JPH10505406A - 測定プローブ - Google Patents
測定プローブInfo
- Publication number
- JPH10505406A JPH10505406A JP7518313A JP51831395A JPH10505406A JP H10505406 A JPH10505406 A JP H10505406A JP 7518313 A JP7518313 A JP 7518313A JP 51831395 A JP51831395 A JP 51831395A JP H10505406 A JPH10505406 A JP H10505406A
- Authority
- JP
- Japan
- Prior art keywords
- sensor chip
- measurement probe
- probe according
- connection
- welded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000523 sample Substances 0.000 title claims abstract description 52
- 238000005259 measurement Methods 0.000 claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 30
- 238000003466 welding Methods 0.000 claims abstract description 14
- 239000004020 conductor Substances 0.000 claims description 15
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 2
- 238000005728 strengthening Methods 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 claims 1
- 229910052500 inorganic mineral Inorganic materials 0.000 claims 1
- 238000000691 measurement method Methods 0.000 claims 1
- 239000011707 mineral Substances 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000009429 electrical wiring Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000406668 Loxodonta cyclotis Species 0.000 description 1
- 241001676573 Minium Species 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 244000309464 bull Species 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0004—Gaseous mixtures, e.g. polluted air
- G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6683—Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/029—Welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
- H01R4/4809—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0221—Laser welding
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
- C04B2235/665—Local sintering, e.g. laser sintering
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/72—Forming laminates or joined articles comprising at least two interlayers directly next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T403/00—Joints and connections
- Y10T403/47—Molded joint
- Y10T403/477—Fusion bond, e.g., weld, etc.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Structural Engineering (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Immunology (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Food Science & Technology (AREA)
- Combustion & Propulsion (AREA)
- General Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Oxygen Concentration In Cells (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Measuring Fluid Pressure (AREA)
- Laser Beam Processing (AREA)
- Ceramic Products (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 金属性のハウジングと、ハウジング内に収容されその一端付近にセンサ本 体(19)を備えたセンサチップ(18)と、一端においてセンサ本体(19)に電気 的に接続された電気リードと、好ましくはセンサ本体(19)に接続され、かつ電 気導電性の少なくとも1つの接続路(51)とを備えたガス測定用の測定プローブ において、センサチップ(18)は、測定すべきガスをハウジング内に導入するた めの導入口(12)に面した側の端部付近にセンサ本体(19)を備え、かつ前記の 電気リードは機械的にも、直接もしくは間接にレーザー溶接により接続路(51) に結合されていることを特徴とする、測定プローブ(10)。 2. 前記の電気リードは鉱物により電気的に絶縁された少なくとも1つの内部 導体(40)を有する金属ジャケットリード(13)からなり、かつ金属ジャケット リード(13)はハウジングの導入口の反対側の挿入口近傍に差し込まれて、溶接 もしくは半田付けによりハウジング(11)に気密に接続され、さらに電気接続用 の内部導体(40)は接続路(51)に直接もしくは間接に接続され、その一端でセ ンサチップ(18)に永久的に機械的に接続されていることを特徴とする、請求 の範囲1の測定プローブ。 