JPH09508706A - 液相分析のための新規支持メディアにおける小型化平坦カラム - Google Patents
液相分析のための新規支持メディアにおける小型化平坦カラムInfo
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- JPH09508706A JPH09508706A JP8514016A JP51401696A JPH09508706A JP H09508706 A JPH09508706 A JP H09508706A JP 8514016 A JP8514016 A JP 8514016A JP 51401696 A JP51401696 A JP 51401696A JP H09508706 A JPH09508706 A JP H09508706A
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Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.第1及び第2の実質的に平坦な対向表面を有する基板であって、前記基板が シリコン又は二酸化ケイ素以外の材料から成り、かつ第1の平坦表面にレーザ切 削されたマイクロチャネルを有する基板と; 第1の平坦表面の上方に配置され、細長い分離区画を定めるマイクロチャネル との組み合わされるカバー板と; 分離区画を通して外部ソースからの流体の通過を可能にする、分離区画と連絡 する少なくとも1つの入口ポート及び少なくとも1つの出口ポートと; を含んで成る小型化カラムデバイス。 2.さらに、該基板にレーザ切削した第1の検出手段を包含し、かつ前記第1の 検出手段が分離区画と連絡して該分離区画を通過する試料の検出を可能にする請 求項1記載の小型化カラム。 3.該基板が高分子材料、セラミック材料、及びその組合せから成る群から選択 される請求項2記載の小型化カラム。 4.さらに、カバー板にレーザ切削された第2の検出手段を包含し、前記第2の 検出手段は分離区画と連絡しておりかつ第1の検出手段と対向して配置される請 求項3記載の小型化カラム。 5.第1及び第2の検出手段が基板の平坦表面に直交する軸を有するアパチャー を包含し、前記アパチャーは組合されて検出経路を形成する請求項4記載の小型 化カラム。 6.さらに、第1及び第2の透明シートを包含し、かつ基板が前記第1の透明シ ートと第1の平坦表面との間に挿入され、前記第2の透明シートが第2の平坦表 面上方に置かれており、前記の両透明シートが第1及び第2の検出手段との組合 せで光学的検出経路を形成することを特徴とする請求項5記載の小型化カラム。 7.基板の第1の平坦表面にレーザ切削され、かつ分離区画と検出経路とに連絡 するさらに別の検出手段を包含する請求項5記載の小型化カラム。 8.さらに、それぞれ、第1及び第2の検出手段にインタフェースされ、かつ分 離区画に連絡している第1及び第2の導光手段を包含する請求項5記載の小型化 カラム。 9.別の検出手段が、基板の第1の平坦表面にレーザ切削された溝を包含するこ とを特徴とする請求項7記載の小型化カラム。 10.さらに、別の検出手段内部に配置され、かつ分離区画と検出経路とに連絡 する第3の導光手段を包含する請求項9記載の小型化カラム。 11.検出手段がさらに基板の第1の平坦表面にレーザ切削された第1及び第2 の溝を包含し、前記第1及び第2の溝は分離区画に関して互いに対向して配置さ れて第2の検出経路を形成することを特徴とする請求項7記載の小型化カラム。 12.さらに、それぞれ、第1及び第2の検出手段にインタフェースされ、かつ 分離区画に連絡している第1及び第2の導光手段と、それぞれ、第1及び第2の 溝内部に配置されて、分離区画及び検出経路に連絡している第3及び第4の導光 手段とを包含する請求項11記載の小型化カラム。 13.さらに、第1及び第2の平坦表面にそれぞれレーザ切削された第1及び第 2のマイクロチャネルと; 第1及び第2の平坦表面上方にそれぞれ配置され、第1及び第2の細長い分離 区画を定める、第1及び第2のマイクロチャネルと組み合わされる第1及び第2 のカバー板と; 第1の分離区画と連絡する少なくとも1つの入口ポート、及び第2の分離区画 と連絡する少なくとも1つの出口ポートと; 第1及び第2の分離区画を互いに連絡させて単一の連続的分離区画を形成する コンジット手段であって、前記コンジット手段は平坦表面に直交する軸を有する 基板にレーザ切削されたアパチャーを含むことを特徴とするコンジット手段と; を含んで成る請求項3記載の小型化カラム。 