JPS6251748U - - Google Patents
Info
- Publication number
- JPS6251748U JPS6251748U JP1985142994U JP14299485U JPS6251748U JP S6251748 U JPS6251748 U JP S6251748U JP 1985142994 U JP1985142994 U JP 1985142994U JP 14299485 U JP14299485 U JP 14299485U JP S6251748 U JPS6251748 U JP S6251748U
- Authority
- JP
- Japan
- Prior art keywords
- led out
- input
- bottom plate
- external lead
- side walls
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011104 metalized film Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14299485U JPH083011Y2 (ja) | 1985-09-19 | 1985-09-19 | 半導体装置用パツケ−ジ |
CA000500274A CA1264380A (en) | 1985-01-30 | 1986-01-24 | Semiconductor device package with integral earth lead and side wall |
EP86400160A EP0190077B1 (en) | 1985-01-30 | 1986-01-28 | A package structure for a semiconductor chip |
DE8686400160T DE3688205T2 (de) | 1985-01-30 | 1986-01-28 | Packungsstruktur fuer einen halbleiterchip. |
AU52794/86A AU564928B2 (en) | 1985-01-30 | 1986-01-29 | Package structure for ultra-high frequency semiconductor chip |
KR1019860000613A KR900001246B1 (ko) | 1985-01-30 | 1986-01-30 | 반도체장치 |
US07/147,633 US4825282A (en) | 1985-01-30 | 1988-01-25 | Semiconductor package having side walls, earth-bonding terminal, and earth lead formed in a unitary structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14299485U JPH083011Y2 (ja) | 1985-09-19 | 1985-09-19 | 半導体装置用パツケ−ジ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6251748U true JPS6251748U (enrdf_load_stackoverflow) | 1987-03-31 |
JPH083011Y2 JPH083011Y2 (ja) | 1996-01-29 |
Family
ID=31052258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14299485U Expired - Lifetime JPH083011Y2 (ja) | 1985-01-30 | 1985-09-19 | 半導体装置用パツケ−ジ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH083011Y2 (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02296353A (ja) * | 1989-05-11 | 1990-12-06 | Nec Corp | 高周波パッケージ |
-
1985
- 1985-09-19 JP JP14299485U patent/JPH083011Y2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02296353A (ja) * | 1989-05-11 | 1990-12-06 | Nec Corp | 高周波パッケージ |
Also Published As
Publication number | Publication date |
---|---|
JPH083011Y2 (ja) | 1996-01-29 |