3. 内部導体(40)を半田付けもしくは溶接したクリップ(50)を設けて、該 クリップ(50)をセンサチップ(18)の接続路(51)にレーザー溶接したことを 特徴とする請求の範囲1または2の測定プローブ。 4. クリップ(50)は電気導電性で、センサチップ(18)の両面に上下に重な るようにはめ込まれて、センサチップ(18)の接続路(51)上に配置されて、こ の接続路付近でレーザー溶接されていることを特徴とする、請求の範囲1〜3の いずれかに記載の測定プローブ。 5. クリップ(50)は一対のフレキシブルなアーム(55,56)を備え、アー ムは接続路(51)に少なくとも部分的に面上に平滑に接触し、かつこの平滑な接 触領域でリードにレーザー溶接されていることを特徴とする、請求の範囲1〜4 のいずれかに記載の測定プローブ。 6. 各クリップ(50)は、挿入開口に向かって延びかつU字状の曲げ部(54) を備えた接続タブ(41)を有し、この曲げ部に金属ジャケットリード(13)の内 部導体(40)の接続ワイヤが溶接されていることを特徴とする、請求の範囲1〜 5のいずれかに記載の測定プローブ。 7. 長尺状で平坦なセンサチップ(18)に、挿入開口とセンサ本体(19)との 間で、支持体(20,30)を設け、該支持体はセンサチップ(18)の長手方向に 対してほぼ直角にセンサチップを支持することを特徴とする、請求の範囲1〜6 のいずれかに記載の測定プローブ。 8. 支持体がセンサチップ(18)に接するように配置した予備成型した金編体 (20)からなることを特徴とする、請求の範囲7の測定プローブ。 9. 金属ハウジングは円筒状のチューブ(11)からなり、その一端にセンサ本 体(19)へ測定すべき排気ガスを導くための導入口(12)を設け、他端に金属ジ ャケットリード(13)を挿入して、溶接もしくは半田付けするための挿入開口を 設けたことを特徴とする、請求の範囲1〜8のいずれかに記載の測定プローブ。 10. 金属ブッシュ(14)を金属ジャケットリード(13)に接するように設け て半田付けもしくは溶接し、かつ該リードをブッシュによりチューブ(11)に半 田付けもしくは溶接したことを特徴とする、請求の範囲9の測定プローブ。 11. センサチップ(18)には機械接続用のメタライズ(24)からなる接続路 をその一面に設け、支持体21の接続路に実質的に垂直に配置した少なくとも1 つの小脚(22)を、小脚の小足(23)により、メタライズ(24)にレーザー溶接 したことを特徴とする、請求の範囲1〜10のいずれかに記載の測定プローブ。 12. 支持体はチューブ(11)の長手方向に沿って延び、小脚(22)はこれか ら曲がりかつ支持体(21)に直角に延びることを特徴とする、請求の範囲1〜1 1のいずれかに記載の測定プローブ。 13. 支持体(30)はチューブ(11)の方向に沿って延び、V字状の曲げ部( 31)の外側で、その外端部においてチューブ(11)の内側に固着されているこ とを特徴とする、請求の範囲9〜12のいずれかに記載の測定プローブ。 14. V字状の曲げ部(31)はセンサ本体(19)と導入口(12)との間に配置 されていることを特徴とする請求の範囲13の測定プローブ。 15. 少なくとも1個の小脚(22)が溶接によりセンサチップに接続され、リ ンク(26)は取付部材(25)により、金属ジャケットリード(13)の金属ジャケ ットもしくはブッシュ(14)に接続されていることを特徴とする、請求の範囲1 〜14のいずれかに記載の測定プローブ。 16. 小脚(22)がセンサチップ(18)の端面付近で少なくとも部分的に、端 部(18)の近傍に設けた窪みに係合もしくははめ合わされていることを特徴とす る、請求の範囲1〜15のいずれかに記載の測定プローブ。 17. 少なくとも1つの小脚(22)が、センサチップ(18)のメタライズ側の 面へ、2回ほぼ直角に曲げられていることを特徴とする、請求の範囲1〜16の いずれかに記載の測定プローブ。 18. 電気リードの金属ジャケットリード(13)の内部導体(40)の各電気接 続用ワイヤが、各々測定すべき排ガスに曝されるハウジングの内側で接続されて いることを特徴とする、請求の範囲1〜17のいずれかに記載の測定プローブ。 19. 内部導体40の電気接続用ワイヤはセンサチップに直接レーザー溶接さ れ、かつワイヤは、センサチップ(18)に対する長さ補償と応力吸収用の、予備 成型した弧(43)を備えることを特徴とする、請求の範囲18の測定プローブ。 20. 接続ワイヤ(40)は接続路(41)に接続スリーブ(42)により接続され ることを特徴とする、請求の範囲1〜19のいずれかに記載の測定プローブ。 21. 接続ワイヤ(40)は接続のため弧状に予備成型されていることを特徴と する、請求の範囲1〜20のいずれかに記載の測定プローブ。 22. 接続路(51)は、センサチップ(18)の基体(53)に固着強化層(52) で結合されていることを特徴とする、請求の範囲1〜21のいずれかに記載の測 定プローブ。 23. 接続路(51)をスクリーン印刷で形成したことを特徴とする、請求の範 囲22に記載の測定プローブ。 24. 固着強化層(52)をスクリーン印刷で設けたことを特徴とする、請求の 範囲22に記載の測定プローブ。 25. 接続路(51)はプラチナを含有することを特徴とする、請求の範囲22 〜24のいずれかに記載の測定プローブ。 26.固着強化層(52)はプラチナ以外に、ガラス及びセラミックからなる群の 少なくとも一員の物質を含有することを特徴とする、請求の範囲22〜24のい ずれかに記載の測定プローブ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE4400220 | 1994-01-05 | ||
DE4400220.3 | 1994-01-05 | ||
PCT/EP1995/000042 WO1995018965A1 (de) | 1994-01-05 | 1995-01-05 | Messfühler |
Publications (1)
Publication Number | Publication Date |
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JPH10505406A true JPH10505406A (ja) | 1998-05-26 |
Family
ID=6507509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7518313A Ceased JPH10505406A (ja) | 1994-01-05 | 1995-01-05 | 測定プローブ |
Country Status (5)
Country | Link |
---|---|
US (4) | US5730543A (ja) |
EP (2) | EP0797558B1 (ja) |
