JPH10277899A - End face polishing machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To treat plural sheets of glass boards in a lump by installing a grinding wheel part multistageably installed with plural concave grinding wheels, having the central part of a polishing surface sunken so as to contact with each face of these plural glass substrates held by a cassette type stage. SOLUTION: Those of width adjustments of a cassette type stage 2 and position adjustments of a turning shaft 9 are carried out according to the size of a glass substrate 1 and the stock removal of face polishing. In addition, a position is altered to a polishing position by a turning shaft positioning part 5 and thereby the positioned turning shaft 9 is rotated at a rotational speed adjusted to grinding wheel polishing conditions. Four sheets of the glass substrate 1 are mounted on the cassette type stage 2 and, after holding by suction is carried out, the cassette type stage 2 is moved at an optional speed in space between two grinding wheel parts 4, and thus a polishing process takes place. At the time of a size alteration of the glass substrate 1, width of the cassette type stage 2 and a position of the turning shaft 9 are automatically adjusted each.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an end face polishing machine for polishing an end face of a glass substrate used for, for example, a color liquid crystal panel or the like, and more particularly to a plurality of concave grindstones arranged in multiple stages and a plurality of cassettes mounted on a cassette type stage. The present invention relates to an end face polishing machine using a mechanism for simultaneously polishing end faces of a glass substrate.

[0002]

2. Description of the Related Art First, there is a case where a glass substrate is divided before a patterned glass substrate is subjected to an alignment treatment or the like in a color liquid crystal panel manufacturing process as a background that requires polishing by an end face polishing machine. The end face of the glass substrate after the cutting is sharp, which may damage a transfer guide or the like used in transferring the glass substrate, generate dust, and cause poor alignment or the like when placed on the glass substrate. Further, it is conceivable that similar defects occur even if chipping occurs from the sharp glass substrate end face. Second, when positioning is performed using the outer shape of the glass substrate, poor positioning may occur if the outer shape of the glass substrate is not accurately shaped.

Here, an example of a conventional glass substrate end face polishing machine will be described with reference to FIGS. 5 and 6. FIG. This end face polishing machine
As shown in FIG. 5, a stage 19 on which the glass substrate 1 is placed and transported between two cup-shaped grindstones 20 is set so that the tapered surface after the end face polishing and the polished surface of the bottom surface of the cup-shaped grindstone 20 are parallel. A cup-shaped whetstone 20 attached to four places,
A rotation mechanism 15 for rotating the cup-type grindstone 20 horizontally with the tapered surface is provided.

[0004] The first disadvantage of this end face polishing machine is that since the polishing process is performed on a single wafer, it takes a long time for the polishing process. When processing a large number of glass substrates, it is necessary to install a plurality of apparatuses. The point is that it may not be. Also, the second
The disadvantage of this is that when the size of the glass substrate changes, the stage 19 needs to be replaced in accordance with the size of the glass substrate 1, and the operation rate of the apparatus is reduced by operations such as stage replacement and adjustment of the polishing amount after the replacement. Is a point. The third disadvantage is that since the polishing is performed using the bottom surface of the cup-shaped grindstone, the polishing shape of the end surface of the glass substrate can be processed only in a trapezoidal shape (C chamfering) as shown in FIG. The point is that machining of the cut surface 17 and arc shape (R chamfering) machining cannot be performed. Therefore, the outer shape cannot be formed after polishing, and the tapered shape at the time of cutting cannot be corrected.
In addition, when the chamfer amount became large with respect to the thickness of the glass substrate, after polishing, the end surface shape of the glass substrate became sharp as shown in FIG. In this case, the operation of the device may be adversely affected.

Next, as an example of a conventional glass substrate cutting and chamfering machine, an apparatus disclosed in Japanese Patent Application Laid-Open No. Sho 62-100440 will be described with reference to FIGS. This device is
As shown in FIG. 7, the glass substrate 1 is placed and the convex whetstone 14
The support table 12 to be transported upward, and a V for performing a cutting process and a chamfering process as cutting lines arranged above and below the support table 12.
Convex whetstone 14 having a character-shaped convex portion, a rotation mechanism 15 for rotating the convex whetstone 14 vertically, and an upper and lower convex whetstone 1
4 is positioned on the same vertical plane as the cutting line 13 and an adjusting mechanism 16 for bringing the convex grindstone 14 into contact with the glass substrate 1
And apply bending stress to the cutting line 13 after polishing,
Make a cut. Usually, bending stress is applied manually.

