JPH09201763A - ウェーハ研摩ヘッド - Google Patents

ウェーハ研摩ヘッド

Info

Publication number
JPH09201763A
JPH09201763A JP1036997A JP1036997A JPH09201763A JP H09201763 A JPH09201763 A JP H09201763A JP 1036997 A JP1036997 A JP 1036997A JP 1036997 A JP1036997 A JP 1036997A JP H09201763 A JPH09201763 A JP H09201763A
Authority
JP
Japan
Prior art keywords
wafer
retainer
fluid
housing
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1036997A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09201763A5 (enExample
Inventor
Konstantin Volodarsky
ヴォロダースキー コンスタンチン
David E Weldon
エドウィン ウェルドン ディヴィッド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ontrak Systems Inc
Original Assignee
Ontrak Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ontrak Systems Inc filed Critical Ontrak Systems Inc
Publication of JPH09201763A publication Critical patent/JPH09201763A/ja
Publication of JPH09201763A5 publication Critical patent/JPH09201763A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP1036997A 1996-01-24 1997-01-23 ウェーハ研摩ヘッド Pending JPH09201763A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59086196A 1996-01-24 1996-01-24
US08/590861 1996-01-24

Publications (2)

Publication Number Publication Date
JPH09201763A true JPH09201763A (ja) 1997-08-05
JPH09201763A5 JPH09201763A5 (enExample) 2005-01-27

Family

ID=24364029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1036997A Pending JPH09201763A (ja) 1996-01-24 1997-01-23 ウェーハ研摩ヘッド

Country Status (5)

Country Link
US (1) US5803799A (enExample)
EP (1) EP0786310B1 (enExample)
JP (1) JPH09201763A (enExample)
AT (1) ATE228915T1 (enExample)
DE (1) DE69717510T2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6033292A (en) * 1997-05-28 2000-03-07 Tokyo Seimitsu Co., Ltd. Wafer polishing apparatus with retainer ring
JP2000202762A (ja) * 1998-12-30 2000-07-25 Applied Materials Inc 化学機械研磨の制御可能圧力及びローディング領域を有するキャリヤヘッド
JP2002134447A (ja) * 2000-10-19 2002-05-10 Fujikoshi Mach Corp ウェーハ研磨ヘッド
JP2003529457A (ja) * 2000-03-31 2003-10-07 ラム リサーチ コーポレイション ウェーハキャリヤヘッド組立体

