JPH087639Y2 - 半導体モジュール - Google Patents

半導体モジュール

Info

Publication number
JPH087639Y2
JPH087639Y2 JP5507890U JP5507890U JPH087639Y2 JP H087639 Y2 JPH087639 Y2 JP H087639Y2 JP 5507890 U JP5507890 U JP 5507890U JP 5507890 U JP5507890 U JP 5507890U JP H087639 Y2 JPH087639 Y2 JP H087639Y2
Authority
JP
Japan
Prior art keywords
frame body
screw hole
semiconductor module
screw
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5507890U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0415244U (ar
Inventor
優里 音部
栄次 河野
Original Assignee
株式会社豊田自動織機製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社豊田自動織機製作所 filed Critical 株式会社豊田自動織機製作所
Priority to JP5507890U priority Critical patent/JPH087639Y2/ja
Publication of JPH0415244U publication Critical patent/JPH0415244U/ja
Application granted granted Critical
Publication of JPH087639Y2 publication Critical patent/JPH087639Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP5507890U 1990-05-25 1990-05-25 半導体モジュール Expired - Lifetime JPH087639Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5507890U JPH087639Y2 (ja) 1990-05-25 1990-05-25 半導体モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5507890U JPH087639Y2 (ja) 1990-05-25 1990-05-25 半導体モジュール

Publications (2)

Publication Number Publication Date
JPH0415244U JPH0415244U (ar) 1992-02-06
JPH087639Y2 true JPH087639Y2 (ja) 1996-03-04

Family

ID=31577711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5507890U Expired - Lifetime JPH087639Y2 (ja) 1990-05-25 1990-05-25 半導体モジュール

Country Status (1)

Country Link
JP (1) JPH087639Y2 (ar)

Also Published As

Publication number Publication date
JPH0415244U (ar) 1992-02-06

Similar Documents

Publication Publication Date Title
JPH0653390A (ja) 半導体装置及びその製造方法
JPH087639Y2 (ja) 半導体モジュール
JPH04363031A (ja) 半導体装置
JPH0418468B2 (ar)
JPH042152A (ja) 樹脂封止型半導体装置及びその製造方法
JPH031540U (ar)
JPH0272656A (ja) 半導体素子の封止構造
JPH06334070A (ja) 混成集積回路装置
JP3430204B2 (ja) 中空モールドパッケージ装置
JPH1197569A (ja) 半導体パッケージ
JP2583242Y2 (ja) 半導体装置
JPH0526761Y2 (ar)
JPH0823068A (ja) リードフレームおよびそれを用いて構成された半導体装置
JPH01231415A (ja) 弾性表面波装置
JPS63248155A (ja) 半導体装置
JPH073646Y2 (ja) 半導体装置の構造
JPH04138296A (ja) 薄形半導体装置
JP2559891Y2 (ja) 複合半導体装置
JPH0142344Y2 (ar)
JPH08306744A (ja) 電子部品
JP2809478B2 (ja) 樹脂封止型半導体装置の製造方法
JPH04139746A (ja) 半導体装置
JPS6112682Y2 (ar)
JPH02246143A (ja) リードフレーム
JP2805246B2 (ja) 電子部品搭載用基板