The cutting and polishing of the glass substrate 1 is performed by
Convex whetstone 14 whose position has been adjusted to the cutting line 13
The support 12 on which the glass substrate 1 is placed is moved so that the convex grindstone 14 is in contact with the cutting line 13, a V-groove is formed on the glass substrate 1, and a bending stress is applied to the V-groove to divide it. I do. The divided glass substrate 1 is cut from the center of the V groove, and the tapered portion of the V groove has a chamfered shape. When this apparatus is used, it is considered that the V-groove serving as a chamfered portion and the cutting line 13 are collectively processed, so that the cutting and polishing processing time can be slightly reduced.

However, the following disadvantages are also considered. The first disadvantage of this device is that it performs single-wafer processing,
This means that a long time is required for the cutting and polishing process, and when a large amount of processing is performed, a plurality of apparatuses must be installed.
Further, as a second disadvantage, since the V-groove formed by the polishing process is divided as the cutting line 13, cracks for cutting are less likely to progress, and if the bending stress at the time of cutting varies, a cutting failure occurs, and the device becomes defective. The point is that operation and product quality may be adversely affected. As a third disadvantage, since the cutting is performed after the polishing process, the cut surface 17 shown in FIG. 8 is not polished. For this reason, as shown in FIG. 8, glass peeling may occur due to minute cracks 18 generated at the time of cutting, which may cause a trouble during glass substrate transfer. When the position of the upper and lower convex grindstones 14 is shifted, the cut surface 17 is tapered as shown in FIG. 8, but the polishing of the cut surface 17 is not performed, so that the shape of the end surface of the glass substrate 1 is corrected. And may adversely affect product quality.

[0008]

A first problem with the conventional end face polishing machine is that the polishing process requires time. For this reason, in the processing using the cup-type grindstone, since the bottom surface of the cup-type grindstone comes in contact with the polishing surface obliquely from above and below, two axes are required for polishing one side,
This is because batch processing in which a plurality of glass substrates are stacked in multiple stages cannot be performed.

A second problem is that when a glass substrate is processed by placing the glass substrate on a stage, the stage needs to be replaced and the apparatus adjusted by changing the size of the glass substrate. The reason for this is that, since the width of the stage is fixed, stable support is not possible depending on the size of the glass substrate, which makes processing difficult.

A third problem is that the polishing can be performed only in a polishing mode in which the end face of the glass substrate is trapezoidal, and the shape after polishing may be sharp. The reason for this is that a cup-shaped grindstone is used for polishing, and the flat surface at the bottom is rotated for polishing to perform the polishing process. Therefore, the end surface processing of the glass substrate is not performed, and the polished surface itself has a flat shape. This is because it can only be processed.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and can perform a batch processing of a plurality of glass substrates, and can improve productivity by easily coping with glass substrates of different sizes. It is another object of the present invention to provide an end face polishing machine capable of obtaining a good end face polishing shape.

[0012]

In order to achieve the above object, an end face polishing machine according to the present invention is characterized in that the width of a substrate receiving portion for holding a rectangular glass substrate can be automatically adjusted according to the size of the glass substrate. A cassette type stage in which a plurality of glass substrates are stored in multiple stages by a plurality of substrate receiving portions, and a central portion of the polishing surface is depressed so as to be in contact with end surfaces of the plurality of glass substrates held by the cassette type stage. A plurality of concave grindstones provided in multiple stages, a first rotating shaft to which the grindstones are attached and arranged on both sides of a cassette type stage for processing two sides of the glass substrate; And a rotating shaft positioning portion for automatically moving the first rotating shaft in accordance with the width and the amount of polishing to fix the position.

[0013] In addition to the above-mentioned structure, a shape in which the amount of contact with the end face of the glass substrate is smaller than that of the shape of the concave grindstone at the preceding stage of the grindstone portion, and is made of a material coarser than that used in the grindstone portion. Auxiliary polishing grindstone part provided with a plurality of concave grinding wheels for auxiliary polishing provided in multiple stages, and the auxiliary polishing grindstone part is mounted, and the second polishing grindstone part is disposed on both sides of the cassette type stage to process two sides of the glass substrate. A second rotating shaft, and a rotating shaft positioning unit that automatically moves and fixes the position of the first and second rotating shafts according to the width and the polishing amount of the glass substrate may be provided.