Families Citing this family (92)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3183388B2 (ja) * 1996-07-12 2001-07-09 株式会社東京精密 半導体ウェーハ研磨装置
US6183354B1 (en) 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6146259A (en) 1996-11-08 2000-11-14 Applied Materials, Inc. Carrier head with local pressure control for a chemical mechanical polishing apparatus
JP3705670B2 (ja) * 1997-02-19 2005-10-12 株式会社荏原製作所 ポリッシング装置及び方法
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US6244946B1 (en) * 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
SG66487A1 (en) 1997-07-11 1999-07-20 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
US5916015A (en) * 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
US6113479A (en) * 1997-07-25 2000-09-05 Obsidian, Inc. Wafer carrier for chemical mechanical planarization polishing
TW434096B (en) * 1997-08-11 2001-05-16 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
TW434095B (en) * 1997-08-11 2001-05-16 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
US5989103A (en) * 1997-09-19 1999-11-23 Applied Materials, Inc. Magnetic carrier head for chemical mechanical polishing
US6080040A (en) * 1997-11-05 2000-06-27 Aplex Group Wafer carrier head with inflatable bladder and attack angle control for polishing
JP3006568B2 (ja) * 1997-12-04 2000-02-07 日本電気株式会社 ウエハ研磨装置および研磨方法
US6068548A (en) * 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US6531397B1 (en) 1998-01-09 2003-03-11 Lsi Logic Corporation Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
JPH11285966A (ja) * 1998-04-02 1999-10-19 Speedfam-Ipec Co Ltd キャリア及びｃｍｐ装置
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
US6113480A (en) * 1998-06-02 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus for polishing semiconductor wafers and method of testing same
US6251215B1 (en) 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US6159079A (en) 1998-09-08 2000-12-12 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6210255B1 (en) 1998-09-08 2001-04-03 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
SG95604A1 (en) * 1998-09-25 2003-04-23 Tdk Corp Apparatus and method for processing slider, load applying apparatus and auxiliary device for processing slider
US6347979B1 (en) * 1998-09-29 2002-02-19 Vsli Technology, Inc. Slurry dispensing carrier ring
JP2000187832A (ja) * 1998-10-05 2000-07-04 Exclusive Design Co Inc 磁気ディスク及び他の基板を自動研磨する方法及び装置
US6244942B1 (en) 1998-10-09 2001-06-12 Applied Materials, Inc. Carrier head with a flexible membrane and adjustable edge pressure
US6277014B1 (en) 1998-10-09 2001-08-21 Applied Materials, Inc. Carrier head with a flexible membrane for chemical mechanical polishing
US6132298A (en) * 1998-11-25 2000-10-17 Applied Materials, Inc. Carrier head with edge control for chemical mechanical polishing
US6220930B1 (en) * 1998-11-03 2001-04-24 United Microelectronics Corp. Wafer polishing head
US6165058A (en) * 1998-12-09 2000-12-26 Applied Materials, Inc. Carrier head for chemical mechanical polishing
US6422927B1 (en) * 1998-12-30 2002-07-23 Applied Materials, Inc. Carrier head with controllable pressure and loading area for chemical mechanical polishing
US6162116A (en) * 1999-01-23 2000-12-19 Applied Materials, Inc. Carrier head for chemical mechanical polishing
US6179709B1 (en) * 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
TW436378B (en) * 1999-02-05 2001-05-28 Mitsubishi Materials Corp Wafer polishing apparatus and method for making a wafer
US6645050B1 (en) * 1999-02-25 2003-11-11 Applied Materials, Inc. Multimode substrate carrier
US6368189B1 (en) 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6231428B1 (en) * 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6113468A (en) * 1999-04-06 2000-09-05 Speedfam-Ipec Corporation Wafer planarization carrier having floating pad load ring
US6431968B1 (en) 1999-04-22 2002-08-13 Applied Materials, Inc. Carrier head with a compressible film
WO2000078504A1 (en) * 1999-06-19 2000-12-28 Speedfam-Ipec Corporation Method and apparatus for increasing the lifetime of a workpiece retaining structure and conditioning a polishing surface
US6224472B1 (en) * 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing
US6358121B1 (en) 1999-07-09 2002-03-19 Applied Materials, Inc. Carrier head with a flexible membrane and an edge load ring
US6855043B1 (en) 1999-07-09 2005-02-15 Applied Materials, Inc. Carrier head with a modified flexible membrane
US6241593B1 (en) * 1999-07-09 2001-06-05 Applied Materials, Inc. Carrier head with pressurizable bladder
US6494774B1 (en) 1999-07-09 2002-12-17 Applied Materials, Inc. Carrier head with pressure transfer mechanism
EP1117506B1 (en) * 1999-07-28 2005-07-13 Ebara Corporation Cmp polishing head with three chambers and method for using the same
US6663466B2 (en) 1999-11-17 2003-12-16 Applied Materials, Inc. Carrier head with a substrate detector
US6375549B1 (en) 2000-03-17 2002-04-23 Motorola, Inc. Polishing head for wafer, and method for polishing
US6450868B1 (en) 2000-03-27 2002-09-17 Applied Materials, Inc. Carrier head with multi-part flexible membrane
US6361419B1 (en) 2000-03-27 2002-03-26 Applied Materials, Inc. Carrier head with controllable edge pressure
US7140956B1 (en) 2000-03-31 2006-11-28 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6390905B1 (en) * 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US6354928B1 (en) * 2000-04-21 2002-03-12 Agere Systems Guardian Corp. Polishing apparatus with carrier ring and carrier head employing like polarities
US6436828B1 (en) 2000-05-04 2002-08-20 Applied Materials, Inc. Chemical mechanical polishing using magnetic force
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6409579B1 (en) * 2000-05-31 2002-06-25 Koninklijke Philips Electronics N.V. Method and apparatus for conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish
US6540592B1 (en) 2000-06-29 2003-04-01 Speedfam-Ipec Corporation Carrier head with reduced moment wear ring
US6447380B1 (en) 2000-06-30 2002-09-10 Lam Research Corporation Polishing apparatus and substrate retainer ring providing continuous slurry distribution
US6722965B2 (en) * 2000-07-11 2004-04-20 Applied Materials Inc. Carrier head with flexible membranes to provide controllable pressure and loading area
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
US6857945B1 (en) 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
US20040005842A1 (en) * 2000-07-25 2004-01-08 Chen Hung Chih Carrier head with flexible membrane
US6419567B1 (en) 2000-08-14 2002-07-16 Semiconductor 300 Gmbh & Co. Kg Retaining ring for chemical-mechanical polishing (CMP) head, polishing apparatus, slurry cycle system, and method
US6652357B1 (en) 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
US6443815B1 (en) * 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
US6447368B1 (en) 2000-11-20 2002-09-10 Speedfam-Ipec Corporation Carriers with concentric balloons supporting a diaphragm
US6468131B1 (en) 2000-11-28 2002-10-22 Speedfam-Ipec Corporation Method to mathematically characterize a multizone carrier
US6910949B1 (en) 2001-04-25 2005-06-28 Lam Research Corporation Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers
US6582277B2 (en) 2001-05-01 2003-06-24 Speedfam-Ipec Corporation Method for controlling a process in a multi-zonal apparatus
US6722942B1 (en) 2001-05-21 2004-04-20 Advanced Micro Devices, Inc. Chemical mechanical polishing with electrochemical control
KR100939096B1 (ko) * 2001-05-29 2010-01-28 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치, 폴리싱방법 및 기판캐리어 시스템
US6893327B2 (en) * 2001-06-04 2005-05-17 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
KR100421445B1 (ko) * 2001-09-28 2004-03-09 삼성전자주식회사 연마 헤드 조립 방법 및 연마 헤드 조립 시의 공기 누설검사장치
US6890249B1 (en) 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
US6872130B1 (en) 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
US20030182015A1 (en) * 2002-03-19 2003-09-25 Domaille Michael D. Polisher
US6689258B1 (en) 2002-04-30 2004-02-10 Advanced Micro Devices, Inc. Electrochemically generated reactants for chemical mechanical planarization
US6790123B2 (en) 2002-05-16 2004-09-14 Speedfam-Ipec Corporation Method for processing a work piece in a multi-zonal processing apparatus
WO2004033152A1 (en) * 2002-10-11 2004-04-22 Semplastics, L.L.C. Retaining ring for use on a carrier of a polishing apparatus
US7001245B2 (en) * 2003-03-07 2006-02-21 Applied Materials Inc. Substrate carrier with a textured membrane
US20060180486A1 (en) * 2003-04-21 2006-08-17 Bennett David W Modular panel and storage system for flat items such as media discs and holders therefor
KR100600231B1 (ko) * 2003-07-12 2006-07-13 동부일렉트로닉스 주식회사 씨엠피 폴리싱 헤드 및 그 동작방법
US7255771B2 (en) 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
US6935938B1 (en) 2004-03-31 2005-08-30 Lam Research Corporation Multiple-conditioning member device for chemical mechanical planarization conditioning
CN105904335B (zh) 2004-11-01 2019-04-30 株式会社荏原制作所 抛光设备
US7101272B2 (en) * 2005-01-15 2006-09-05 Applied Materials, Inc. Carrier head for thermal drift compensation
JP4814677B2 (ja) * 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置
WO2009120641A2 (en) * 2008-03-25 2009-10-01 Applied Materials, Inc. Improved carrier head membrane
US7749052B2 (en) * 2008-09-08 2010-07-06 Applied Materials, Inc. Carrier head using flexure restraints for retaining ring alignment
US10160093B2 (en) 2008-12-12 2018-12-25 Applied Materials, Inc. Carrier head membrane roughness to control polishing rate

