JPH08211101A - 全ウェハ試験用の多ポート薄膜プローブ - Google Patents

全ウェハ試験用の多ポート薄膜プローブ

Info

Publication number
JPH08211101A
JPH08211101A JP7267178A JP26717895A JPH08211101A JP H08211101 A JPH08211101 A JP H08211101A JP 7267178 A JP7267178 A JP 7267178A JP 26717895 A JP26717895 A JP 26717895A JP H08211101 A JPH08211101 A JP H08211101A
Authority
JP
Japan
Prior art keywords
test
probe
chips
thin film
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7267178A
Other languages
English (en)
Japanese (ja)
Inventor
Jr John Pasiecznik
ジョン・パゼツニック
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of JPH08211101A publication Critical patent/JPH08211101A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
JP7267178A 1994-10-14 1995-10-16 全ウェハ試験用の多ポート薄膜プローブ Pending JPH08211101A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32329094A 1994-10-14 1994-10-14
US323290 1994-10-14

Publications (1)

Publication Number Publication Date
JPH08211101A true JPH08211101A (ja) 1996-08-20

Family

ID=23258543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7267178A Pending JPH08211101A (ja) 1994-10-14 1995-10-16 全ウェハ試験用の多ポート薄膜プローブ

Country Status (4)

Country Link
US (1) US5623214A (en, 2012)
EP (1) EP0707214A3 (en, 2012)
JP (1) JPH08211101A (en, 2012)
TW (1) TW274636B (en, 2012)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0964125A (ja) * 1995-08-24 1997-03-07 Nippon Maikuronikusu:Kk プローブカード
JP2000227446A (ja) * 1998-11-30 2000-08-15 Japan Electronic Materials Corp プローブカード
JP2006343182A (ja) * 2005-06-08 2006-12-21 Renesas Technology Corp 半導体集積回路装置の製造方法
US8174793B2 (en) 2010-06-22 2012-05-08 Tdk Corporation Thin film magnetic head and magnetic disk device and electronic component

