JPH10274788A5 - - Google Patents

Info

Publication number
JPH10274788A5
JPH10274788A5 JP1997081477A JP8147797A JPH10274788A5 JP H10274788 A5 JPH10274788 A5 JP H10274788A5 JP 1997081477 A JP1997081477 A JP 1997081477A JP 8147797 A JP8147797 A JP 8147797A JP H10274788 A5 JPH10274788 A5 JP H10274788A5
Authority
JP
Japan
Prior art keywords
insulating
film
semiconductor layer
layer
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997081477A
Other languages
English (en)
Japanese (ja)
Other versions
JP3827180B2 (ja
JPH10274788A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP8147797A priority Critical patent/JP3827180B2/ja
Priority claimed from JP8147797A external-priority patent/JP3827180B2/ja
Priority to US09/049,313 priority patent/US6010923A/en
Publication of JPH10274788A publication Critical patent/JPH10274788A/ja
Priority to US09/428,819 priority patent/US6097038A/en
Publication of JPH10274788A5 publication Critical patent/JPH10274788A5/ja
Application granted granted Critical
Publication of JP3827180B2 publication Critical patent/JP3827180B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP8147797A 1997-03-31 1997-03-31 半導体装置の製造方法 Expired - Fee Related JP3827180B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP8147797A JP3827180B2 (ja) 1997-03-31 1997-03-31 半導体装置の製造方法
US09/049,313 US6010923A (en) 1997-03-31 1998-03-27 Manufacturing method of semiconductor device utilizing annealed semiconductor layer as channel region
US09/428,819 US6097038A (en) 1997-03-31 1999-10-28 Semiconductor device utilizing annealed semiconductor layer as channel region

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8147797A JP3827180B2 (ja) 1997-03-31 1997-03-31 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPH10274788A JPH10274788A (ja) 1998-10-13
JPH10274788A5 true JPH10274788A5 (enExample) 2005-03-03
JP3827180B2 JP3827180B2 (ja) 2006-09-27

Family

ID=13747499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8147797A Expired - Fee Related JP3827180B2 (ja) 1997-03-31 1997-03-31 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP3827180B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116314475B (zh) * 2023-03-22 2024-10-01 天合光能股份有限公司 非晶硅薄膜退火方法和装置

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