JPH0810952Y2 - 半導体素子収納用パッケージ - Google Patents

半導体素子収納用パッケージ

Info

Publication number
JPH0810952Y2
JPH0810952Y2 JP1990064360U JP6436090U JPH0810952Y2 JP H0810952 Y2 JPH0810952 Y2 JP H0810952Y2 JP 1990064360 U JP1990064360 U JP 1990064360U JP 6436090 U JP6436090 U JP 6436090U JP H0810952 Y2 JPH0810952 Y2 JP H0810952Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
base
package
mounting portion
capacitive element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990064360U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0423146U (US06262066-20010717-C00424.png
Inventor
淳 田中
成夫 棚橋
理 明石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1990064360U priority Critical patent/JPH0810952Y2/ja
Publication of JPH0423146U publication Critical patent/JPH0423146U/ja
Application granted granted Critical
Publication of JPH0810952Y2 publication Critical patent/JPH0810952Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Packaging Frangible Articles (AREA)
JP1990064360U 1990-06-18 1990-06-18 半導体素子収納用パッケージ Expired - Lifetime JPH0810952Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990064360U JPH0810952Y2 (ja) 1990-06-18 1990-06-18 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990064360U JPH0810952Y2 (ja) 1990-06-18 1990-06-18 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0423146U JPH0423146U (US06262066-20010717-C00424.png) 1992-02-26
JPH0810952Y2 true JPH0810952Y2 (ja) 1996-03-29

Family

ID=31595235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990064360U Expired - Lifetime JPH0810952Y2 (ja) 1990-06-18 1990-06-18 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JPH0810952Y2 (US06262066-20010717-C00424.png)

Also Published As

Publication number Publication date
JPH0423146U (US06262066-20010717-C00424.png) 1992-02-26

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term