JPH10328989A5 - - Google Patents

Info

Publication number
JPH10328989A5
JPH10328989A5 JP1997159261A JP15926197A JPH10328989A5 JP H10328989 A5 JPH10328989 A5 JP H10328989A5 JP 1997159261 A JP1997159261 A JP 1997159261A JP 15926197 A JP15926197 A JP 15926197A JP H10328989 A5 JPH10328989 A5 JP H10328989A5
Authority
JP
Japan
Prior art keywords
wafer
polishing
edge
edges
drums
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997159261A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10328989A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP15926197A priority Critical patent/JPH10328989A/ja
Priority claimed from JP15926197A external-priority patent/JPH10328989A/ja
Publication of JPH10328989A publication Critical patent/JPH10328989A/ja
Publication of JPH10328989A5 publication Critical patent/JPH10328989A5/ja
Pending legal-status Critical Current

Links

JP15926197A 1997-06-02 1997-06-02 ウエハエッジの鏡面研磨方法及び装置 Pending JPH10328989A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15926197A JPH10328989A (ja) 1997-06-02 1997-06-02 ウエハエッジの鏡面研磨方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15926197A JPH10328989A (ja) 1997-06-02 1997-06-02 ウエハエッジの鏡面研磨方法及び装置

Publications (2)

Publication Number Publication Date
JPH10328989A JPH10328989A (ja) 1998-12-15
JPH10328989A5 true JPH10328989A5 (enrdf_load_stackoverflow) 2005-03-17

Family

ID=15689906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15926197A Pending JPH10328989A (ja) 1997-06-02 1997-06-02 ウエハエッジの鏡面研磨方法及び装置

Country Status (1)

Country Link
JP (1) JPH10328989A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6685539B1 (en) 1999-08-24 2004-02-03 Ricoh Company, Ltd. Processing tool, method of producing tool, processing method and processing apparatus
JP2002313757A (ja) 2001-04-17 2002-10-25 Hitachi Ltd 半導体集積回路装置の製造方法
JP2002329687A (ja) * 2001-05-02 2002-11-15 Speedfam Co Ltd デバイスウエハの外周研磨装置及び研磨方法
US20070298687A1 (en) * 2006-06-22 2007-12-27 3M Innovative Properties Company Apparatus and method for modifying an edge
JP4966116B2 (ja) * 2007-07-09 2012-07-04 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP2009027198A (ja) * 2008-10-31 2009-02-05 Renesas Technology Corp 半導体集積回路装置の製造方法

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