14.さらに、第1及び第2のカバー板にそれぞれレーザ切削され、かつコンジ ット手段と同軸的に連絡して配置されたアパチャーを含む第1及び第2の検出手 段を包含する請求項13記載の小型化カラム。 15.さらに、第1及び第2の透明シートを包含し、かつ第1のカバー板が前記 第1の透明シートと第1の平坦表面との間に挿入され、前記第2のカバー板が前 記第2の透明シートと第2の平坦表面との間に挿入されることを特徴とする請求 項14記載の小型化カラム。 16.コンジット手段が、透明シートとの組合せで、基板の幅に実質的に等しい 経路長を有する光学的検出経路を形成する請求項15記載の小型化カラム。 17.さらに、それぞれ、第1及び第2の検出手段にインタフェースされかつコ ンジット手段に連絡している第1及び第2の導光手段を包含する請求項14記載 の小型化カラム。 18.基板の第1の平坦表面にレーザ切削された溝によって形成され、かつコン ジット手段と連絡しているさらに別の検出手段を包含する請求項14、16又は 17の何れかに記載の小型化カラム。 19.さらに、別の検出手段内に配置されかつコンジット手段と連絡している導 光手段を包含する請求項14記載の小型化カラム。 20.小型化カラムデバイスにおいて、 シリコン又は二酸化ケイ素以外の材料から構成された基板から形成される支持体 であって、実質的に平坦な内表面をそれぞれ有する第1及び第2の構成要素半分 を有する支持体と; 第1の支持体の半分の内表面にレーザ切削された第1のマイクロチャネルと、 第2の支持体の半分の内表面にレーザ切削された第2のマイクロチャネルとであ って、前記の各支持体が相手の鏡像を与えるよう配置された各マイクロチャネル と; 両支持体半分の両内表面を互いに突合せ対向させてアライニングすることによ り形成され、マイクロチャネル群によって定められる細長い穴から成る分離区画 と; 分離区画を通して外部ソースからの流体の通過を可能にする、分離区画と連絡 する少なくとも1つの入口ポート及び少なくとも1つの出口ポートと; を含んで成る小型化デバイス。 21.さらに、支持体にレーザ切削されかつ分離区画と連絡していて、それによ り分離区画を通過する試料の検出を可能にする検出手段を包含する請求項20記 載の小型化カラム。 22.基板が高分子材料、セラミック材料、及びその組合せから成る群から選択 される請求項21記載の小型化カラム。 23.支持体がさらに、該支持体に折曲げ部を作るための折曲げ手段を包含し、 それによって基板が折り曲げられて第1及び第2の構成要素半分を互いに正確に 軸一致状態にすることができる請求項22記載の小型化カラム。 24.第1及び第2の支持体半分がさらに、該支持体半分にレーザ切削された複 数の穴から成るマイクロアライメント手段を包含し、かつ該穴群は、第1及び第 2の支持体半分における対応する穴の同軸アライメントによって該支持体半分の 正確なアライメントができるよう配置されて正確に細長い孔を定めることを特徴 とする請求項23記載の小型化カラム。 25.第1及び第2の支持体半分がさらに、該支持体半分に作られた対応する構 造体から成るマイクロアライメント手段を包含し、前記構造体が第1の支持体半 分の上に配置された複数の凹部と第2の支持体半分に配置された複数の突起から 成り、対応する構造体のアライメントによって両支持体半分の正確なアライメン トが可能となって正確に細長い孔を定めることができるよう前記突起が凹部とか み合うよう形造られることを特徴とする請求項23記載の小型化カラム。 26.さらに、第1及び第2の構成要素半分を通してそれぞれレーザ切削されて いて、分離区画と連絡しかつ支持体の面に直交する軸を有する第1及び第2のア パチャーを包含し、かつ該アパチャーは、両支持体半分の内表面が互いに突合せ 対向状態でアライメントされるときに同軸検出経路を形成するよう配置される請 求項22記載の小型化カラム。 27.さらに、支持体外面の上部に配置されかつ第1及び第2のアパチャーを覆 っている第1及び第2の透明シートを包含し、これにより、分光光度の諸検出手 段を前記透明シートを介して試料にインタフェースさせることによって分離区画 を通過している試料を分析できることを特徴とする請求項26記載の小型化カラ ム。 28.さらに、それぞれ、第1及び第2のアパチャーにインタフェースされかつ 分離区画に連絡している第1及び第2の導光手段を包含する請求項26記載の小 型化カラム。 