CN1141434A - Contact structure of treatment device used for IC testing apparatus - Google Patents
Contact structure of treatment device used for IC testing apparatus Download PDFInfo
- Publication number
- CN1141434A CN1141434A CN96104014A CN96104014A CN1141434A CN 1141434 A CN1141434 A CN 1141434A CN 96104014 A CN96104014 A CN 96104014A CN 96104014 A CN96104014 A CN 96104014A CN 1141434 A CN1141434 A CN 1141434A
- Authority
- CN
- China
- Prior art keywords
- top board
- socket
- contact
- carriage
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Chutes (AREA)
Abstract
A contact structure of treatment device used for integrate circuit (IC) testing apparatus, which can be easily coped with even if the shape of an IC device and an IC socket to be measured becomes thin in a handler of self-weight-dropping type. A roof interlocking part 7 where a gap 9 for dropping and sliding corresponding to the dimensions of a carrier 3 is formed, a roof A1, a roof B2, and a rail 5 are provided. A handler consists of the roof A1 and the roof B2 which support the carrier 3 and an opening part 8 for preventing the roof A1 and the roof B2 from interfering at the time of the contact operation between the corresponding IC socket and an IC device 4.
Description
The present invention relates to the structure of the contact portion of tested object IC assembly in the deadweight whereabouts mode processor that the IC test unit is used.
When utilizing the electrical specification of IC test unit test I C assembly, the processor that carries out necessary processing is in order to handle the assembly of many kinds, corresponding with the assembly of different shape, the parts of the structure division relevant with the encapsulation shape of assembly adopt replaceable accessory (the チ ェ Application ジ キ ッ ト) structure that can be easy to change.
Fig. 5 is the structural drawing of the relation of the carriage of replaceable set and assembling parts department of prior art and top board.In addition, Fig. 6 is the sectional side view that the IC assembly in the carriage is contacted with the IC socket B that is positioned at test head.Fig. 3 is the Facad structure figure of IC socket, is that contact terminal 23 is arranged in the example that top board withdraws from the both sides of groove 21, has the TSOPII type/SOP encapsulation usefulness of IC lead-in wire in two directions.
As shown in Figure 5, the carriage 3 of the IC assembly 4 of packing into from the top of replaceable set and assembling parts department 18 with dilly, is made it to stop at the contact position of test head 13 by block between guide rail 5 and top board.Then, under the guiding of guide pillar 19, to socket one side shifting, the lead terminal of IC assembly 4 contacts (electric contact) with the contact pin 16 of IC socket B15 with top board C17.Carry out after the electrical test of assembly and move to after the original position, transmit downwards.Carry out in proper order with this, just can carry out the test of a large amount of tested assemblies.
Here, in order to contact with IC socket B15, the structure of the top board C17 of replaceable set and assembling parts department 18 as Fig. 5, shown in Figure 6, must be useful on the top board central portion 20 that keeps carriage 3.For corresponding, must form the structure that the top board that this extension is withdrawed from withdraws from groove 21 in IC socket B15 one side with this protuberance.
Withdraw from groove 21 in order to form this top board, need to contact pin 16 certain depth be arranged from the socket bottom surface 12 of IC socket B15.But, owing to, in fact the such top board of prior art can not be set withdraw from groove 21 as the relation of the kind of the IC assembly 4 of tested object.That is, 1. along with the high frequencyization of IC assembly 4, corresponding therewith in order to make IC socket B15, contact pin 16 shortens, and withdraws from groove 21 thereby be difficult to form top board.2. in addition, because as qfp structure, form lead terminal 22 or on the terminal surface of the IC of same PGA structure assembly 4, form lead terminal 22 with clathrate in 4 directions, so, top board central portion 20 just becomes obstacle, causes the contact pin 16 that is used to test not contact with lead terminal 22.
