JPH08220189A - Contact structure of handler for ic testing device - Google Patents

Abstract

PURPOSE: To obtain a contact structure which can be easily coped with even if the shape of an IC device and an IC socket to be measured becomes thin in a dead weight drop system handler. CONSTITUTION: A roof interlocking part 7 where a gap 9 for dropping and sliding corresponding to the dimensions of a carrier 3 is formed, a roof A1, a roof B2, and a rail 5 are provided. A handler consists of the roof A1 and the roof B2 which support the carrier 3 and an opening part 8 for preventing the roof A1 and the roof B2 from interfering at the time of the contact operation between the corresponding IC socket and an IC device 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a contact portion of an IC device to be measured in a self-weight drop type handler for an IC test apparatus.

[0002]

2. Description of the Related Art A handler for handling the electric characteristics of an IC device by an IC tester handles a wide variety of devices and handles devices of various shapes. The parts of the structure part that depend on are made into an exchange kit (change kit) structure so that they can be easily exchanged. FIG. 5 is a structural diagram showing a relationship between a carrier and a roof of a change kit unit according to a conventional technique. Further, FIG. 6 shows the I in the test head section.
It is a sectional side view which contacts the IC device in a carrier with C socket B. FIG. 3 is a front structural view of an IC socket, in which the contact terminals 23 are arranged on both sides of the roof escape groove 21 and the TS having the IC leads in two directions.
This is an example for an OP type 2 / SOP package.

As shown in FIG. 5, the change kit section 18
The carrier 3 accommodating the IC device 4 from the upper part of the vehicle slides by its own weight between the rail 5 and the roof, and stops at the contact position of the test head portion 13 by the stopper. Next, the lead terminal of the IC device 4 contacts (electrically contacts) the contact pin 16 of the IC socket B15 while moving to the socket side together with the roof C17 while being guided by the guide post 19. After that, the device is subjected to an electrical test, then moved to the original position, and then dropped and conveyed. By sequentially performing this, many devices under test are tested.

Here, in order to make contact with the IC socket B15 side, the structure of the roof C17 of the change kit portion 18 requires a roof central portion 20 for holding the carrier 3, as shown in FIGS. It was. In order to deal with this convex portion, it is necessary to form a roof escape groove 21 structure on the IC socket B15 side for escaping the protruding portion. In order to form the roof escape groove 21, a depth from the socket bottom surface 12 of the IC socket B15 to the contact pin 16 is required. However, the IC to be measured
Depending on the type of the device 4, a situation has arisen in which the roof relief groove 21 as in the prior art cannot be provided.
That is, as the frequency of the IC device 4 becomes higher, the contact pin 16 becomes shorter in order to correspond to the IC socket B15, and it becomes difficult to form the roof escape groove 21. In addition, a lead terminal 22 is formed in four directions such as a QFP structure, or an IC device 4 also having a PGA structure.
In the case where the lead terminals 22 are formed on the terminal surface in a grid pattern, the roof central portion 20 becomes an obstacle, and there is a problem that the contact pins 16 and the lead terminals 22 for measurement cannot be contacted. It was

[0005]

The problem to be solved by the present invention is that the structure of the lead terminal of the IC device is QFP.
Alternatively, it is an object to realize a structure in which a contact for measurement can be obtained without trouble by making the contact side compatible with a thin IC socket in the case of four directions like a PGA or in a lattice shape.

[0006]

1 and 2 show a first solution according to the present invention. In order to solve the above-mentioned problem, in the configuration of the present invention, the roof connecting portion 7, the roof A1, the roof B2, and the rail 5 having the gap 9 for dropping and sliding corresponding to the size of the carrier 3 are provided, and the carrier 3 is provided.
And a roof A1 and a roof B2 having an opening 8 structure that does not interfere with the roof A1 and the roof B2 during the contact operation between the corresponding IC socket and the IC device 4.
Is provided. As a result, the IC device 4
The carrier 3 having a carrier 3 and a contact IC socket on the side of the test head 13
Realizes the structure of the contact part that contacts the socket.

