JPH0846091A - ボールグリッドアレイ半導体装置 - Google Patents

ボールグリッドアレイ半導体装置

Info

Publication number
JPH0846091A
JPH0846091A JP6175606A JP17560694A JPH0846091A JP H0846091 A JPH0846091 A JP H0846091A JP 6175606 A JP6175606 A JP 6175606A JP 17560694 A JP17560694 A JP 17560694A JP H0846091 A JPH0846091 A JP H0846091A
Authority
JP
Japan
Prior art keywords
wiring board
semiconductor device
package
semiconductor chip
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6175606A
Other languages
English (en)
Japanese (ja)
Inventor
Akiro Sumiya
彰朗 角谷
Ichiro Anjo
一郎 安生
Masachika Masuda
正親 増田
Hiromichi Suzuki
博通 鈴木
Akira Haruta
亮 春田
Junichi Arita
順一 有田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6175606A priority Critical patent/JPH0846091A/ja
Priority to TW084107217A priority patent/TW296473B/zh
Priority to KR1019950021276A priority patent/KR960005965A/ko
Publication of JPH0846091A publication Critical patent/JPH0846091A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP6175606A 1994-07-27 1994-07-27 ボールグリッドアレイ半導体装置 Pending JPH0846091A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP6175606A JPH0846091A (ja) 1994-07-27 1994-07-27 ボールグリッドアレイ半導体装置
TW084107217A TW296473B (enExample) 1994-07-27 1995-07-12
KR1019950021276A KR960005965A (ko) 1994-07-27 1995-07-20 반도체 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6175606A JPH0846091A (ja) 1994-07-27 1994-07-27 ボールグリッドアレイ半導体装置

Publications (1)

Publication Number Publication Date
JPH0846091A true JPH0846091A (ja) 1996-02-16

Family

ID=15999040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6175606A Pending JPH0846091A (ja) 1994-07-27 1994-07-27 ボールグリッドアレイ半導体装置

Country Status (3)

Country Link
JP (1) JPH0846091A (enExample)
KR (1) KR960005965A (enExample)
TW (1) TW296473B (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237142A (ja) * 2000-02-22 2001-08-31 Shizuki Electric Co Inc フィルムコンデンサ及び樹脂成形部品
JP2010050488A (ja) * 2009-11-30 2010-03-04 Panasonic Corp 半導体装置およびその製造方法
JP2010177388A (ja) * 2009-01-29 2010-08-12 Panasonic Corp 半導体装置及びその製造方法
CN102668042A (zh) * 2009-12-24 2012-09-12 株式会社村田制作所 电子元器件的制造方法
JP2023006455A (ja) * 2021-06-30 2023-01-18 キオクシア株式会社 半導体デバイス及び電子デバイス
JPWO2024177013A1 (enExample) * 2023-02-20 2024-08-29

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237142A (ja) * 2000-02-22 2001-08-31 Shizuki Electric Co Inc フィルムコンデンサ及び樹脂成形部品
JP2010177388A (ja) * 2009-01-29 2010-08-12 Panasonic Corp 半導体装置及びその製造方法
JP2010050488A (ja) * 2009-11-30 2010-03-04 Panasonic Corp 半導体装置およびその製造方法
CN102668042A (zh) * 2009-12-24 2012-09-12 株式会社村田制作所 电子元器件的制造方法
US9005736B2 (en) 2009-12-24 2015-04-14 Murata Manufacturing Co., Ltd. Electronic component manufacturing method
JP2023006455A (ja) * 2021-06-30 2023-01-18 キオクシア株式会社 半導体デバイス及び電子デバイス
US12374594B2 (en) 2021-06-30 2025-07-29 Kioxia Corporation Semiconductor device and electronic device
JPWO2024177013A1 (enExample) * 2023-02-20 2024-08-29

Also Published As

Publication number Publication date
TW296473B (enExample) 1997-01-21
KR960005965A (ko) 1996-02-23

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