JP (1) | JPH10505406A (ja) |
DE (4) | DE59409959D1 (ja) |
WO (2) | WO1995018777A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018016482A1 (ja) * | 2016-07-19 | 2018-01-25 | 日本特殊陶業株式会社 | ガスセンサ |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19523911C5 (de) * | 1995-06-30 | 2004-07-15 | Robert Bosch Gmbh | Anschlußleitung für einen Meßfühler |
DE19638209A1 (de) * | 1996-09-19 | 1998-03-26 | Bosch Gmbh Robert | Hochschmelzende elektrisch leitende Verbindung und Verfahren zu deren Herstellung |
DE19638208C2 (de) * | 1996-09-19 | 2000-03-23 | Bosch Gmbh Robert | Hochtemperaturstabile elektrische Kontaktierung eines Sensorelements sowie Verfahren zu deren Herstellung |
BR9804787A (pt) * | 1997-03-21 | 1999-08-17 | Hereaus Sensor Nite Technik Gm | Conduto isolado com mineral |
DE29724000U1 (de) * | 1997-09-25 | 1999-09-09 | Heraeus Electro Nite Int | Elektrischer Sensor, insbesondere Temperatur-Sensor, mit Leiterplatte |
DE19825451A1 (de) * | 1998-06-06 | 1999-12-09 | Ego Elektro Geraetebau Gmbh | Keramischer Träger mit einer elektrischen Schaltung und mit einer Anschlußvorrichtung |
US6415647B1 (en) * | 1998-10-30 | 2002-07-09 | Denso Corporation | Compact structure of gas sensor and production method thereof |
US6341519B1 (en) * | 1998-11-06 | 2002-01-29 | Reuter-Stokes, Inc. | Gas-sensing probe for use in a combustor |
JP2000241382A (ja) * | 1999-02-22 | 2000-09-08 | Ngk Spark Plug Co Ltd | ガスセンサ |
DE19911516C1 (de) * | 1999-03-16 | 2000-09-28 | Heraeus Electro Nite Int | Sensoranordnung für gasförmige Medien |
US6401521B1 (en) * | 1999-10-27 | 2002-06-11 | Delphi Technologies, Inc. | Method of preventing movement of a planar sensor element packaged in a mat support |
DE19958762C2 (de) | 1999-12-07 | 2001-09-27 | Heraeus Electro Nite Int | Anschlußanordnung einer mineral-isolierten Leitung |
DE10038001B4 (de) * | 2000-08-04 | 2008-09-18 | Balluff Gmbh | Sensoranordnung |
US6658916B2 (en) | 2000-12-15 | 2003-12-09 | Delphi Technologies, Inc. | Oxygen sensor for multiple port applications |
DE10103084B4 (de) * | 2001-01-24 | 2006-08-03 | Infineon Technologies Ag | Halbleitermodul und Verfahren zu seiner Herstellung |
MXPA03008628A (es) * | 2001-03-22 | 2006-03-15 | Univ Maryland | Sonda de sensor para medir temperatura y fraccion volumetrica liquida de un gas caliente cargado de gotas de liquido y metodo para usar la misma. |
DE10127871C1 (de) * | 2001-03-29 | 2003-03-13 | Epiq Sensor Nite N V | Gehäuse für einen Temperatur- oder Gassensor |
DE10132825A1 (de) * | 2001-07-06 | 2003-01-30 | Bosch Gmbh Robert | Gassensor |
US7128818B2 (en) * | 2002-01-09 | 2006-10-31 | General Electric Company | Method and apparatus for monitoring gases in a combustion system |
US6634210B1 (en) * | 2002-04-17 | 2003-10-21 | Delphi Technologies, Inc. | Particulate sensor system |
US7389672B2 (en) * | 2004-01-27 | 2008-06-24 | H2Scan Corporation | Method and apparatus for thermal isolation of a gas sensor |
DE102004010593B4 (de) * | 2004-03-02 | 2012-06-28 | Enotec Gmbh, Prozess- Und Umweltmesstechnik | Meßsonde und Verfahren zu deren Herstellung |