FIG. 8 shows a structure in which a cushioning means according to the present invention is added. That is, in addition to the above-mentioned solution means, a contact cushioning means including a spring 28 and a carrier retainer 27 is provided on the rear surface of the rail in order to guide the lateral posture of the carrier 3 and cushion the contact at the time of fitting with the contact side. It is a construction means.

As described above, according to the present invention, in the contact structure for the IC test apparatus, (1) a rail for forming a predetermined width, height and gap for dropping the carrier accommodating the IC device in the dropping direction of the IC device. Although there is a roof consisting of each part, (2) keep the falling posture of the carrier that contains the IC device, and
An opening is provided by dividing the roof central part required to separate it from the C socket into an upper roof A and a lower roof B. (3) A guide taper is provided on the roof B to set the carrier at a predetermined position. It has a structure that drops to the ground.

[0009]

In the present invention, the central portion of the roof is divided into two, but the size of the opening is such that the upper end of the carrier overlaps the roof A and the lower end of the carrier is roof B at the position where the carrier falls and stops. By adopting a predetermined one that is aligned with the carrier so as to be overlapped with the above, a structure that allows contact with a thin IC device, QFP, PGA, or the like is provided. That is, roof A1 and roof B2
Is compatible with H-type IC sockets and other IC sockets, has a dimension structure that does not hinder contact, and has a length that supports the carrier 3, so that devices of arbitrary packages can be supported. Further, in the configuration example shown in FIG. 8, in order to guide the lateral posture of the carrier 3 and buffer the contact at the time of fitting with the contact side, a spring 28 and a carrier retainer 27 are additionally configured on the rear surface of the rail to contact the contact. It has a buffering effect.

[0010]

The embodiment according to the present invention is a structural example in the case of a thin VSMP package as shown in the side sectional view of FIG. FIG. 2 is this front view. In addition, Figure 4 shows QF
It is a conceptual diagram which shows that it is in the range of an opening part in order to measure the thing of P or PGA structure. An IC socket corresponding to the structure of the present embodiment has a structure corresponding to a socket called an H-type socket, and as shown in FIG. The carrier 3 is supported by the roof A1 and the roof B2 as shown in FIG.

The carrier 3 drops in the gap between the rail 5 and the roof A1 and stops at the position of the opening 8 which is contacted by the stopper 10. Further, the lower roof B so that the carrier 3 does not get caught in the lower roof B2 and becomes a jam and does not jump out to the opening side of the opening 8.
2 is provided with a guide taper 11. Also, since one side is open, I
In order to hold the C device 4, a structure for supporting and fixing the upper and lower parts of the IC package is provided so that the C device 4 is not easily dropped from the carrier container when it is moved to the contact side and returned.

To move to the contact side, the roof A1, the roof B2 and the rail 5 cooperate with each other to move to the contact side while holding the carrier 3 and make contact with the corresponding IC socket. After the electrical test, after returning to the original position, the stopper 10 is removed and the sheet is dropped and conveyed downward.
By the way, in order to deal with devices of various shapes, a portion depending on the package shape of the device, for example, the roof A
The structural parts of 1, the roof B2, the rails 5, and the carrier 3 have an exchange kit structure so that they can be easily exchanged as in the conventional case.

In the present invention, as shown in FIGS. 1 and 2,
In the configuration of the rail 5 and the roof forming the gap 9 having a predetermined width and height for correctly dropping the carrier 3 accommodating the IC device 4 in the IC device dropping direction 6, the roof central portion 20 in the configuration of the conventional technique is used. Instead, the roof A1 at the top and the roof B2 at the bottom are divided. As a result, in the case of the H-type IC socket, it is not necessary to provide the roof relief groove 21 in the IC socket B15 as shown in FIG. This made it possible to realize a contact structure that can easily be applied to a thin contact structure. That is, by providing the opening 8 in the roof, it is not necessary to provide the roof escape groove 21 on the IC socket B15 side.

In the above description of the embodiment, the case of the thin VSMP package has been described, but the QF having leads in four directions is used.
In the case of a P package or a PGA package, the opening 8 is wider than the IC lead, and an opening structure having a narrower space than the carrier 3 is provided, so that the same operation as in the above embodiment can be performed.