The problem that the present invention wants to solve be exactly structure when the lead terminal of IC assembly as QFP or PGA in 4 directions or when becoming clathrate, contact one side also can with slim IC socket correspondence, purpose is intended to realize that the contact that is used to test can become the structure that has no obstacle.
Fig. 1 and Fig. 2 are the 1st solutions of the present invention.
In order to address the above problem, in structure of the present invention, setting forms to fall to sliding top board attachment 7, top board A1, top board B2 and the guide rail 5 in gap 9 with the size of carriage 3 accordingly, and support rack 3 is set and is carrying out making top board A1 and top board A2 can not become the top board A1 with peristome 8 structures of obstacle and the frame mode of top board B2 when corresponding IC socket contacts with IC assembly 4.
Like this, just can realize having the carriage 3 of taking in IC assembly 4 and be positioned at contacting of test head 13 1 sides and use the IC socket, thus the contact structure that carriage 3 is contacted with the IC socket.
Fig. 8 is the structure of having added buffer gear of the present invention.That is, except above-mentioned solution, it is for the transverse direction position guiding of giving carriage 3 and at the damp impacts and at the frame mode of the contact buffer gear that is made of spring 28 and bracket plate 27 of rail back setting when chimeric with contact one side.
Like this, the present invention has just adopted following structure in the contact structure that the IC proving installation is used: (1) has by specified width, which width and highly forms the guide rail in gap and the top board that each several part constitutes, so that hold the falling direction whereabouts of the carriage of IC assembly along the IC assembly; (2) for the position, whereabouts of the carriage that keeps holding the IC assembly, and after end of test (EOT), carriage is pulled out from the IC socket, top board is divided into top top board A and bottom top board B two parts and at the top board middle body of needs peristome is set: (3) are provided with the guiding awl on top board B, so that carriage drops to appointed positions.
In the present invention, though cut apart at the top board central portion, but, the size of its peristome makes the upper end of carriage and top board A overlapping for the position that stops after falling at carriage, make the bottom and the top board B of carriage overlapping, by adopting the specified size with the carriage coupling, thus become can with the thin type assembly and the contacting structure such as QFP or PGA of IC assembly.That is, top board A1, top board B2 just can be corresponding with the assembly of any encapsulation by adopting the length of dimensional structure that when contacting can not become obstacle corresponding with H type IC socket and other IC sockets and employing support rack 3.
In addition, in structure example shown in Figure 8,, behind rail back additional springs 28 and bracket plate 27, has the contact buffer action for the transverse direction position guiding of giving carriage 3 and at damp impacts when chimeric with contact one side.
Because the present invention constitutes as described above like that, so the true following effect of tool:
(1) by have the carriage that keeps taking in the IC assembly when falling with deadweight posture and the top plate portion of the function of separating with the IC socket that is arranged on test probe one side on peristome is set, just can on the IC socket, form the groove that withdraws from of top plate portion.As a result, can realize the easy contact structure that contacts with the IC socket of thin type.
(2) by on same top plate portion, peristome being set, and the structure of the non-lead portion of supporting IC encapsulation is set in the inboard of carriage 3, not only can be corresponding at the assembly of a direction or two direction formation with the lead terminal of IC assembly, but also can be corresponding with the assembly of QFP that forms at four direction and PGA formula.
Fig. 1 is the cut-open view of the side of the embodiment of the invention.
Fig. 2 is the front view of the embodiment of the invention.
Fig. 3 is the main TV structure legend of the IC socket that has earlier.
Fig. 4 is that expression utilizes the peristome of top board of the present invention to go for the front view of the notion of IC assembly such as QFP formula.
Fig. 5 is the front view of the replaceable set and assembling parts department of prior art.
Fig. 6 is the replaceable set and assembling parts department of prior art and the cut-open view of IC socket.
Fig. 7 is the H type IC socket figure of operable central upper and lower opening in the present invention.
Fig. 8 is the shock absorbing structure figure when having added of the present invention the contact, (a) is the sectional structure chart of bracket plate 27 sides, (b) is to go up sectional view.