DE102004034192A1 (de) | 2004-07-14 | 2006-02-09 | Heraeus Sensor Technology Gmbh | Hochtemperaturstabiler Sensor |
US20060037394A1 (en) * | 2004-08-20 | 2006-02-23 | Honeywell International, Inc. | High temperature sensor sleeve |
US20110268975A1 (en) * | 2005-01-25 | 2011-11-03 | Massachusetts Institute Of Technology | Transient Migrating Phase Low Temperature Joining of Co-Sintered Particulate Materials Including a Chemical Reaction |
DE102007027491A1 (de) | 2007-06-14 | 2008-12-18 | Robert Bosch Gmbh | Gassensor |
DE102007035324A1 (de) * | 2007-07-27 | 2009-01-29 | Robert Bosch Gmbh | Verfahren zum Befestigen von mindestens einem elektronischen Bauelement an einem Stator einer elektrischen Maschine |
US8151626B2 (en) * | 2007-11-05 | 2012-04-10 | Honeywell International Inc. | System and method for sensing high temperature particulate matter |
JP2009175135A (ja) * | 2007-12-27 | 2009-08-06 | Yamaha Motor Co Ltd | ガスセンサおよびそれを備えた空燃比制御装置ならびに輸送機器 |
US7966862B2 (en) | 2008-01-28 | 2011-06-28 | Honeywell International Inc. | Electrode structure for particulate matter sensor |
DE102008006707A1 (de) * | 2008-01-30 | 2009-08-06 | Robert Bosch Gmbh | Sensor mit Gehäuse, Sensormodul und Einlegeteil |
US8186051B2 (en) * | 2008-03-28 | 2012-05-29 | Intel Corporation | Method for fabricating package substrate and die spacer layers having a ceramic backbone |
US7644609B2 (en) * | 2008-06-04 | 2010-01-12 | Honeywell International Inc. | Exhaust sensor apparatus and method |
DE102008043219A1 (de) | 2008-10-28 | 2010-04-29 | Robert Bosch Gmbh | Gassensor |
NO330346B1 (no) * | 2009-07-20 | 2011-03-28 | Sinvent As | Lokal termisk styring |
DE102010020338A1 (de) * | 2010-05-12 | 2011-11-17 | Hydrometer Gmbh | Gehäuseanordnung für Ultraschall-Durchflussmesser sowie Ultaschall-Durchflussmesser |
US8969928B2 (en) * | 2010-08-31 | 2015-03-03 | Micron Technology, Inc. | Transistors having a control gate and one or more conductive structures |
US9980384B2 (en) * | 2012-06-21 | 2018-05-22 | Kyocera Corporation | Circuit board and electronic apparatus including the same |
JP6017401B2 (ja) * | 2013-11-05 | 2016-11-02 | 愛三工業株式会社 | 回転角度検出センサ |
DE102014114808B4 (de) * | 2014-10-13 | 2018-03-08 | Infineon Technologies Ag | Elektronikmodul und Verfahren zur Herstellung eines Elektronikmoduls |
JP6641079B2 (ja) * | 2014-10-29 | 2020-02-05 | タツタ電線株式会社 | プリント基板の製造方法及び導電性部材の接合方法 |
KR101597302B1 (ko) | 2014-12-17 | 2016-02-24 | 주식회사 동양센서 | 온도센서 및 그 제조방법 |
US20170299545A1 (en) * | 2016-04-19 | 2017-10-19 | Tyco Electronics Corporation | Sensor package having an electrical contact |
KR102511323B1 (ko) | 2021-06-09 | 2023-03-17 | 주식회사 코멧센서 | 레이저 용접 방법 및 이를 이용한 온도센서 제조방법 |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2523691A (en) * | 1949-06-21 | 1950-09-26 | Nat Fitch Corp | Combined thermometer and sampling unit |
DE1022957B (de) * | 1952-11-26 | 1958-01-16 | Gulton Mfg Corp | Verfahren zum Herstellen einer flaechigen, elektrisch leitfaehigen Verbindung eines metallischen mit einem keramischen Werkstueck |
US2996401A (en) * | 1955-09-30 | 1961-08-15 | Eitel Mccullough Inc | Method of making ceramic structures for electron tubes |