29.支持体の内表面にレーザ切削され、かつ分離区画に連絡している別の検出 手段を包含する請求項26、27又は28の何れかに記載の小型化カラム。 30.その別の検出手段が、第1の支持体半分の内表面にレーザ切削された溝を 含む請求項29記載の小型化カラム。 31.さらに、その別の検出手段内部に配置されかつ分離区画に連絡している導 光手段を包含する請求項30記載の小型化カラム。 32.その別の検出手段が、第1及び第2の支持体半分の内表面にレーザ切削さ れた一組の相補的溝を包含し、前記溝は分離区画と連絡しかつ各溝が相手の鏡像 を与えるよう配置され、これにより、前記溝は、両支持体半分の内表面が互いに 突合せ対向状態でアライメントされるときにさらに別の検出経路を形成すること を特徴とする請求項29記載の小型化カラム。 33.その別の検出手段が、第1及び第2の支持体半分の内表面にレーザ切削さ れた相補的溝の第1及び第2の組を包含し、前記溝は分離区画と連絡しかつ各そ れぞれ相補的な一組の溝が他の溝の鏡像を与えるよう配置され、これにより、前 記溝の組は、両支持体半分の内表面が互いに突合せ対向状態でアライメントされ るときにさらに別の検出経路を形成することを特徴とする請求項29記載の小型 化カラム。 34.相補的溝の第1及び第2の組が、さらに互いに対向して配置されて連続的 検出経路を形成する請求項33記載の小型化カラム。 35.それぞれ、第1及び第2のアパチャーにインタフェースされかつ分離区画 に連絡している第1及び第2の導光手段と、別の検出手段内に配置されかつ分離 区画に連絡している第3の導光手段をさらに包含する請求項32記載の小型化カ ラム。 36.それぞれ、第1及び第2のアパチャーにインタフェースされかつ分離区画 に連絡している第1及び第2の導光手段と、別の検出手段内に配置されかつ分離 区画に連絡している第3及び第4の導光手段をさらに包含する請求項34記載の 小型化カラム。 37.レーザ切削されたマイクロチャネルは、分離区画が形成される以前に表面 処理にかけられ、かつ該表面処理が、レーザ切削されたマイクロチャネルの内表 面に対する選択種の化学結合もしくは吸着、又はその上への選択された材料の薄 膜堆積から成ることを特徴とする請求項1記載の小型化カラム。 38.レーザ切削されたマイクロチャネル群は、分離区画群が形成される以前に 表面処理にかけられ、かつ該表面処理が、レーザ切削されたマイクロチャネル群 の内表面に対する選択種の化学結合もしくは吸着又はその上への選択された材料 の薄膜堆積から成ることを特徴とする請求項13記載の小型化カラム。 39.レーザ切削されたマイクロチャネル群は、分離区画が形成される以前に表 面処理にかけられ、かつ該表面処理が、レーザ切削されたマイクロチャネル群の 内表面に対する選択種の化学結合もしくは吸着又はその上への選択された材料の 薄膜堆積から成ることを特徴とする請求項20記載の小型化カラム。 40.第1及び第2の実質的に平坦な対向表面を有し、第1の平坦表面にレーザ 切削されたマイクロチャネルを有する支持体と; 第1の平坦表面の上方に配置され、細長い分離区画を定めるマイクロチャネル との組み合わされるカバー板と; 分離区画を通して外部源からの流体の通過を可能にする、分離区画と連絡する 少なくとも1つの入口ポート及び少なくとも1つの出口ポートと; 分離区画に隣接して配置され、分離区画を通過する試料の電気特性の変化の検 出を可能にする複数の連絡経路と; を含んで成る小型化カラムデバイス。 41.第1及び第2の連絡経路を含んで成り、かつ第1の連絡経路が分離区画の 第1の側面に隣接して配置され、第2の連絡経路が分離区画の第2の側面に隣接 して配置されかつ第1の連絡経路に対向して位置決めされることを特徴とする請 求項40記載の小型化カラムデバイス。 42.複数の連絡経路が、分離区画の第1の側面に沿う長手方向に互いに間隔を 置いた関係で配置された少なくとも第1及び第2の連絡経路から成る請求項40 記載の小型化カラムデバイス。 43.複数の連絡経路が、分離区画の周りに同軸関係で配置された第1のコイル と、分離区画の周りに同軸関係でかつ第1のコイルと間隔を置いた関係で配置さ れた第2のコイルとを包含する請求項40記載の小型化カラムデバイス。 44.第1の連絡経路が分離区画の第1の側面に隣接して配置され、第2の連絡 経路が分離区画の第2の側面に隣接して配置されかつ第1の連絡経路に対向して 位置決めされる、第1及び第2の連絡経路をさらに包含する請求項5、14又は 26の何れかに記載の小型化カラム。 