JPH09201763A5 - - Google Patents

Info

Publication number
JPH09201763A5
JPH09201763A5 JP1997010369A JP1036997A JPH09201763A5 JP H09201763 A5 JPH09201763 A5 JP H09201763A5 JP 1997010369 A JP1997010369 A JP 1997010369A JP 1036997 A JP1036997 A JP 1036997A JP H09201763 A5 JPH09201763 A5 JP H09201763A5
Authority
JP
Japan
Prior art keywords
wafer
retainer
housing
fluid
polishing head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997010369A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09201763A (ja
Filing date
Publication date
Application filed filed Critical
Publication of JPH09201763A publication Critical patent/JPH09201763A/ja
Publication of JPH09201763A5 publication Critical patent/JPH09201763A5/ja
Pending legal-status Critical Current

Links

JP1036997A 1996-01-24 1997-01-23 ウェーハ研摩ヘッド Pending JPH09201763A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59086196A 1996-01-24 1996-01-24
US08/590861 1996-01-24

Publications (2)

Publication Number Publication Date
JPH09201763A JPH09201763A (ja) 1997-08-05
JPH09201763A5 true JPH09201763A5 (enExample) 2005-01-27

Family

ID=24364029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1036997A Pending JPH09201763A (ja) 1996-01-24 1997-01-23 ウェーハ研摩ヘッド

Country Status (5)

Country Link
US (1) US5803799A (enExample)
EP (1) EP0786310B1 (enExample)
JP (1) JPH09201763A (enExample)
AT (1) ATE228915T1 (enExample)
DE (1) DE69717510T2 (enExample)

Families Citing this family (96)

* Cited by examiner, † Cited by third party
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JP3006568B2 (ja) * 1997-12-04 2000-02-07 日本電気株式会社 ウエハ研磨装置および研磨方法
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US6231428B1 (en) * 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6113468A (en) * 1999-04-06 2000-09-05 Speedfam-Ipec Corporation Wafer planarization carrier having floating pad load ring
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US6855043B1 (en) 1999-07-09 2005-02-15 Applied Materials, Inc. Carrier head with a modified flexible membrane
US6241593B1 (en) * 1999-07-09 2001-06-05 Applied Materials, Inc. Carrier head with pressurizable bladder
US6494774B1 (en) 1999-07-09 2002-12-17 Applied Materials, Inc. Carrier head with pressure transfer mechanism
EP1117506B1 (en) * 1999-07-28 2005-07-13 Ebara Corporation Cmp polishing head with three chambers and method for using the same
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US6375549B1 (en) 2000-03-17 2002-04-23 Motorola, Inc. Polishing head for wafer, and method for polishing
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US6361419B1 (en) 2000-03-27 2002-03-26 Applied Materials, Inc. Carrier head with controllable edge pressure
US6666756B1 (en) * 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
US7140956B1 (en) 2000-03-31 2006-11-28 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6390905B1 (en) * 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US6354928B1 (en) * 2000-04-21 2002-03-12 Agere Systems Guardian Corp. Polishing apparatus with carrier ring and carrier head employing like polarities
US6436828B1 (en) 2000-05-04 2002-08-20 Applied Materials, Inc. Chemical mechanical polishing using magnetic force
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
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US6443815B1 (en) * 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
JP4818505B2 (ja) * 2000-10-19 2011-11-16 不二越機械工業株式会社 ウェーハ研磨ヘッド
US6447368B1 (en) 2000-11-20 2002-09-10 Speedfam-Ipec Corporation Carriers with concentric balloons supporting a diaphragm
US6468131B1 (en) 2000-11-28 2002-10-22 Speedfam-Ipec Corporation Method to mathematically characterize a multizone carrier
US6910949B1 (en) 2001-04-25 2005-06-28 Lam Research Corporation Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers
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KR100939096B1 (ko) * 2001-05-29 2010-01-28 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치, 폴리싱방법 및 기판캐리어 시스템
US6893327B2 (en) * 2001-06-04 2005-05-17 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
KR100421445B1 (ko) * 2001-09-28 2004-03-09 삼성전자주식회사 연마 헤드 조립 방법 및 연마 헤드 조립 시의 공기 누설검사장치
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US6872130B1 (en) 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
US20030182015A1 (en) * 2002-03-19 2003-09-25 Domaille Michael D. Polisher
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US7001245B2 (en) * 2003-03-07 2006-02-21 Applied Materials Inc. Substrate carrier with a textured membrane
US20060180486A1 (en) * 2003-04-21 2006-08-17 Bennett David W Modular panel and storage system for flat items such as media discs and holders therefor
KR100600231B1 (ko) * 2003-07-12 2006-07-13 동부일렉트로닉스 주식회사 씨엠피 폴리싱 헤드 및 그 동작방법
US7255771B2 (en) 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
US6935938B1 (en) 2004-03-31 2005-08-30 Lam Research Corporation Multiple-conditioning member device for chemical mechanical planarization conditioning
CN105904335B (zh) 2004-11-01 2019-04-30 株式会社荏原制作所 抛光设备
US7101272B2 (en) * 2005-01-15 2006-09-05 Applied Materials, Inc. Carrier head for thermal drift compensation
JP4814677B2 (ja) * 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置
WO2009120641A2 (en) * 2008-03-25 2009-10-01 Applied Materials, Inc. Improved carrier head membrane
US7749052B2 (en) * 2008-09-08 2010-07-06 Applied Materials, Inc. Carrier head using flexure restraints for retaining ring alignment
US10160093B2 (en) 2008-12-12 2018-12-25 Applied Materials, Inc. Carrier head membrane roughness to control polishing rate

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