US3154503A (en) * | 1961-01-12 | 1964-10-27 | Int Resistance Co | Resistance material and resistor made therefrom |
NL294370A (ja) * | 1963-06-20 | |||
US3523357A (en) * | 1967-12-14 | 1970-08-11 | Sylvania Electric Prod | Electrical contact material and method of making and utilizing the same |
US3824368A (en) * | 1971-12-30 | 1974-07-16 | Avco Corp | Laser welding |
JPS5119592A (en) * | 1974-08-09 | 1976-02-16 | Nissan Motor | Gasunodo kenshutsuki |
JPS52100287A (en) * | 1976-02-19 | 1977-08-23 | Nissan Motor | Oxygen concentration detector |
US4058789A (en) * | 1976-04-05 | 1977-11-15 | The Carborundum Company | Electrical connector |
DE2702578A1 (de) * | 1977-01-22 | 1978-07-27 | Bosch Gmbh Robert | Elektrochemischer messfuehler fuer die bestimmung des sauerstoffgehaltes in abgasen, insbesondere von abgasen von verbrennungsmotoren |
GB1595421A (en) * | 1977-04-12 | 1981-08-12 | Lucas Industries Ltd | Device for minitoring the composition of the exhaust emission of a combustion process |
US4230930A (en) * | 1979-01-25 | 1980-10-28 | Ford Motor Company | Laser welding method for electrical wire connection to a terminal pin of an exhaust gas sensor |
JPS5613745U (ja) * | 1979-07-12 | 1981-02-05 | ||
DE3109101C2 (de) * | 1981-03-10 | 1984-02-23 | Franz 8359 Ortenburg Frischen | Verfahren zur Herstellung von elektrischen Kabeln |
US4512827A (en) * | 1981-09-21 | 1985-04-23 | Associated Electrical Industries Limited | Method of manufacturing mineral insulated electric cable and like elements |
DE3247338A1 (de) * | 1982-12-21 | 1984-06-28 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum laserloeten von flexiblen verdrahtungen |
US4569817A (en) * | 1983-05-17 | 1986-02-11 | Westinghouse Electric Corp. | Miniature fission chamber and signal cable assembly |
WO1985003773A1 (en) * | 1984-02-20 | 1985-08-29 | Pio Meyer | Sample taking device |
US4750062A (en) * | 1984-04-19 | 1988-06-07 | Alpine Electronics Ltd. | Rotatable tape loading device in a magnetic tape recorder-reproducer apparatus |
JPS60226464A (ja) * | 1984-04-20 | 1985-11-11 | 日本特殊陶業株式会社 | セラミックと金属との接合構造 |
DE3427207A1 (de) * | 1984-07-24 | 1986-02-06 | Hotset Heizpatronen und Zubehör GmbH, 5880 Lüdenscheid | Leiteranschlussvorrichtung an einem elektrischen patronenheizkoerper |
JPH0719643B2 (ja) * | 1984-10-26 | 1995-03-06 | 日本電装株式会社 | セラミツクスヒ−タおよびその製造方法 |
FR2575321B1 (fr) * | 1984-12-21 | 1988-01-15 | Thermocoax Cie | Cable blinde a isolant mineral |
US4883643A (en) * | 1985-06-20 | 1989-11-28 | Ngk Spark Plug Co., Ltd. | Oxygen sensor protected against contaminants |
JPS62163961A (ja) * | 1986-01-16 | 1987-07-20 | Fujikura Ltd | 酸素センサ素子 |
US4713520A (en) * | 1986-03-24 | 1987-12-15 | Tektronix, Inc. | Method and apparatus for interconnecting and hermetically sealing ceramic components |
US4742717A (en) * | 1986-09-16 | 1988-05-10 | Kaijo Denki Co., Ltd. | Gas flow rate measuring device |
US4978052A (en) * | 1986-11-07 | 1990-12-18 | Olin Corporation | Semiconductor die attach system |
EP0277645A1 (en) * | 1987-02-02 | 1988-08-10 | Sumitomo Electric Industries Limited | Ceramics-metal jointed body |
