10 2005-03-31 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH1079491A JPH1079491A (ja) 1998-03-24
JPH1079491A5 true JPH1079491A5 (enrdf_load_html_response) 2005-09-15

Family

ID=26500381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9185264A Pending JPH1079491A (ja) 1996-07-10 1997-07-10 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JPH1079491A (enrdf_load_html_response)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6057193A (en) * 1998-04-16 2000-05-02 Advanced Micro Devices, Inc. Elimination of poly cap for easy poly1 contact for NAND product
FR2785720B1 (fr) * 1998-11-05 2003-01-03 St Microelectronics Sa Fabrication de memoire dram et de transistors mos
KR100275752B1 (ko) * 1998-11-18 2000-12-15 윤종용 접합 스페이서를 구비한 컨케이브 커패시터의 제조방법
TW472384B (en) * 1999-06-17 2002-01-11 Fujitsu Ltd Semiconductor device and method of manufacturing the same
KR100334393B1 (ko) * 1999-06-30 2002-05-03 박종섭 반도체소자의 제조방법
US6458649B1 (en) * 1999-07-22 2002-10-01 Micron Technology, Inc. Methods of forming capacitor-over-bit line memory cells
JP5775018B2 (ja) * 1999-10-13 2015-09-09 ソニー株式会社 半導体装置
KR100351897B1 (ko) * 1999-12-31 2002-09-12 주식회사 하이닉스반도체 반도체 소자 제조방법
JP3957945B2 (ja) 2000-03-31 2007-08-15 富士通株式会社 半導体装置及びその製造方法
KR100402943B1 (ko) * 2000-06-19 2003-10-30 주식회사 하이닉스반도체 고유전체 캐패시터 및 그 제조 방법
JP2003152104A (ja) * 2001-11-14 2003-05-23 Fujitsu Ltd 半導体装置及びその製造方法
JP2007258747A (ja) * 2002-08-30 2007-10-04 Matsushita Electric Ind Co Ltd 半導体装置
JP2005260082A (ja) * 2004-03-12 2005-09-22 Toshiba Corp 磁気ランダムアクセスメモリ
JP5076168B2 (ja) * 2009-12-07 2012-11-21 富士通セミコンダクター株式会社 半導体装置の製造方法

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