45.分離区画の第1の側面に沿う長手方向に互いに間隔を置いた関係で配置さ れた第1及び第2の連絡経路をさらに包含する請求項5、14又は26の何れか に記載の小型化カラム。 46.分離区画の周りに同軸関係で配置された第1のコイルと、分離区画の周り に同軸関係でかつ第1のコイルと間隔を置いた関係で配置された第2のコイルと をさらに包含する請求項5、14又は26の何れかに記載の小型化カラムデバイ ス。 47.第1及び第2の連絡経路が光学的検出経路に隣接して配置される請求項4 4記載の小型化カラム。 48.第1及び第2の連絡経路がコンジット手段に隣接して配置される請求項4 5記載の小型化カラム。 49.第1及び第2のコイルが第1の検出手段に隣接して配置される請求項46 記載の小型化カラム。 50.(a)第1及び第2の構成要素半分を有しかつ実質的に平坦な内表面を有 する支持体を設け; (b)(i)第1の支持体半分の内表面に第1のマイクロチャネルをレーザ切削 し;(ii)第2の支持体半分の内表面に第2のマイクロチャネルをレーザ切削 し、かつ第2のマイクロチャネルを第1のマイクロチャネルの鏡像を与えるよう 配置して、その後で互いに突合せ対向する状態で支持体の両半分の内表面をアラ イメントすることにより細長い孔が定められるようにして、支持体に区画を形成 し; (c)支持体の少なくとも1つの外表面から伸びて少なくとも1つのマイクロチ ャネルと連絡し、これにより、その中を通る液体の通過を可能にする複数のアパ チャーをレーザ切削することにより、該区画と外部の関連した流体収容装置との 間で流体の連絡を可能にする複数のポートを支持体に作り込み; (d)第1及び第2の構成要素半分を通した別のアパチャー群をレーザ切削する ことにより支持体に検出手段を形成して、アパチャー群が該区画と連絡するよう にし; (e)互いに突合せ対向状態で支持体の両半分をアライニングして、小型化カラ ムデバイスを与えるようマイクロチャネル群、ポート群及び検出手段をアライニ ングする; 各ステップを含んで成る小型化カラムデバイスを形成する方法。 51.ヒンジを定めるため支持体に一列の間隔を置いたミシン目をレーザ切削し て、これにより、支持体を前記ヒンジの回りで折り曲げ互いの軸を正確に一致さ せて第1及び第2の構成要素半分を設定できるように、支持体に折曲げ手段を設 けるステップをさらに包含する請求項50記載の方法。 52.支持体に穴群をレーザ切削することにより、前記穴群は同軸アライメント によって支持体半分の正確なアライメントが可能となって細長い孔を正確に定め ることができるよう配置されることで第1及び第2の支持体にマイクロアライメ ント手段を形成するステップをさらに包含する請求項51記載の方法。 53.支持体半分に対応する構造体を形成して、該構造体が第1の支持体半分の 上に配置された複数の凹部と第2の支持体半分に配置された複数の突起から成り 、対応する構造体のアライメントによって両支持体半分の正確なアライメントが 可能となって正確に細長い孔を定めることができるよう、前記突起が凹部とかみ 合うように支持体半分にマイクロアライメント手段を設けるステップをさらに包 含する請求項51記載の方法。 54.マイクロチャネル群が支持体半分の表面にレーザ切削された後及び分離区 画が形成される以前に、第1及び第2のマイクロチャネル群を、レーザ切削した マイクロチャネル群の内表面に対する選択した種の化学結合もしくは吸着又はそ の上への選択された材料の薄膜堆積から成る表面処理にかけるステップをさらに 包含する請求項50記載の方法。 55.熱接着性ポリイミドの第2の薄層と共押出しされたポリイミドの第1の層 から作られたラミネートから成る支持体を設け; 熱積層を用いて第1及び第2の支持体半分を熱シールして、実質的に支持体と同 一の物理的、化学的特性を有する接合が形成されるようにする; ステップをさらに包含する請求項50記載の方法。 56.(a)実質的に平坦な内表面を有する親支持体を用意し; (b)(i)マスター支持体の内表面にマイクロチャネルを形成し;そして(i i)マスター支持体にマイクロチャネルと流体連絡する複数のアパチャーを形成 することにより、小型化カラムデバイスのマスターコピーを形成し; (c)(i)マスターコピーの内表面を第1の金属の層でコーティングし;(i i)第2の金属の層をその上に堆積して内表面に形成されたマイクロチャネルと アパチャー群に充填し;そして(iii)型挿入物が提供されるようマスター支 持体から型挿入物を分離することにより、型挿入物を作り; (d)適当な高分子又はセラミック基板で型挿入物からマスターコピーの多重複 製を射出成形する; 各ステップを含んで成る小型化カラムデバイスの多重複製を作る方法。 