US4750256A (en) * | 1987-04-13 | 1988-06-14 | Allied Corporation | Method of assembly of an O2 sensor |
FR2636737B1 (fr) * | 1988-09-16 | 1993-12-03 | Thomson Csf | Capteur de type resistif, de mesure de concentrations relatives d'especes reactives fluides, compense en temperature |
JPH02146364U (ja) * | 1989-05-15 | 1990-12-12 | ||
WO1992008127A1 (de) * | 1990-10-26 | 1992-05-14 | Robert Bosch Gmbh | Gasmessfühler, insbesondere zur bestimmung des sauerstoffgehaltes in abgasen von brennkraftmaschinen |
US5171517A (en) * | 1990-12-10 | 1992-12-15 | General Electric Company | Method for monitoring corrosion on a member in a nuclear reactor core |
US5108025A (en) * | 1991-05-20 | 1992-04-28 | Gte Laboratories Incorporated | Ceramic-metal composite article and joining method |
DE4204850A1 (de) * | 1992-02-18 | 1993-08-19 | Roth Technik Gmbh | Gehaeuse fuer einen gassensor |
US5306891A (en) * | 1992-04-02 | 1994-04-26 | Motorola, Inc. | Laser welding process for attaching metal to ceramic substrate |
US5329806A (en) * | 1993-05-11 | 1994-07-19 | General Motors Corporation | Exhaust sensor with tubular shell |
DE4415938C2 (de) * | 1994-05-05 | 2000-02-24 | Heraeus Electro Nite Int | Gassensor |
US5536478A (en) * | 1994-12-01 | 1996-07-16 | Corning Incorporated | Electrical leads for a fluid heaters |
-
1994
- 1994-12-23 EP EP95905584A patent/EP0797558B1/de not_active Expired - Lifetime
- 1994-12-23 DE DE59409959T patent/DE59409959D1/de not_active Expired - Lifetime
- 1994-12-23 US US08/669,364 patent/US5730543A/en not_active Expired - Fee Related
- 1994-12-23 WO PCT/EP1994/004297 patent/WO1995018777A1/de active IP Right Grant
-
1995
- 1995-01-05 DE DE29521966U patent/DE29521966U1/de not_active Expired - Lifetime
- 1995-01-05 DE DE59510271T patent/DE59510271D1/de not_active Expired - Lifetime
- 1995-01-05 DE DE29522062U patent/DE29522062U1/de not_active Expired - Lifetime
- 1995-01-05 JP JP7518313A patent/JPH10505406A/ja not_active Ceased
- 1995-01-05 WO PCT/EP1995/000042 patent/WO1995018965A1/de active IP Right Grant
- 1995-01-05 EP EP95906915A patent/EP0738385B1/de not_active Expired - Lifetime
-
1997
- 1997-11-18 US US08/972,538 patent/US6055847A/en not_active Expired - Fee Related
- 1997-11-18 US US08/979,823 patent/US6067843A/en not_active Expired - Lifetime
-
1999
- 1999-12-09 US US09/457,263 patent/US6158268A/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018016482A1 (ja) * | 2016-07-19 | 2018-01-25 | 日本特殊陶業株式会社 | ガスセンサ |
JPWO2018016482A1 (ja) * | 2016-07-19 | 2018-07-19 | 日本特殊陶業株式会社 | ガスセンサ |
Also Published As
Publication number | Publication date |
---|---|
US6055847A (en) | 2000-05-02 |
US5730543A (en) | 1998-03-24 |
EP0797558A1 (de) | 1997-10-01 |
DE59409959D1 (de) | 2001-12-20 |
WO1995018965A1 (de) | 1995-07-13 |
US6067843A (en) | 2000-05-30 |
EP0738385A1 (de) | 1996-10-23 |
US6158268A (en) | 2000-12-12 |
DE29521966U1 (de) | 1999-02-11 |
EP0797558B1 (de) | 2001-11-14 |
DE29522062U1 (de) | 1999-07-15 |
WO1995018777A1 (de) | 1995-07-13 |
EP0738385B1 (de) | 2002-07-10 |
DE59510271D1 (de) | 2002-08-14 |
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