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3579916A (en) * 1968-11-15 1971-05-25 Speedfam Corp Polishing machine
US3731435A (en) * 1971-02-09 1973-05-08 Speedfam Corp Polishing machine load plate
JPS55157473A (en) * 1979-05-22 1980-12-08 Nippon Telegr & Teleph Corp <Ntt> Polishing method
US4519168A (en) * 1979-09-18 1985-05-28 Speedfam Corporation Liquid waxless fixturing of microsize wafers
JPS59187456A (ja) * 1983-04-08 1984-10-24 Fujitsu Ltd 半導体基板の研摩方法
US5205082A (en) * 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5329732A (en) 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
DE69325756T2 (de) * 1992-09-24 2000-03-02 Ebara Corp., Tokio/Tokyo Poliergerät
JP3370112B2 (ja) * 1992-10-12 2003-01-27 不二越機械工業株式会社 ウエハーの研磨装置
US5398459A (en) * 1992-11-27 1995-03-21 Kabushiki Kaisha Toshiba Method and apparatus for polishing a workpiece
US5377451A (en) * 1993-02-23 1995-01-03 Memc Electronic Materials, Inc. Wafer polishing apparatus and method
US5329734A (en) 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate
US5443416A (en) * 1993-09-09 1995-08-22 Cybeq Systems Incorporated Rotary union for coupling fluids in a wafer polishing apparatus
US5423716A (en) * 1994-01-05 1995-06-13 Strasbaugh; Alan Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied
US5449316A (en) * 1994-01-05 1995-09-12 Strasbaugh; Alan Wafer carrier for film planarization
US5423558A (en) * 1994-03-24 1995-06-13 Ipec/Westech Systems, Inc. Semiconductor wafer carrier and method
JP3158934B2 (ja) * 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
JP3724869B2 (ja) * 1995-10-09 2005-12-07 株式会社荏原製作所 ポリッシング装置および方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6033292A (en) * 1997-05-28 2000-03-07 Tokyo Seimitsu Co., Ltd. Wafer polishing apparatus with retainer ring
US6196905B1 (en) 1997-05-28 2001-03-06 Tokyo Seimitsu Co., Ltd. Wafer polishing apparatus with retainer ring
JP2000202762A (ja) * 1998-12-30 2000-07-25 Applied Materials Inc 化学機械研磨の制御可能圧力及びローディング領域を有するキャリヤヘッド
JP2003529457A (ja) * 2000-03-31 2003-10-07 ラム リサーチ コーポレイション ウェーハキャリヤヘッド組立体
JP2002134447A (ja) * 2000-10-19 2002-05-10 Fujikoshi Mach Corp ウェーハ研磨ヘッド

