JPH10233573A - プリント配線板及び部品実装方法 - Google Patents

プリント配線板及び部品実装方法

Info

Publication number
JPH10233573A
JPH10233573A JP9036760A JP3676097A JPH10233573A JP H10233573 A JPH10233573 A JP H10233573A JP 9036760 A JP9036760 A JP 9036760A JP 3676097 A JP3676097 A JP 3676097A JP H10233573 A JPH10233573 A JP H10233573A
Authority
JP
Japan
Prior art keywords
wiring board
substrate
printed wiring
land portion
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9036760A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10233573A5 (enExample
Inventor
Hiroyuki Hasegawa
浩之 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP9036760A priority Critical patent/JPH10233573A/ja
Publication of JPH10233573A publication Critical patent/JPH10233573A/ja
Publication of JPH10233573A5 publication Critical patent/JPH10233573A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP9036760A 1997-02-20 1997-02-20 プリント配線板及び部品実装方法 Pending JPH10233573A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9036760A JPH10233573A (ja) 1997-02-20 1997-02-20 プリント配線板及び部品実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9036760A JPH10233573A (ja) 1997-02-20 1997-02-20 プリント配線板及び部品実装方法

Publications (2)

Publication Number Publication Date
JPH10233573A true JPH10233573A (ja) 1998-09-02
JPH10233573A5 JPH10233573A5 (enExample) 2004-10-07

Family

ID=12478716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9036760A Pending JPH10233573A (ja) 1997-02-20 1997-02-20 プリント配線板及び部品実装方法

Country Status (1)

Country Link
JP (1) JPH10233573A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088058A (ja) * 2005-09-20 2007-04-05 Denso Corp 多層基板、及びその製造方法
JP2010283044A (ja) * 2009-06-03 2010-12-16 Shinko Electric Ind Co Ltd 配線基板および配線基板の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007088058A (ja) * 2005-09-20 2007-04-05 Denso Corp 多層基板、及びその製造方法
JP2010283044A (ja) * 2009-06-03 2010-12-16 Shinko Electric Ind Co Ltd 配線基板および配線基板の製造方法
US8749046B2 (en) 2009-06-03 2014-06-10 Shinko Electric Industries Co., Ltd. Wiring substrate and method of manufacturing the same

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