[0014] Alternatively, a plurality of auxiliary polishing members made of a material coarser than that used in the grindstone portion may have a shape in which the amount of contact with the end face of the glass substrate is smaller than that of the concave grindstone portion. The concave grindstone and the concave grindstone are provided in multiple stages alternately, the first rotating shaft is automatically moved according to the width and the polishing amount of the glass substrate, the position is fixed, and the height of the first rotating shaft is adjusted. A rotating shaft positioning unit for adjusting may be provided.

According to the edge polishing machine of the present invention, a plurality of glass substrates are held in multiple stages on the cassette type stage, and the edge of the glass substrate is polished by a grindstone portion provided with a plurality of concave grindstones in multiple stages. As a result, the glass substrate can be collectively polished, and the processing capability of the apparatus can be improved.

In addition, the apparatus has a cassette type stage having a substrate receiving portion whose width can be adjusted, and the position of a rotating shaft for rotating the grindstone portion is movable, so that it is possible to cope with glass substrates of various sizes. Since the width of the cassette type stage and the position of the rotation axis automatically change when the size of the glass substrate is changed, the operation rate of the apparatus does not decrease due to the change in the size of the glass substrate.

Further, by using a concave grindstone in which the shape of a grindstone can be freely manufactured, it becomes possible to polish the arc shape of the end portion of the glass substrate, to correct the outer dimensions after cutting, and to generate dust and dust from the end portion of the glass substrate. It is possible to prevent a transport trouble due to a defective outer shape.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a front view showing an end face polishing machine of the present embodiment, and FIG. 2 is a side view thereof.

As shown in FIGS. 1 and 2, the end face polisher of the present embodiment automatically changes the position of the substrate receiving portion 6 in accordance with the width of the glass substrate 1 to be polished. A cassette type stage 2 for mounting and transporting the glass substrates 1 in multiple stages, and a concave grinding wheel 3 having a concave portion formed in accordance with the shape of the end surface of the glass substrate 1 so as to uniformly contact the end surfaces of the four glass substrates 1. Whetstone parts 4 arranged in multiple stages, each glass substrate 1
A rotating shaft 9 (first rotating shaft) for rotating the grinding stone portion 4 in contact with the end surface of the glass substrate 1 to polish the end surface of the glass substrate 1 into an arbitrary concave shape, and the rotating shaft 9 according to the width and the polishing amount of the glass substrate 1. And the like. The grinding wheel unit 4, the rotating shaft 9, and the rotating shaft positioning unit 5
The glass substrate 1 is disposed on both sides of the cassette type stage 2 so that two sides of the glass substrate 1 can be processed.

The rotation shaft 9 is moved in the width direction of the glass substrate 1 by the operation of the rotation shaft positioning portion 5, but is not moved in the front-back direction, and rotates at that position. ing. Then, the cassette type stage 2 is configured to move in the front-rear direction by a front-rear movement mechanism (not shown), and polishing is performed by sliding the end surface of the side portion of each glass substrate 1 with the rotating polishing surface of the concave grindstone 3. Is being done.

Next, the configuration of the cassette type stage 2 on which the glass substrates 1 are mounted in multiple stages will be described. The width of the glass substrate 1 is measured in advance, and the size of the glass substrate 1 to be polished when the glass substrate 1 is transferred to a polishing machine is set. Then, according to the set size of the glass substrate 1, the substrate receiving portion 6 of the cassette type stage 2 is moved to the guide 7a.
And is adjusted to the size of the glass substrate 1. The substrate receiving portion 6 is provided with an adsorption mechanism 8 for adsorbing and holding the glass substrate 1, so that the glass substrate 1 does not move during polishing. By providing the substrate receiving portion 6 at the center, it is possible to make it difficult for the glass substrate 1 to bend when the glass substrate 1 is placed.

Next, the grinding wheel 4 of the end face polishing machine, the rotating shaft 9,
The rotating shaft positioning unit 5 will be described. In the whetstone part 4,
A plurality of concave grindstones 3 having a concave shape required after the polishing process, for example, the center of the polishing surface is smoothly rounded and concaved, are provided. The height is adjusted and the combination is configured so that the concave portion is positioned at the contact position.
The rotating shaft 9 is provided with a motor 10 whose specifications are determined according to grinding conditions, grinding shape, grinding load, peripheral speed, and the like. The rotating shaft positioning section 5 moves and holds the rotating shaft 9 to a position on the guide 7b according to the size and the polishing amount of the glass substrate 1.