In addition to the above-described embodiment, a structure example in which a buffer structure is added by a carrier retainer 27 and a spring 28 in order to buffer the contact at the time of fitting with the contact side is shown in FIG.
It shows in (b). In this case, since the carrier retainer 27 is provided on the back surface of the rail 26, the rail 26 is provided with
As shown in (b), a hole is formed through both end surfaces of the carrier holder 27 to guide the carrier 3. The carrier holder 27 is pressed against the rear surface of the rail 26 by a spring 28. Both sides of the U-shaped carrier retainer 27 stick out to the running surface and the carrier 3
To guide the lateral posture of. At the time of contact, when the whole of the carrier holder 27 moves to the contact side together with the rail 26 to make contact, even if the top 27a of the carrier holder 27 hits the socket side container, it is buffered by the spring 28 to hold the carrier 3 in a stable contact state. This is the added structure.

In the above-mentioned embodiment, the support portion of the carrier 3 by the roof A1 and the roof B2 is lengthened to correspond to the H type IC socket, but if desired, the length of the support portion of the roof A1 and the roof B2 can be changed to H. The length may be a length corresponding to an IC socket other than the type IC socket and may be a length for supporting the carrier 3, and the same operation can be performed.

[0017]

Since the present invention is configured as described above, it has the following effects. (1) By providing an opening in the roof part that functions to maintain the attitude of the carrier containing the IC device when it falls by its own weight and to separate it from the IC socket provided on the test head side, the roof part escapes from the IC socket. It is no longer necessary to form a groove. As a result, it has become possible to realize a contact structure that can easily make contact with a thin IC socket. (2) Similarly, by providing an opening in the roof part and providing a structure for supporting the non-lead part of the IC package inside the carrier 3, the lead terminals of the IC device are not limited to one direction or two directions, but four directions. QFP and P formed in
It is also possible to support GA type. As a result, it was possible to realize a contact structure that can be used even when the contact side is a thin IC socket.

[0018]

[Brief description of drawings]

FIG. 1 is a side sectional view of an embodiment according to the present invention.

FIG. 2 is a front view of an embodiment according to the present invention.

FIG. 3 is an example of a conventional front view of an IC socket.

FIG. 4 is a front view showing the concept that the present invention can be applied to a QFP type or the like due to the opening of the roof.

FIG. 5 is a front view of a change kit unit according to the related art.

FIG. 6 is a cross-sectional view of a change kit unit and an IC socket according to a conventional technique.

FIG. 7 is a structural diagram of an H-type IC socket that can be used in the present invention and has an opening at the center and top and bottom.

8A and 8B are a cross-sectional structural view of a side of the carrier retainer 27 and a cross-sectional structural view of the present invention, in which a shock absorbing structure at the time of contact is added according to the present invention.

[Explanation of symbols]

 1 Roof A 2 Roof B 3 Carrier 4 IC Device 5, 26 Rail 6 IC Device Drop Direction 7 Roof Connecting Part 8 Opening 9 Gap 10 Stopper 11 Guide Taper 12 Socket Bottom 13 Test Head Part 14 IC Socket A 15 IC Socket B 16 Contact pin 18 Change kit part 17 Roof C 19 Guide post 20 Roof central part 21 Roof escape groove 22 Lead terminal 23 Contact terminal 27 Carrier retainer 28 Spring

Claims (2)

[Claims] 1. A carrier (3) for accommodating an IC device (4) and a contact IC socket on the side of a test head (13), comprising a contact part for contacting the carrier (3) with the IC socket. In the structure, a roof connecting portion (7) having a gap (9) for sliding and dropping corresponding to the size of the carrier (3), a roof A
(1), roof B (2) and rail (5) are provided, carrier (3) is supported, and corresponding IC socket and IC
Roof A during contact operation with device (4)
(1) and roof B (2) are provided with roof A (1) and roof B (2) having an opening (8) structure that does not interfere with the above, and the handler for IC test characterized by including the above Contact structure. 2. In addition to the above structure, a spring (28) and a carrier retainer (28) are provided on the rear surface of the rail to guide the lateral posture of the carrier (3) and buffer the contact when the carrier (3) is fitted with the contact side. 27) The contact structure of the IC test handler according to claim 1, further comprising a contact buffering means according to (27) above.