JPH0810202Y2 - 半導体装置用軽量基板 - Google Patents

半導体装置用軽量基板

Info

Publication number
JPH0810202Y2
JPH0810202Y2 JP11858889U JP11858889U JPH0810202Y2 JP H0810202 Y2 JPH0810202 Y2 JP H0810202Y2 JP 11858889 U JP11858889 U JP 11858889U JP 11858889 U JP11858889 U JP 11858889U JP H0810202 Y2 JPH0810202 Y2 JP H0810202Y2
Authority
JP
Japan
Prior art keywords
plate material
alloy
thin plate
heat sink
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP11858889U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0357945U (cg-RX-API-DMAC10.html
Inventor
秀昭 吉田
祥郎 黒光
誠 鳥海
通男 湯澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP11858889U priority Critical patent/JPH0810202Y2/ja
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to DE69034139T priority patent/DE69034139T2/de
Priority to DE69033718T priority patent/DE69033718T2/de
Priority to KR1019900015989A priority patent/KR0173782B1/ko
Priority to EP00104809A priority patent/EP1020914B1/en
Priority to EP90119255A priority patent/EP0422558B1/en
Priority to US07/594,596 priority patent/US5130498A/en
Publication of JPH0357945U publication Critical patent/JPH0357945U/ja
Application granted granted Critical
Publication of JPH0810202Y2 publication Critical patent/JPH0810202Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP11858889U 1989-10-09 1989-10-09 半導体装置用軽量基板 Expired - Lifetime JPH0810202Y2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP11858889U JPH0810202Y2 (ja) 1989-10-09 1989-10-09 半導体装置用軽量基板
DE69033718T DE69033718T2 (de) 1989-10-09 1990-10-08 Keramisches Substrat angewendet zum Herstellen einer elektrischen oder elektronischen Schaltung
KR1019900015989A KR0173782B1 (ko) 1989-10-09 1990-10-08 전기 또는 전자회로의 성형에 사용되는 세라믹기판
EP00104809A EP1020914B1 (en) 1989-10-09 1990-10-08 Ceramic substrate used for fabricating electric or electronic circuit
DE69034139T DE69034139T2 (de) 1989-10-09 1990-10-08 Keramiksubstrat zur Herstellung elektrischer oder elektronischer Schaltungen
EP90119255A EP0422558B1 (en) 1989-10-09 1990-10-08 Ceramic substrate used for fabricating electric or electronic circuit
US07/594,596 US5130498A (en) 1989-10-09 1990-10-09 Ceramic substrate used for fabricating electric or electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11858889U JPH0810202Y2 (ja) 1989-10-09 1989-10-09 半導体装置用軽量基板

Publications (2)

Publication Number Publication Date
JPH0357945U JPH0357945U (cg-RX-API-DMAC10.html) 1991-06-05
JPH0810202Y2 true JPH0810202Y2 (ja) 1996-03-27

Family

ID=14740302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11858889U Expired - Lifetime JPH0810202Y2 (ja) 1989-10-09 1989-10-09 半導体装置用軽量基板

Country Status (1)

Country Link
JP (1) JPH0810202Y2 (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037231A (ja) * 2001-07-23 2003-02-07 Ibiden Co Ltd モジュール用基板
JP2003060137A (ja) * 2001-08-08 2003-02-28 Ibiden Co Ltd モジュール用基板
JP2003060136A (ja) * 2001-08-08 2003-02-28 Ibiden Co Ltd モジュール用基板
JP2011233735A (ja) * 2010-04-28 2011-11-17 Showa Denko Kk 絶縁回路基板およびその製造方法、パワーモジュール用ベースおよびその製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4756200B2 (ja) 2000-09-04 2011-08-24 Ｄｏｗａメタルテック株式会社 金属セラミックス回路基板
JP5664254B2 (ja) * 2011-01-14 2015-02-04 三菱マテリアル株式会社 パワーモジュール用基板の製造方法及びろう材箔の接合装置
JP5764342B2 (ja) * 2011-02-10 2015-08-19 昭和電工株式会社 絶縁回路基板、ならびにパワーモジュール用ベースおよびその製造方法
JP5861935B2 (ja) * 2011-04-11 2016-02-16 日立金属株式会社 セラミックス回路基板の検査方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037231A (ja) * 2001-07-23 2003-02-07 Ibiden Co Ltd モジュール用基板
JP2003060137A (ja) * 2001-08-08 2003-02-28 Ibiden Co Ltd モジュール用基板
JP2003060136A (ja) * 2001-08-08 2003-02-28 Ibiden Co Ltd モジュール用基板
JP2011233735A (ja) * 2010-04-28 2011-11-17 Showa Denko Kk 絶縁回路基板およびその製造方法、パワーモジュール用ベースおよびその製造方法

Also Published As

Publication number Publication date
JPH0357945U (cg-RX-API-DMAC10.html) 1991-06-05

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