Hereinafter, a polishing method of the end face polishing machine having the above configuration will be described. First, the width of the cassette type stage 2 and the position of the rotating shaft 9 are adjusted according to the size of the glass substrate 1 and the polishing amount of the end surface polishing. Then, the rotating shaft 9 whose position has been changed to the polishing position by the rotating shaft positioning unit 5 and positioned, rotates at a rotation speed that matches the grinding wheel polishing conditions.

Next, four glass substrates 1 positioned on a cassette type stage 2 having a width corresponding to the size of the glass substrate 1 are placed. When the glass substrates 1 are placed, they are placed at once from the side surface of the cassette type stage 2 or one by one. Further, the positioning may be performed by a method according to the precision at the time of polishing. For example, when precise polishing is required, the positioning may be performed on a single wafer, and the cassette-type stage 2 may be placed in order from the top and suction-held.

After the four glass substrates are placed on the cassette type stage 2 and suction holding is performed, the cassette type stage 2 is moved between the two grindstone portions 4 at an arbitrary speed.
A polishing process is performed. After the polishing process, the glass substrate 1 is discharged from the cassette type stage 2.

According to the edge polishing machine of the present embodiment, the four glass substrates 1 are
The glass substrate 1 is formed by a grindstone portion 4 having a plurality of concave grindstones 3.
Since the end face is polished, the glass substrate 1 can be collectively polished, and the processing capability of the apparatus can be improved. A rotating shaft 9 having a cassette type stage 2 having a substrate receiving portion 6 having an adjustable width and rotating the grinding wheel portion 4;
Since the position of the glass substrate 1 is also movable, it can correspond to glass substrates 1 of various sizes, and when the size of the glass substrate 1 is changed, the width of the cassette type stage 2 and the position of the rotating shaft 9 are automatically adjusted. The operation rate of the apparatus does not decrease due to the change in the size of the glass substrate 1. Further, by using the concave whetstone 3 whose grinding wheel shape can be freely manufactured, it becomes possible to polish the arc shape of the end portion of the glass substrate 1 and to correct the external dimensions after cutting, and to generate dust and dust from the end portion of the glass substrate 1. It is possible to prevent a transport trouble due to a defective outer shape.

Hereinafter, a second embodiment of the present invention will be described with reference to FIG. FIG. 1 is a side view showing an end face polishing machine according to the present embodiment, but the present embodiment differs from the first embodiment in that it has an auxiliary polishing grindstone portion. Therefore, regarding the other common parts, FIG.
The same reference numerals as in FIG. 2 are assigned, and the detailed description is omitted.

As shown in FIG. 3, the auxiliary polishing grindstone portion 11 and the grindstone portion 4 in the end face polishing machine of the present embodiment come into contact with the end faces of the four glass substrates 1 mounted on the cassette type stage 2. The height is adjusted so that each of the concave portions is positioned, and the combined four concave grindstones 3 are formed.
a, 3b and are attached to separate rotating shafts 9 respectively.

The auxiliary grinding wheel portion 11 has a shape in which the amount of contact with the end face of the glass substrate 1 is smaller than the shape of the grinding wheel used in the wheel portion 4 in order to reduce the processing load on the wheel portion 4. A concave grinding wheel 3b for auxiliary polishing made of a material coarser than that used is provided. For example, assuming that the shape of the concave grindstone 3a of the grindstone portion 4 is a concave portion with a round central portion,
The shape of the concave grinding wheel 3b of the auxiliary grinding wheel part 11 is V at the center.
It is shaped like a letter.

On the other hand, the grindstone portion 4 is provided with a concave grindstone 3a having a concave shape required after the polishing process. Each rotary shaft 9 is provided with a motor 10 whose specifications are determined according to grinding conditions, polishing shape, load during polishing, peripheral speed, etc., and an auxiliary grinding wheel unit 11 and a grinding wheel unit 4 are attached. Further, the rotating shaft positioning section 5 is provided with each rotating shaft 9 at a position corresponding to the size and the polishing amount of the glass substrate 1.
Is moved and held.