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US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
JP3135825B2 (ja) 1995-09-27 2001-02-19 株式会社東芝 プローブカードおよびそのプローブカードを使用した半導体集積回路のプロービング試験方法
US5914613A (en) * 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
JP3142801B2 (ja) 1997-09-04 2001-03-07 松下電器産業株式会社 半導体集積回路の検査方法、プローブカード及びバーンイン用ボード
JPH1197494A (ja) * 1997-09-18 1999-04-09 Hitachi Ltd 半導体装置およびその製造方法
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6081110A (en) * 1998-09-30 2000-06-27 Credence Systems Corporation Thermal isolation plate for probe card
US6441315B1 (en) * 1998-11-10 2002-08-27 Formfactor, Inc. Contact structures with blades having a wiping motion
US6233184B1 (en) 1998-11-13 2001-05-15 International Business Machines Corporation Structures for wafer level test and burn-in
US6137297A (en) * 1999-01-06 2000-10-24 Vertest Systemsn Corp. Electronic test probe interface assembly and method of manufacture
JP3565086B2 (ja) * 1999-04-16 2004-09-15 富士通株式会社 プローブカード及び半導体装置の試験方法
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
JP2001091543A (ja) * 1999-09-27 2001-04-06 Hitachi Ltd 半導体検査装置
US6262582B1 (en) 1999-10-15 2001-07-17 International Business Machines Corporation Mechanical fixture for holding electronic devices under test showing adjustments in multiple degrees of freedom
US6437587B1 (en) * 1999-11-04 2002-08-20 Agilent Technologies, Inc. ICT test fixture for fine pitch testing
US6838890B2 (en) * 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US6603323B1 (en) * 2000-07-10 2003-08-05 Formfactor, Inc. Closed-grid bus architecture for wafer interconnect structure
US6690184B1 (en) * 2000-08-31 2004-02-10 Micron Technology, Inc. Air socket for testing integrated circuits
US6437364B1 (en) * 2000-09-26 2002-08-20 United Microelectronics Corp. Internal probe pads for failure analysis
DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
DE10130976C2 (de) * 2001-06-27 2003-06-12 Infineon Technologies Ag Verfahren zum Anordnen von Nadelsätzen auf einer Nadelkarte
US6912778B2 (en) 2001-07-19 2005-07-05 Micron Technology, Inc. Methods of fabricating full-wafer silicon probe cards for burn-in and testing of semiconductor devices
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
US7127550B1 (en) * 2001-10-31 2006-10-24 Sandisk Corporation Multi-module simultaneous program, erase test, and performance method for flash memory
AU2003233659A1 (en) 2002-05-23 2003-12-12 Cascade Microtech, Inc. Probe for testing a device under test
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
GB2425844B (en) 2003-12-24 2007-07-11 Cascade Microtech Inc Active wafer probe
US6943573B1 (en) * 2004-03-23 2005-09-13 Texas Instruments Incorporated System and method for site-to-site yield comparison while testing integrated circuit dies
US7368927B2 (en) 2004-07-07 2008-05-06 Cascade Microtech, Inc. Probe head having a membrane suspended probe
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US7282933B2 (en) * 2005-01-03 2007-10-16 Formfactor, Inc. Probe head arrays
US7414418B2 (en) * 2005-01-07 2008-08-19 Formfactor, Inc. Method and apparatus for increasing operating frequency of a system for testing electronic devices
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
EP1932003A2 (en) 2005-06-13 2008-06-18 Cascade Microtech, Inc. Wideband active-passive differential signal probe
USD544452S1 (en) * 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
JP2007101373A (ja) * 2005-10-05 2007-04-19 Renesas Technology Corp プローブシート接着ホルダ、プローブカード、半導体検査装置および半導体装置の製造方法
JP2007121180A (ja) * 2005-10-31 2007-05-17 Fujitsu Ltd 半導体装置の試験装置及び半導体装置の試験方法
DE202007018733U1 (de) 2006-06-09 2009-03-26 Cascade Microtech, Inc., Beaverton Messfühler für differentielle Signale mit integrierter Symmetrieschaltung
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7649366B2 (en) 2006-09-01 2010-01-19 Formfactor, Inc. Method and apparatus for switching tester resources
US7852094B2 (en) * 2006-12-06 2010-12-14 Formfactor, Inc. Sharing resources in a system for testing semiconductor devices
US7764076B2 (en) * 2007-02-20 2010-07-27 Centipede Systems, Inc. Method and apparatus for aligning and/or leveling a test head
WO2008120302A1 (ja) * 2007-03-28 2008-10-09 Fujitsu Microelectronics Limited 半導体装置の試験装置
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8278958B2 (en) * 2009-05-01 2012-10-02 Cambridge Silicon Radio Ltd. Semiconductor test system and method
US8347689B2 (en) * 2009-12-08 2013-01-08 GM Global Technology Operations LLC Tool for assisting leak testing of an enclosed volume and method incorporating the tool
TWI473189B (zh) * 2012-06-15 2015-02-11 Powertech Technology Inc 已單離晶粒堆疊封裝件之晶圓級測試方法
JP5928203B2 (ja) * 2012-07-10 2016-06-01 三菱電機株式会社 検査装置
US9891266B2 (en) * 2014-02-25 2018-02-13 Taiwan Semiconductor Manufacturing Co., Ltd. Test circuit and method
TWI790515B (zh) * 2020-12-21 2023-01-21 矽品精密工業股份有限公司 測試裝置及測試方法
CN114966139B (zh) * 2022-07-22 2022-10-25 威海双丰物探设备股份有限公司 水听器用阻抗匹配器参数测量装置

Citations (3)

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JPS6377129A (ja) * 1986-09-19 1988-04-07 Oki Electric Ind Co Ltd プロ−ブカ−ド
JPH04266043A (ja) * 1990-10-31 1992-09-22 Hughes Aircraft Co 集積回路の試験用装置および方法

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JPS51121268A (en) * 1975-04-17 1976-10-23 Seiko Epson Corp Semiconductor wafer measuring device
JPS6377129A (ja) * 1986-09-19 1988-04-07 Oki Electric Ind Co Ltd プロ−ブカ−ド
JPH04266043A (ja) * 1990-10-31 1992-09-22 Hughes Aircraft Co 集積回路の試験用装置および方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0964125A (ja) * 1995-08-24 1997-03-07 Nippon Maikuronikusu:Kk プローブカード
JP2000227446A (ja) * 1998-11-30 2000-08-15 Japan Electronic Materials Corp プローブカード
JP2006343182A (ja) * 2005-06-08 2006-12-21 Renesas Technology Corp 半導体集積回路装置の製造方法
US8174793B2 (en) 2010-06-22 2012-05-08 Tdk Corporation Thin film magnetic head and magnetic disk device and electronic component

Also Published As

Publication number Publication date
US5623214A (en) 1997-04-22
TW274636B (en, 2012) 1996-04-21
EP0707214A2 (en) 1996-04-17
EP0707214A3 (en) 1997-04-16

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