57.小型化カラムデバイスのマスターコピーがレーザ切削法を使って作られる 請求項56記載の方法。 58.小型化カラムデバイスのマスターコピーがLIGAプロセスを使って作ら れる請求項56記載の方法。 59.(a)実質的に平坦な内表面をもった第1及び第2の半分部分を有するマ スター支持体を用意し; (b)(i)マスター支持体の第1の半分の内表面に第1のマイクロチャネルを 形成し;(ii)マスター支持体の第2の半分の内表面に第2のマイクロチャネ ルを形成し、ここで第2のマイクロチャネルが第1のマイクロチャネルの鏡像を 与えるよう配置し;そして(iii)マイクロチャネルと流体連絡する複数のア パチャーを形成することにより、小型化カラムデバイスのマスターコピーを形成 し; (c)(i)マスターコピーの内表面を第1の金属の層でコーティングし;(i i)第2の金属の層をその上に堆積して内表面に形成されたマイクロチャネルと アパチャー群に充填し;そして(iii)型挿入物が提供されるようマスター支 持体から型挿入物を分離することによって、型挿入物を作り; (d)適当な高分子又はセラミック基板で型挿入物からマスターコピーの多重複 製を射出成形する; 各ステップを含んで成る小型化カラムデバイスの多重複製を作る方法。 60.小型化カラムデバイスのマスターコピーがレーザ切削法を使って作られる 請求項59記載の方法。 61.小型化カラムデバイスのマスターコピーがLIGAプロセスを使って作ら れる請求項59記載の方法。
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US08/482,245 US5658413A (en) | 1994-10-19 | 1995-06-07 | Miniaturized planar columns in novel support media for liquid phase analysis |
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US5641400A (en) * | 1994-10-19 | 1997-06-24 | Hewlett-Packard Company | Use of temperature control devices in miniaturized planar column devices and miniaturized total analysis systems |
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1995
- 1995-06-07 US US08/482,245 patent/US5658413A/en not_active Expired - Lifetime
- 1995-10-16 DE DE69535176T patent/DE69535176T2/de not_active Expired - Lifetime
- 1995-10-16 WO PCT/US1995/013365 patent/WO1996012546A1/en active IP Right Grant
- 1995-10-16 US US08/656,281 patent/US6033628A/en not_active Expired - Lifetime
- 1995-10-16 EP EP95937504A patent/EP0734282B1/en not_active Expired - Lifetime
- 1995-10-19 WO PCT/US1995/013258 patent/WO1996012545A1/en active IP Right Grant
- 1995-10-19 JP JP51401696A patent/JP3631758B2/ja not_active Expired - Fee Related
- 1995-10-19 EP EP95937465A patent/EP0734281B1/en not_active Expired - Lifetime
- 1995-10-19 DE DE69535259T patent/DE69535259T2/de not_active Expired - Lifetime