Hereinafter, a polishing method of the end face polishing machine having the above configuration will be described. First, the width of the cassette type stage 2 and the position of the rotating shaft 9 are adjusted according to the size of the glass substrate 1 and the polishing amount of the end surface polishing. Then, the rotating shaft 9 whose position has been changed to the polishing position by the rotating shaft positioning unit 5 and positioned, rotates at a rotation speed that matches the grinding wheel polishing conditions.

Next, four glass substrates 1 positioned on a cassette type stage 2 having a width corresponding to the size of the glass substrate 1 are placed thereon, and after holding by suction, the cassette type stage 2 is moved to the auxiliary polishing grindstone 11. The rough polishing process and the main polishing process are successively performed by moving the grindstone portion 4 in sequence at an arbitrary speed. After the main polishing process, the glass substrate 1 is discharged from the cassette type stage 2.

The same effects as those of the first embodiment can be obtained in the end face polishing machine of the present embodiment. Further, in the case of the present embodiment, since the auxiliary polishing grindstone portion 11 for performing preliminary rough polishing is provided at a stage preceding the grindstone portion 4 for performing final polishing, the processing load on the grindstone portion 4 is reduced. Thus, the life of the concave grinding wheel 3a can be extended, and the processing time as a whole and the processing accuracy can be improved.

Hereinafter, a third embodiment of the present invention will be described with reference to FIG. FIG. 4 is a side view showing the end face polishing machine of the present embodiment. As in the second embodiment, the present embodiment also has an auxiliary polishing grindstone portion, but in that a concave grindstone for auxiliary polishing and a concave grindstone for main polishing are combined into one grindstone portion, This is different from the configuration of the second embodiment.

As shown in FIG. 4, each of the concave portions of the grindstone portion 4 of the end face polishing machine according to the present embodiment is positioned at a position in contact with the end faces of the four glass substrates 1 mounted on the cassette type stage 2. The height is adjusted so that the concave grindstones 3a for main polishing and the concave grindstones 3b for auxiliary polishing are alternately stacked in a total of eight stages, and attached to the rotating shaft 9.

The concave grinding wheel 3b for auxiliary polishing has a shape in which the amount of contact with the end surface of the glass substrate 1 is smaller than that of the concave grinding wheel 3a in order to reduce the processing load of the concave grinding wheel 3a, and is rougher than the concave grinding wheel 3a. Made of materials. For example,
Assuming that the shape of the concave grindstone 3a is round and concave at the center, the shape of the concave grindstone 3b for auxiliary polishing is a V-shaped cut at the center.

The rotating shaft 9 has a grinding wheel condition, a polishing shape,
A motor 10 whose specifications are determined according to a load and a peripheral speed at the time of polishing is provided, and a grindstone unit 4 is attached. Further, the rotating shaft positioning unit 5 moves and holds the rotating shaft 9 to a position corresponding to the size and the polishing amount of the glass substrate 1. Further, in the case of the present embodiment, the rotating shaft positioning section 5 is configured to be able to move the rotating shaft 9 to an arbitrary height.

Hereinafter, a polishing method of the end face polishing machine having the above configuration will be described. First, the width of the cassette type stage 2 and the position of the rotating shaft 9 are adjusted according to the size of the glass substrate 1 and the polishing amount of the end surface polishing. In addition, first, the rotating shaft positioning unit 5 places the rotating shaft 9, that is, the grinding wheel unit 4, at the position where the auxiliary polishing concave grinding wheel 3 b contacts the end surface of the glass substrate 1.
Adjust the height of the. The rotating shaft 9 whose position has been changed to the polishing position and positioned by the rotating shaft positioning unit 5.
However, it rotates at the number of rotations according to the grinding stone polishing conditions.

Next, four glass substrates 1 positioned on a cassette type stage 2 having a width corresponding to the size of the glass substrate 1 are placed, and after suction holding, the cassette type stage 2 is moved between the grindstone portions 4. Move at any speed with
The rough polishing process is performed by b.

Next, after the cassette type stage 2 has passed between the grindstone portions 4, the rotating shaft positioning portion 5 moves the rotating shaft 9 to a position where the main polishing concave grindstone 3a comes into contact with the end surface of the glass substrate 1 this time. That is, the height of the grindstone portion 4 is changed. Then, the cassette type stage 2 is again moved between the grindstone portions 4 in the direction opposite to the previous direction, and the main polishing process is performed by the concave grindstone 3a. After the main polishing process, the glass substrate 1 is discharged from the cassette type stage 2.

