JPH0415244U - - Google Patents
Info
- Publication number
- JPH0415244U JPH0415244U JP5507890U JP5507890U JPH0415244U JP H0415244 U JPH0415244 U JP H0415244U JP 5507890 U JP5507890 U JP 5507890U JP 5507890 U JP5507890 U JP 5507890U JP H0415244 U JPH0415244 U JP H0415244U
- Authority
- JP
- Japan
- Prior art keywords
- screw hole
- substrate
- frame
- semiconductor chip
- screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5507890U JPH087639Y2 (ja) | 1990-05-25 | 1990-05-25 | 半導体モジュール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5507890U JPH087639Y2 (ja) | 1990-05-25 | 1990-05-25 | 半導体モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0415244U true JPH0415244U (ar) | 1992-02-06 |
| JPH087639Y2 JPH087639Y2 (ja) | 1996-03-04 |
Family
ID=31577711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5507890U Expired - Lifetime JPH087639Y2 (ja) | 1990-05-25 | 1990-05-25 | 半導体モジュール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087639Y2 (ar) |
-
1990
- 1990-05-25 JP JP5507890U patent/JPH087639Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH087639Y2 (ja) | 1996-03-04 |