JPH08330243A - プラズマクリーニング方法及びこの方法に使用される配置領域保護体 - Google Patents

プラズマクリーニング方法及びこの方法に使用される配置領域保護体

Info

Publication number
JPH08330243A
JPH08330243A JP7156977A JP15697795A JPH08330243A JP H08330243 A JPH08330243 A JP H08330243A JP 7156977 A JP7156977 A JP 7156977A JP 15697795 A JP15697795 A JP 15697795A JP H08330243 A JPH08330243 A JP H08330243A
Authority
JP
Japan
Prior art keywords
substrate
plasma
gas
stage
substrate stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7156977A
Other languages
English (en)
Japanese (ja)
Inventor
Yoshihiro Tamura
好宏 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP7156977A priority Critical patent/JPH08330243A/ja
Priority to TW085106124A priority patent/TW295772B/zh
Priority to KR1019960018647A priority patent/KR100262883B1/ko
Publication of JPH08330243A publication Critical patent/JPH08330243A/ja
Priority to US09/374,112 priority patent/US6283130B1/en
Priority to US09/874,325 priority patent/US6769439B2/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
JP7156977A 1995-05-30 1995-05-30 プラズマクリーニング方法及びこの方法に使用される配置領域保護体 Pending JPH08330243A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP7156977A JPH08330243A (ja) 1995-05-30 1995-05-30 プラズマクリーニング方法及びこの方法に使用される配置領域保護体
TW085106124A TW295772B (enrdf_load_stackoverflow) 1995-05-30 1996-05-23
KR1019960018647A KR100262883B1 (ko) 1995-05-30 1996-05-30 플라즈마 크리닝 방법 및 플라즈마 처리장치
US09/374,112 US6283130B1 (en) 1995-05-30 1999-08-16 Plasma cleaning method and placement area protector used in the method
US09/874,325 US6769439B2 (en) 1995-05-30 2001-06-06 Plasma cleaning method and placement area protector used in the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7156977A JPH08330243A (ja) 1995-05-30 1995-05-30 プラズマクリーニング方法及びこの方法に使用される配置領域保護体

Publications (1)

Publication Number Publication Date
JPH08330243A true JPH08330243A (ja) 1996-12-13

Family

ID=15639476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7156977A Pending JPH08330243A (ja) 1995-05-30 1995-05-30 プラズマクリーニング方法及びこの方法に使用される配置領域保護体

Country Status (3)

Country Link
JP (1) JPH08330243A (enrdf_load_stackoverflow)
KR (1) KR100262883B1 (enrdf_load_stackoverflow)
TW (1) TW295772B (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001313289A (ja) * 2000-01-28 2001-11-09 Applied Materials Inc 半導体ウエーハ処理システムの洗浄方法及び装置
JP2002212732A (ja) * 2001-01-22 2002-07-31 Anelva Corp Ｃｖｄ装置のクリーニング方法
US6652713B2 (en) 2001-08-09 2003-11-25 Applied Materials, Inc. Pedestal with integral shield
JP2007216095A (ja) * 2006-02-14 2007-08-30 National Institutes Of Natural Sciences 水素貯蔵金属又は合金の初期活性化方法及び水素化方法
WO2010084909A1 (ja) * 2009-01-21 2010-07-29 キヤノンアネルバ株式会社 磁性膜加工チャンバのクリーニング方法、磁性素子の製造方法、および基板処理装置
WO2014142031A1 (ja) * 2013-03-13 2014-09-18 株式会社日立国際電気 基板処理装置、基板処理装置の制御方法、クリーニング方法及び半導体装置の製造方法並びに記録媒体
US12211737B2 (en) 2021-08-27 2025-01-28 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning chamber for metal oxide removal

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100799815B1 (ko) * 2002-12-18 2008-01-31 엘지노텔 주식회사 시스템간 버전 호환성 처리 방법
KR101586237B1 (ko) * 2015-07-24 2016-01-19 주식회사 애니테이프 대기압 플라즈마를 이용한 압출성형재의 윤활유 제거 장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555184A (ja) * 1991-08-27 1993-03-05 Fujitsu Ltd クリーニング方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001313289A (ja) * 2000-01-28 2001-11-09 Applied Materials Inc 半導体ウエーハ処理システムの洗浄方法及び装置
JP2002212732A (ja) * 2001-01-22 2002-07-31 Anelva Corp Ｃｖｄ装置のクリーニング方法
US8105440B2 (en) 2001-01-22 2012-01-31 Canon Anelva Corporation Method of cleaning a CVD device
US6652713B2 (en) 2001-08-09 2003-11-25 Applied Materials, Inc. Pedestal with integral shield
WO2003015137A3 (en) * 2001-08-09 2004-03-11 Applied Materials Inc Pedestal with integral shield
US6837968B2 (en) 2001-08-09 2005-01-04 Applied Materials, Inc. Lower pedestal shield
JP2007216095A (ja) * 2006-02-14 2007-08-30 National Institutes Of Natural Sciences 水素貯蔵金属又は合金の初期活性化方法及び水素化方法
WO2010084909A1 (ja) * 2009-01-21 2010-07-29 キヤノンアネルバ株式会社 磁性膜加工チャンバのクリーニング方法、磁性素子の製造方法、および基板処理装置
WO2014142031A1 (ja) * 2013-03-13 2014-09-18 株式会社日立国際電気 基板処理装置、基板処理装置の制御方法、クリーニング方法及び半導体装置の製造方法並びに記録媒体
US12211737B2 (en) 2021-08-27 2025-01-28 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning chamber for metal oxide removal

Also Published As

Publication number Publication date
KR960042935A (ko) 1996-12-21
KR100262883B1 (ko) 2000-09-01
TW295772B (enrdf_load_stackoverflow) 1997-01-11

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