The technical scope of the present invention is not limited to the above embodiment, and various changes can be made without departing from the spirit of the present invention. For example, the number of glass substrates that can be mounted on a cassette type stage,
The number and shape of the concave grindstones are not limited to those in the above embodiment, and the design can be changed as appropriate.

[0042]

As described above, according to the edge polishing machine of the present invention, the following effects can be obtained. The first effect is that the processing capability of the apparatus can be improved by the batch polishing process. The reason is that a large number of glass substrates can be held on the cassette type stage and the polishing process can be performed by the concave grindstones arranged in multiple stages. Further, since the batch polishing is performed, there is little processing variation in the batch, and the quality of the product can be improved.

The second effect is that it is not necessary to change the stage even if the size of the glass substrate changes. The reason is that by using a cassette type stage and a rotation axis whose width can be automatically adjusted, the width of the cassette type stage and the position of the rotation axis automatically change when the size of the glass substrate is changed. This is because such stage exchange becomes unnecessary.

The third effect is that the end face of the glass substrate can be polished, the shape of the end face of the glass substrate can be freely selected, and the generation of dust from the end face of the glass substrate can be suppressed. The reason is that the use of a concave grindstone capable of freely processing and manufacturing the shape of a grindstone enables the shape of the grindstone to match the desired shape of the end face of the glass substrate.

[Brief description of the drawings]

FIG. 1 is a front view showing a schematic configuration of an end face polishing machine according to a first embodiment of the present invention.

FIG. 2 is a side view of the same.

FIG. 3 is a side view illustrating a schematic configuration of an end face polishing machine according to a second embodiment of the present invention.

FIG. 4 is a side view showing a schematic configuration of an end face polishing machine according to a third embodiment of the present invention.

FIG. 5 is a front view showing a schematic configuration of an end face polishing machine as an example of the related art.

FIG. 6 is a perspective view showing an end face of the glass substrate after a polishing process by the end face polishing machine.

FIG. 7 is a front view showing a schematic configuration of a conventional glass substrate cutting and chamfering machine.

FIG. 8 is a perspective view showing an end surface of the glass substrate after the polishing process by the cutting chamfering machine.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Cassette type stage 3, 3a, 3b Concave grindstone 4 Grindstone part 5 Rotation axis positioning part 6 Substrate receiving part 7a, 7b Guide 8 Suction mechanism 9 Rotation axis 10 Motor 11 Auxiliary grinding stone part 12 Support stand 13 Cutting line 14 Convex whetstone 15 Rotation mechanism 16 Adjustment mechanism 17 Cutting surface 18 Micro crack 19 Stage 20 Cup type whetstone

Claims (3)

[Claims] 1. A cassette type stage in which a width of a substrate receiving portion for holding a rectangular glass substrate can be automatically adjusted according to the size of the glass substrate, and a plurality of glass substrates are stored in multiple stages by a plurality of substrate receiving portions. A plurality of concave grindstones in which the central part of the polishing surface is depressed so as to be in contact with the end faces of the plurality of glass substrates held by the cassette type stage; A first rotating shaft disposed on both sides of the cassette type stage for processing two sides of the glass substrate; and automatically moving the first rotating shaft in accordance with the width and polishing amount of the glass substrate. An end face polishing machine, comprising: a rotary shaft positioning part for causing the position to be fixed. 2. The end face polishing machine according to claim 1, wherein a shape in which the amount of contact with a glass substrate end face is smaller than that of the shape of the concave whetstone before the whetstone part, and which is used in the whetstone part. A plurality of auxiliary polishing grindstones made of a coarser material and provided in multiple stages, and an auxiliary polishing grindstone portion attached to the cassette type stage for processing two sides of a glass substrate. A second rotating shaft disposed on both sides of the first and second substrates according to the width of the glass substrate and the polishing amount.
An end face polishing machine comprising a rotating shaft positioning section for automatically moving and rotating the rotating shaft. 3. The end face polishing machine according to claim 1, wherein the grindstone has a shape in which the amount of contact with the glass substrate end face is smaller than the shape of the concave grindstone, and is smaller than that used in the grindstone. A plurality of concave grindstones for auxiliary polishing made of a coarse material and the concave grindstones are alternately provided in multiple stages, and the first rotating shaft is automatically moved and fixed in position according to the width of the glass substrate and the polishing amount. And the first
An end face polishing machine comprising a rotating shaft positioning portion for adjusting the height of the rotating shaft.