JPH10303259A5 - - Google Patents

Info

Publication number
JPH10303259A5
JPH10303259A5 JP1997111520A JP11152097A JPH10303259A5 JP H10303259 A5 JPH10303259 A5 JP H10303259A5 JP 1997111520 A JP1997111520 A JP 1997111520A JP 11152097 A JP11152097 A JP 11152097A JP H10303259 A5 JPH10303259 A5 JP H10303259A5
Authority
JP
Japan
Prior art keywords
wiring layer
chip
integrated circuit
circuit device
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997111520A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10303259A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP9111520A priority Critical patent/JPH10303259A/ja
Priority claimed from JP9111520A external-priority patent/JPH10303259A/ja
Publication of JPH10303259A publication Critical patent/JPH10303259A/ja
Publication of JPH10303259A5 publication Critical patent/JPH10303259A5/ja
Pending legal-status Critical Current

Links

JP9111520A 1997-04-28 1997-04-28 半導体集積回路装置およびその製造方法 Pending JPH10303259A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9111520A JPH10303259A (ja) 1997-04-28 1997-04-28 半導体集積回路装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9111520A JPH10303259A (ja) 1997-04-28 1997-04-28 半導体集積回路装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPH10303259A JPH10303259A (ja) 1998-11-13
JPH10303259A5 true JPH10303259A5 (cg-RX-API-DMAC10.html) 2005-02-10

Family

ID=14563418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9111520A Pending JPH10303259A (ja) 1997-04-28 1997-04-28 半導体集積回路装置およびその製造方法

Country Status (1)

Country Link
JP (1) JPH10303259A (cg-RX-API-DMAC10.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100385225B1 (ko) * 2001-03-23 2003-05-27 삼성전자주식회사 탐침 패드 및 범프 패드를 갖는 플립 칩형 반도체소자 및 그 제조방법
JP4654598B2 (ja) * 2004-04-30 2011-03-23 ソニー株式会社 半導体装置およびその製造方法
JP4822880B2 (ja) 2006-03-02 2011-11-24 株式会社リコー 半導体ウエハ、半導体装置及び半導体装置の製造方法
JP2009212299A (ja) * 2008-03-04 2009-09-17 Fujitsu Ltd 半導体装置及びその製造方法
US9632109B2 (en) * 2011-06-30 2017-04-25 Advantest Corporation Methods, apparatus, and systems for contacting semiconductor dies that are electrically coupled to test access interface positioned in scribe lines of a wafer
CN107680937B (zh) * 2017-09-30 2024-03-26 长鑫存储技术有限公司 晶圆结构、晶圆结构切割方法及芯片

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