-
1997
- 1997-03-27 US US08/824,620 patent/US5882571A/en not_active Expired - Lifetime
- 1997-08-18 US US08/914,297 patent/US5804022A/en not_active Expired - Lifetime
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1999
- 1999-02-11 US US09/249,531 patent/US6093362A/en not_active Expired - Lifetime
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2000
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH08240576A (ja) * | 1995-01-23 | 1996-09-17 | Hewlett Packard Co <Hp> | プレーナ・マニホルド組立体及び分析機器 |
JP2000289166A (ja) * | 1999-04-09 | 2000-10-17 | E I Du Pont De Nemours & Co | 封入された構造を含む一体式ポリイミド積層体および該積層体の製造方法 |
JP2005517959A (ja) * | 2002-02-21 | 2005-06-16 | コミツサリア タ レネルジー アトミーク | 生物又は生化学分析マイクロシステム用のコンポーネント |
JP4727148B2 (ja) * | 2002-02-21 | 2011-07-20 | コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ | 生物又は生化学分析マイクロシステム用のコンポーネント |
JP2010517208A (ja) * | 2006-10-31 | 2010-05-20 | コーニング インコーポレイテッド | マイクロ加工された電解質シート、これを利用する燃料電池デバイス、および燃料電池デバイスを作製するマイクロ加工方法 |
JP2011045981A (ja) * | 2009-08-28 | 2011-03-10 | Ritsumeikan | Mems、及びその製造方法 |
WO2016063950A1 (ja) * | 2014-10-24 | 2016-04-28 | 京都府公立大学法人 | 検体用ホルダ |
JP2016085108A (ja) * | 2014-10-24 | 2016-05-19 | 京都府公立大学法人 | 検体用ホルダ |
Also Published As
Publication number | Publication date |
---|---|
EP0734282B1 (en) | 2006-08-16 |
EP0734281A4 (en) | 1996-11-20 |
DE69535259D1 (de) | 2006-11-23 |
JP3631758B2 (ja) | 2005-03-23 |
US5882571A (en) | 1999-03-16 |
EP0734281B1 (en) | 2006-10-11 |
DE69535259T2 (de) | 2007-01-25 |
EP0734282A4 (en) | 1996-11-20 |
WO1996012546A1 (en) | 1996-05-02 |
DE69535176T2 (de) | 2007-08-23 |
US5804022A (en) | 1998-09-08 |
US6093362A (en) | 2000-07-25 |
EP0734282A1 (en) | 1996-10-02 |
US6033628A (en) | 2000-03-07 |
DE69535176D1 (de) | 2006-09-28 |
US6264892B1 (en) | 2001-07-24 |
EP0734281A1 (en) | 1996-10-02 |
US5658413A (en) | 1997-08-19 |
WO1996012545A1 (en) | 1996-05-02 |
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