JPH083011Y2 - 半導体装置用パツケ−ジ - Google Patents

半導体装置用パツケ−ジ

Info

Publication number
JPH083011Y2
JPH083011Y2 JP14299485U JP14299485U JPH083011Y2 JP H083011 Y2 JPH083011 Y2 JP H083011Y2 JP 14299485 U JP14299485 U JP 14299485U JP 14299485 U JP14299485 U JP 14299485U JP H083011 Y2 JPH083011 Y2 JP H083011Y2
Authority
JP
Japan
Prior art keywords
package
grounding
external lead
bottom plate
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP14299485U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6251748U (enrdf_load_stackoverflow
Inventor
潤 深谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14299485U priority Critical patent/JPH083011Y2/ja
Priority to CA500274A priority patent/CA1264380C/en
Priority to DE8686400160T priority patent/DE3688205T2/de
Priority to EP86400160A priority patent/EP0190077B1/en
Priority to AU52794/86A priority patent/AU564928B2/en
Priority to KR1019860000613A priority patent/KR900001246B1/ko
Publication of JPS6251748U publication Critical patent/JPS6251748U/ja
Priority to US07/147,633 priority patent/US4825282A/en
Application granted granted Critical
Publication of JPH083011Y2 publication Critical patent/JPH083011Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP14299485U 1985-01-30 1985-09-19 半導体装置用パツケ−ジ Expired - Lifetime JPH083011Y2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP14299485U JPH083011Y2 (ja) 1985-09-19 1985-09-19 半導体装置用パツケ−ジ
CA500274A CA1264380C (en) 1985-01-30 1986-01-24 SEMICONDUCTOR DEVICE BOX WITH INTEGRATED GROUNDING CONDUCTOR AND SIDEWALL
EP86400160A EP0190077B1 (en) 1985-01-30 1986-01-28 A package structure for a semiconductor chip
DE8686400160T DE3688205T2 (de) 1985-01-30 1986-01-28 Packungsstruktur fuer einen halbleiterchip.
AU52794/86A AU564928B2 (en) 1985-01-30 1986-01-29 Package structure for ultra-high frequency semiconductor chip
KR1019860000613A KR900001246B1 (ko) 1985-01-30 1986-01-30 반도체장치
US07/147,633 US4825282A (en) 1985-01-30 1988-01-25 Semiconductor package having side walls, earth-bonding terminal, and earth lead formed in a unitary structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14299485U JPH083011Y2 (ja) 1985-09-19 1985-09-19 半導体装置用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS6251748U JPS6251748U (enrdf_load_stackoverflow) 1987-03-31
JPH083011Y2 true JPH083011Y2 (ja) 1996-01-29

Family

ID=31052258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14299485U Expired - Lifetime JPH083011Y2 (ja) 1985-01-30 1985-09-19 半導体装置用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPH083011Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2734085B2 (ja) * 1989-05-11 1998-03-30 日本電気株式会社 高周波パッケージ

Also Published As

Publication number Publication date
JPS6251748U (enrdf_load_stackoverflow) 1987-03-31

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