1... top board A
2... top board B
3... carriage
4...IC assembly
5,26... guide rail
6...IC assembly falling direction
7... top board attachment
8... peristome
9... gap
10... block
11... guiding awl
12... socket bottom surface
13... test head
14...IC socket A
15..IC socket B
16... contact pin
18... replaceable set and assembling parts department
17... top board C
19... guide pillar
20... top board central portion
21... top board withdraws from groove
22... lead terminal
23... contact terminal
27... bracket plate
28... spring
Shown in the embodiments of the invention sectional view as shown in Figure 1, the configuration example when being slim VSMP encapsulation.Fig. 2 is its front view.In addition, Fig. 4 illustrates concept map in the scope of peristome for the assembly of testing QFP and PGA structure.
The IC socket corresponding with the structure of present embodiment be and the corresponding structure of socket that is called H type socket, and be corresponding with the IC socket of the structure with central upper and lower opening as shown in Figure 7, as shown in Figure 2, and by top board A1 and top board B2 support rack 3.
Carriage 3 falls in the gap of guide rail 5 and top board A1, is made it to stop in the position of the peristome 8 that contacts by block 10.In addition, guiding awl 11 is set on the top board B2 of downside, does not go up the formation obstruction so that carriage 3 can not hang over the top board B2 of downside, and opening one side of the peristome 8 that can not fly out.In addition, because one side is an open state, so, in order to keep IC assembly 4, be provided with in the inboard of this carriage 3 and support and the fixing structure of the top and the bottom of IC encapsulation, so that it is not easy to split away off from support container to contact one side shifting with when returning.
To moving of contact one side, be that top board A1, top board B2 and guide rail 5 are keeping carriage 3 to contact one side shifting synergistically, with corresponding IC socket contact.And, after carrying out electrical test, get back to original position after, block 10 leaves, and it is fallen downwards.
But, for corresponding with the assembly of different shape, the part relevant with the encapsulation shape of assembly be the structure division of top board A1, top board B2, guide rail 5, carriage 3 for example, with the same replaceable accessory (the チ ェ Application ジ キ Star ト) structure that adopts in the past, so that can change at an easy rate.
In the present invention, as depicted in figs. 1 and 2, in the structure of the guide rail 5 in gap 9 of width that is formed with appointment for the carriage 3 of taking in IC assembly 4 is correctly fallen along IC assembly falling direction 6 and height and top board, top board central portion 20 in the structure of replacement prior art is divided into top top board A1 and bottom top board B2 with it.Like this, under the situation of H type IC assembly, the top board that needn't be provided with among the IC socket B15 shown in Figure 6 that prior art adopts withdraws from groove 21.Thereby, also can realize corresponding easily contact structure for slim contact structure.That is,, just can top board be set and withdraw from groove 21 in IC socket B15 one side by peristome 8 is set on top board.
In the explanation of the foregoing description, the situation of slim VSMP encapsulation has been described, but, for the situation that QFP encapsulate and PGA encapsulates that direction is leaded at 4, the interval that makes peristome 8 by setting is wideer than the IC lead-in wire, than the narrow opening structure of carriage 3, just can equally with the foregoing description implement.
Except the foregoing description, in order to cushion with contact one side the collision when chimeric and utilize the structure example of bracket plate 27 and spring 28 additional cushion structures to be shown in Fig. 8 (a) and (b).At this moment, for the back side at guide rail 26 is provided with bracket plate 27, shown in Fig. 8 (b) like that, on guide rail 26, be formed for perforation to the both ends of the surface of the through bracket pressing plate 27 of carriage 3 guiding.In addition, this bracket plate 27 is being pressed on the back side of guide rail 26 under the effect of spring 28.The two sides of the bracket plate 27 of " コ " shape are outstanding along planing surface, give the transverse direction position guiding of carriage 3.