Also Published As

Publication number Publication date
ATE228915T1 (de) 2002-12-15
US5803799A (en) 1998-09-08
DE69717510T2 (de) 2003-10-02
EP0786310A1 (en) 1997-07-30
DE69717510D1 (de) 2003-01-16
EP0786310B1 (en) 2002-12-04

Similar Documents

Publication Publication Date Title
JPH09201763A (ja) ウェーハ研摩ヘッド
US5857899A (en) Wafer polishing head with pad dressing element
JP4238244B2 (ja) ウエハ研磨システム
US6113468A (en) Wafer planarization carrier having floating pad load ring
US6872130B1 (en) Carrier head with non-contact retainer
US6890249B1 (en) Carrier head with edge load retaining ring
US7897007B2 (en) Substrate holding apparatus and substrate polishing apparatus
US7001260B2 (en) Carrier head with a compressible film
JP4408566B2 (ja) 基板保持器
EP1133380B1 (en) A carrier head with edge control for chemical mechanical polishing
US6244942B1 (en) Carrier head with a flexible membrane and adjustable edge pressure
JPH11198027A (ja) 密封された流体チャンバを有する研磨パッド支持体及び研磨方法
JPH09201763A5 (enExample)
US6540592B1 (en) Carrier head with reduced moment wear ring
US20030079836A1 (en) Carrier head for chemical mechanical polishing
JP3641464B2 (ja) 半導体基板ホルダおよびこれを備えた半導体基板の研磨装置
KR20040023228A (ko) 화학적 기계적 평탄화 기계의 폴리싱 헤드
US20070010181A1 (en) Independent edge control for CMP carriers
US6641461B2 (en) Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal
JP2001341062A (ja) 半導体ウェーハの研磨装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20031204

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040115

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20040115

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040224

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060223

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060227

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20060724