JPS6251748U - - Google Patents

Info

Publication number
JPS6251748U
JPS6251748U JP1985142994U JP14299485U JPS6251748U JP S6251748 U JPS6251748 U JP S6251748U JP 1985142994 U JP1985142994 U JP 1985142994U JP 14299485 U JP14299485 U JP 14299485U JP S6251748 U JPS6251748 U JP S6251748U
Authority
JP
Japan
Prior art keywords
led out
input
bottom plate
external lead
side walls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985142994U
Other languages
English (en)
Japanese (ja)
Other versions
JPH083011Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14299485U priority Critical patent/JPH083011Y2/ja
Priority to CA000500274A priority patent/CA1264380A/en
Priority to DE8686400160T priority patent/DE3688205T2/de
Priority to EP86400160A priority patent/EP0190077B1/en
Priority to AU52794/86A priority patent/AU564928B2/en
Priority to KR1019860000613A priority patent/KR900001246B1/ko
Publication of JPS6251748U publication Critical patent/JPS6251748U/ja
Priority to US07/147,633 priority patent/US4825282A/en
Application granted granted Critical
Publication of JPH083011Y2 publication Critical patent/JPH083011Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP14299485U 1985-01-30 1985-09-19 半導体装置用パツケ−ジ Expired - Lifetime JPH083011Y2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP14299485U JPH083011Y2 (ja) 1985-09-19 1985-09-19 半導体装置用パツケ−ジ
CA000500274A CA1264380A (en) 1985-01-30 1986-01-24 Semiconductor device package with integral earth lead and side wall
EP86400160A EP0190077B1 (en) 1985-01-30 1986-01-28 A package structure for a semiconductor chip
DE8686400160T DE3688205T2 (de) 1985-01-30 1986-01-28 Packungsstruktur fuer einen halbleiterchip.
AU52794/86A AU564928B2 (en) 1985-01-30 1986-01-29 Package structure for ultra-high frequency semiconductor chip
KR1019860000613A KR900001246B1 (ko) 1985-01-30 1986-01-30 반도체장치
US07/147,633 US4825282A (en) 1985-01-30 1988-01-25 Semiconductor package having side walls, earth-bonding terminal, and earth lead formed in a unitary structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14299485U JPH083011Y2 (ja) 1985-09-19 1985-09-19 半導体装置用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS6251748U true JPS6251748U (enrdf_load_stackoverflow) 1987-03-31
JPH083011Y2 JPH083011Y2 (ja) 1996-01-29

Family

ID=31052258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14299485U Expired - Lifetime JPH083011Y2 (ja) 1985-01-30 1985-09-19 半導体装置用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPH083011Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02296353A (ja) * 1989-05-11 1990-12-06 Nec Corp 高周波パッケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02296353A (ja) * 1989-05-11 1990-12-06 Nec Corp 高周波パッケージ

Also Published As

Publication number Publication date
JPH083011Y2 (ja) 1996-01-29

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