During contact all with guide rail 26 to contact one side shifting, when touching,, thereby can make carriage 3 keep stable status to contact even the collision of the top 27a of bracket plate 27 and socket one side container also can be cushioned by spring 28.
In the above-described embodiments, it is the situation that the support sector of the carriage of being made up of top board A1, top board B2 3 is prolonged with H type IC socket, but, also can be as required with the length setting of the support sector of this top board A1, top board B2 be with H type IC socket beyond, with the corresponding length of other IC sockets, and also can be the length of support rack 3, can implement like this, equally.
Like this, even just can realize under the situation of slim IC socket also can corresponding contact structure for contact one side.
Claims (2)
1.IC the test unit contact structure of processor, it is characterized in that: have the carriage (3) of taking in IC assembly (4) and be positioned at contacting of test probe portion (13) one sides and use the IC socket, and make in the structure of the contact portion that carriage (3) contacts with the IC socket, setting forms the top board attachment (7) that falls to sliding gap (9) accordingly with the size of carriage (3), top board A (1), top board B (2) and guide rail (5), and support rack (3) is set, and when carrying out the contact action of corresponding IC socket and IC assembly (4), make top board A (1) and top board B (2) can not become the top board A (1) with peristome (8) structure and the top board B (2) of obstacle.
2. by the contact structure of the described IC test unit of claim 1 with processor, it is characterized in that: in said structure, for transverse direction position guiding, buffering and contact one side of giving carriage (3) collision when chimeric, append the contact buffer gear of setting by spring (28) and bracket plate (27) formation in rail back.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49049/95 | 1995-02-14 | ||
| JP7049049A JPH08220189A (en) | 1995-02-14 | 1995-02-14 | Contact structure of handler for ic testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1141434A true CN1141434A (en) | 1997-01-29 |
Family
ID=12820235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN96104014A Pending CN1141434A (en) | 1995-02-14 | 1996-02-12 | Contact structure of treatment device used for IC testing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPH08220189A (en) |
| KR (1) | KR970702497A (en) |
| CN (1) | CN1141434A (en) |
| WO (1) | WO1996025672A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1068695C (en) * | 1997-07-25 | 2001-07-18 | 阿尔卑斯电气株式会社 | Contact structure |
| CN109648495A (en) * | 2018-12-29 | 2019-04-19 | 温州易正科技有限公司 | A kind of positioning guide rail structure on diode behavior detection device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS622172A (en) * | 1985-06-28 | 1987-01-08 | Kokusai Electric Co Ltd | Measuring portion of ic handler |
| JPH03200079A (en) * | 1989-12-28 | 1991-09-02 | Hitachi Ltd | Carrier and handler for semiconductor device |
-
1995
- 1995-02-14 JP JP7049049A patent/JPH08220189A/en not_active Withdrawn
-
1996
- 1996-02-12 CN CN96104014A patent/CN1141434A/en active Pending
- 1996-02-14 WO PCT/JP1996/000318 patent/WO1996025672A1/en unknown
- 1996-02-14 KR KR1019960705678A patent/KR970702497A/en not_active Application Discontinuation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1068695C (en) * | 1997-07-25 | 2001-07-18 | 阿尔卑斯电气株式会社 | Contact structure |
| CN109648495A (en) * | 2018-12-29 | 2019-04-19 | 温州易正科技有限公司 | A kind of positioning guide rail structure on diode behavior detection device |
| CN112059958A (en) * | 2018-12-29 | 2020-12-11 | 李生明 | Positioning guide rail structure on diode performance detection equipment |
| CN112059958B (en) * | 2018-12-29 | 2021-10-22 | 苏州市东挺河智能科技发展有限公司 | Positioning guide rail structure on diode performance detection equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO1996025672A1 (en) | 1996-08-22 |
| JPH08220189A (en) | 1996-08-30 |
| KR970702497A (en) | 1997-05-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |