JPH09320996A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPH09320996A
JPH09320996A JP9035078A JP3507897A JPH09320996A JP H09320996 A JPH09320996 A JP H09320996A JP 9035078 A JP9035078 A JP 9035078A JP 3507897 A JP3507897 A JP 3507897A JP H09320996 A JPH09320996 A JP H09320996A
Authority
JP
Japan
Prior art keywords
dicing
groove
semiconductor
pedestal
adhesive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9035078A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09320996A5 (https=
Inventor
Minoru Murata
稔 村田
Kenichi Ao
青　　建一
Yasutoshi Suzuki
康利 鈴木
Seiichiro Ishio
誠一郎 石王
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP9035078A priority Critical patent/JPH09320996A/ja
Priority to US08/825,456 priority patent/US5998234A/en
Publication of JPH09320996A publication Critical patent/JPH09320996A/ja
Publication of JPH09320996A5 publication Critical patent/JPH09320996A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Pressure Sensors (AREA)
  • Dicing (AREA)
JP9035078A 1996-03-29 1997-02-19 半導体装置の製造方法 Pending JPH09320996A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9035078A JPH09320996A (ja) 1996-03-29 1997-02-19 半導体装置の製造方法
US08/825,456 US5998234A (en) 1996-03-29 1997-03-28 Method of producing semiconductor device by dicing

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8-76316 1996-03-29
JP7631696 1996-03-29
JP9035078A JPH09320996A (ja) 1996-03-29 1997-02-19 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH09320996A true JPH09320996A (ja) 1997-12-12
JPH09320996A5 JPH09320996A5 (https=) 2004-07-15

Family

ID=26373992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9035078A Pending JPH09320996A (ja) 1996-03-29 1997-02-19 半導体装置の製造方法

Country Status (2)

Country Link
US (1) US5998234A (https=)
JP (1) JPH09320996A (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006078016A1 (ja) * 2005-01-24 2006-07-27 Sumitomo Electric Industries, Limited 複数のセンサチップの連結体及びその製造方法
WO2009078440A1 (ja) * 2007-12-18 2009-06-25 The Furukawa Electric Co., Ltd. ウエハ貼着用粘着シートおよびウエハの加工方法
JP2009170886A (ja) * 2007-12-18 2009-07-30 Furukawa Electric Co Ltd:The ウエハ貼着用貼着シートおよびウエハの加工方法
JP2009188428A (ja) * 2009-05-25 2009-08-20 Panasonic Corp 半導体基板
KR101158829B1 (ko) * 2004-08-25 2012-06-27 오끼 덴끼 고오교 가부시끼가이샤 반도체장치의 개편화 방법
WO2015002064A1 (ja) * 2013-07-01 2015-01-08 富士ゼロックス株式会社 半導体片の製造方法、半導体片を含む回路基板および画像形成装置
JP2017120197A (ja) * 2015-12-28 2017-07-06 アズビル株式会社 熱式流量センサ
US9709377B2 (en) 2012-04-23 2017-07-18 Hitachi, Ltd. Strain sensor chip mounting structure, strain sensor chip and method of manufacturing a strain sensor chip mounting structure

Families Citing this family (28)

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US6387778B1 (en) * 2000-02-11 2002-05-14 Seagate Technology Llc Breakable tethers for microelectromechanical system devices utilizing reactive ion etching lag
DE10101737A1 (de) * 2001-01-16 2002-07-25 Osram Opto Semiconductors Gmbh Verfahren zum Vereinzeln von Wafern in Chips
EP1270504B1 (de) * 2001-06-22 2004-05-26 Nanoworld AG Halbleiterbauelemente in einem Waferverbund
JP2003197569A (ja) * 2001-12-28 2003-07-11 Disco Abrasive Syst Ltd 半導体チップの製造方法
US6911155B2 (en) * 2002-01-31 2005-06-28 Hewlett-Packard Development Company, L.P. Methods and systems for forming slots in a substrate
US7051426B2 (en) * 2002-01-31 2006-05-30 Hewlett-Packard Development Company, L.P. Method making a cutting disk into of a substrate
US20030140496A1 (en) * 2002-01-31 2003-07-31 Shen Buswell Methods and systems for forming slots in a semiconductor substrate
US6806552B2 (en) * 2002-02-21 2004-10-19 Altera, Corp. Integrated inductive circuits
MXPA04008789A (es) 2002-03-11 2004-11-26 Becton Dickinson Co Sistema y metodo para la fabricacion de cuchillas quirurgicas.
US7387742B2 (en) 2002-03-11 2008-06-17 Becton, Dickinson And Company Silicon blades for surgical and non-surgical use
JP2003338587A (ja) * 2002-05-21 2003-11-28 Hitachi Ltd 半導体装置及びその製造方法
US6872599B1 (en) * 2002-12-10 2005-03-29 National Semiconductor Corporation Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)
US20050036004A1 (en) * 2003-08-13 2005-02-17 Barbara Horn Methods and systems for conditioning slotted substrates
EP1662970A2 (en) 2003-09-17 2006-06-07 Becton, Dickinson and Company System and method for creating linear and non-linear trenches in silicon and other crystalline materials with a router
US7129114B2 (en) * 2004-03-10 2006-10-31 Micron Technology, Inc. Methods relating to singulating semiconductor wafers and wafer scale assemblies
US7396484B2 (en) 2004-04-30 2008-07-08 Becton, Dickinson And Company Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries
JP2006108343A (ja) * 2004-10-05 2006-04-20 Seiko Epson Corp 半導体装置及びその製造方法
JP4372115B2 (ja) * 2006-05-12 2009-11-25 パナソニック株式会社 半導体装置の製造方法、および半導体モジュールの製造方法
US7884445B2 (en) * 2006-11-22 2011-02-08 Applied Nanostructures, Inc. Semiconductor device in wafer assembly
JP5276035B2 (ja) * 2009-04-13 2013-08-28 日本電波工業株式会社 圧電デバイスの製造方法及び圧電デバイス
US8757897B2 (en) 2012-01-10 2014-06-24 Invensas Corporation Optical interposer
US9323010B2 (en) 2012-01-10 2016-04-26 Invensas Corporation Structures formed using monocrystalline silicon and/or other materials for optical and other applications
US9346273B2 (en) * 2013-05-31 2016-05-24 Stmicroelectronics, Inc. Methods of making an inkjet print head by sawing discontinuous slotted recesses
DE102015104410B4 (de) * 2015-03-24 2018-09-13 Tdk-Micronas Gmbh Drucksensor
EP3171400A1 (en) * 2015-11-20 2017-05-24 Nexperia B.V. Semiconductor device and method of making a semiconductor device
US10595951B2 (en) * 2016-08-15 2020-03-24 Covidien Lp Force sensor for surgical devices
CN112549331B (zh) * 2019-09-10 2024-03-15 苏州阿特斯阳光电力科技有限公司 方硅锭及其制备方法、硅片及其制备方法
CN116344446A (zh) * 2023-04-10 2023-06-27 合肥矽迈微电子科技有限公司 一种芯片封装体分离切割方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51149784A (en) * 1975-06-17 1976-12-22 Matsushita Electric Ind Co Ltd Solid state light emission device
JPS604010A (ja) * 1983-06-23 1985-01-10 日本電気株式会社 半導体素子の分割方法
US5196378A (en) * 1987-12-17 1993-03-23 Texas Instruments Incorporated Method of fabricating an integrated circuit having active regions near a die edge
JPH02305450A (ja) * 1989-05-19 1990-12-19 Mitsubishi Electric Corp 加速度センサの製造方法
US5000811A (en) * 1989-11-22 1991-03-19 Xerox Corporation Precision buttable subunits via dicing
JPH0485750A (ja) * 1990-07-28 1992-03-18 Sony Corp 磁気再生装置
JPH04107155A (ja) * 1990-08-28 1992-04-08 Alps Electric Co Ltd サーマルヘッドの製造方法
US5421213A (en) * 1990-10-12 1995-06-06 Okada; Kazuhiro Multi-dimensional force detector
US5219796A (en) * 1991-11-04 1993-06-15 Xerox Corporation Method of fabricating image sensor dies and the like for use in assembling arrays
US5421956A (en) * 1991-11-20 1995-06-06 Nippondenso Co., Ltd. Method of fabricating an integrated pressure sensor

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101158829B1 (ko) * 2004-08-25 2012-06-27 오끼 덴끼 고오교 가부시끼가이샤 반도체장치의 개편화 방법
JP2006201126A (ja) * 2005-01-24 2006-08-03 Sumitomo Electric Ind Ltd センサチップ連結体及びその製造方法
WO2006078016A1 (ja) * 2005-01-24 2006-07-27 Sumitomo Electric Industries, Limited 複数のセンサチップの連結体及びその製造方法
WO2009078440A1 (ja) * 2007-12-18 2009-06-25 The Furukawa Electric Co., Ltd. ウエハ貼着用粘着シートおよびウエハの加工方法
JP2009170886A (ja) * 2007-12-18 2009-07-30 Furukawa Electric Co Ltd:The ウエハ貼着用貼着シートおよびウエハの加工方法
JP2009188428A (ja) * 2009-05-25 2009-08-20 Panasonic Corp 半導体基板
US9709377B2 (en) 2012-04-23 2017-07-18 Hitachi, Ltd. Strain sensor chip mounting structure, strain sensor chip and method of manufacturing a strain sensor chip mounting structure
WO2015002064A1 (ja) * 2013-07-01 2015-01-08 富士ゼロックス株式会社 半導体片の製造方法、半導体片を含む回路基板および画像形成装置
JP2015029058A (ja) * 2013-07-01 2015-02-12 富士ゼロックス株式会社 半導体片の製造方法、半導体片を含む回路基板および画像形成装置
JP2015029060A (ja) * 2013-07-01 2015-02-12 富士ゼロックス株式会社 半導体片の製造方法、半導体片を含む回路基板および画像形成装置
US9455173B2 (en) 2013-07-01 2016-09-27 Fuji Xerox Co., Ltd. Semiconductor piece manufacturing method
US9673080B2 (en) 2013-07-01 2017-06-06 Fuji Xerox Co., Ltd. Semiconductor piece manufacturing method
JP2015029059A (ja) * 2013-07-01 2015-02-12 富士ゼロックス株式会社 半導体片の製造方法、半導体片を含む回路基板および画像形成装置
JP2017120197A (ja) * 2015-12-28 2017-07-06 アズビル株式会社 熱式流量センサ

Also Published As

Publication number Publication date
US5998234A (en) 1999-12-07

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