JPH079611Y2 - 半導体ウエハの切断保持機構 - Google Patents
半導体ウエハの切断保持機構Info
- Publication number
- JPH079611Y2 JPH079611Y2 JP1989147793U JP14779389U JPH079611Y2 JP H079611 Y2 JPH079611 Y2 JP H079611Y2 JP 1989147793 U JP1989147793 U JP 1989147793U JP 14779389 U JP14779389 U JP 14779389U JP H079611 Y2 JPH079611 Y2 JP H079611Y2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- suction plate
- wafer
- semiconductor wafer
- holding mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 235000012431 wafers Nutrition 0.000 title claims description 72
- 238000005520 cutting process Methods 0.000 title claims description 68
- 239000004065 semiconductor Substances 0.000 title claims description 39
- 230000002093 peripheral effect Effects 0.000 claims description 16
- 238000005259 measurement Methods 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 238000001179 sorption measurement Methods 0.000 claims 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 21
- 238000011084 recovery Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- -1 transistors Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989147793U JPH079611Y2 (ja) | 1989-12-21 | 1989-12-21 | 半導体ウエハの切断保持機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989147793U JPH079611Y2 (ja) | 1989-12-21 | 1989-12-21 | 半導体ウエハの切断保持機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0387209U JPH0387209U (enExample) | 1991-09-04 |
| JPH079611Y2 true JPH079611Y2 (ja) | 1995-03-08 |
Family
ID=31694291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989147793U Expired - Lifetime JPH079611Y2 (ja) | 1989-12-21 | 1989-12-21 | 半導体ウエハの切断保持機構 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH079611Y2 (enExample) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3834507A (en) * | 1973-01-30 | 1974-09-10 | Kroy Ind Inc | Printing apparatus |
| JPH0695565B2 (ja) * | 1986-06-30 | 1994-11-24 | 日本電気株式会社 | 半導体記憶装置の製造方法 |
| JPH06103674B2 (ja) * | 1987-06-19 | 1994-12-14 | 住友電気工業株式会社 | 半導体単結晶インゴツトの角度調整法と装置 |
-
1989
- 1989-12-21 JP JP1989147793U patent/JPH079611Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0387209U (enExample) | 1991-09-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4921444B2 (ja) | 半導体ウェハの同時両面機械加工のための両面研削盤における研削スピンドル位置の修正のための方法および当該方法を実施するための装置 | |
| JPH02131849A (ja) | 円筒研磨装置 | |
| CN111595517A (zh) | 一种金刚石微径铣刀动平衡测试与修正系统 | |
| JP2002346803A (ja) | 溝加工法、溝加工品、及び、光学部品又は精密部品 | |
| JPH079611Y2 (ja) | 半導体ウエハの切断保持機構 | |
| JP3780841B2 (ja) | インゴットのオリエンテーションフラット加工方法及びオリエンテーションフラット加工装置 | |
| JPH077086Y2 (ja) | 滑り弁等のパッキン面を所定位置でまたは工場で研削しラップ仕上げするための装置 | |
| JPH1015795A (ja) | 単結晶材料の方位修正用支持装置および研削装置 | |
| JPH0310760A (ja) | 結晶質脆性材料切断用ワイヤソー | |
| JP3801780B2 (ja) | ツルーイング工具及びツルーイング工具付きウェーハ面取り装置 | |
| JPS6179559A (ja) | エツジ研磨装置 | |
| JP2001162426A (ja) | 曲面切削装置及び曲面切削方法 | |
| JP4560144B2 (ja) | 梃子式ダイヤルゲージの心ずれ補正工具 | |
| JP2002326144A (ja) | ねじ研削盤の砥石芯出方法 | |
| KR20140092115A (ko) | 잉곳 절단 장치의 스핀들의 축 정렬 방법 | |
| JPH02167703A (ja) | 半導体切断装置 | |
| CN223770114U (zh) | 晶体定向仪 | |
| JP2748569B2 (ja) | 研削加工方法 | |
| JPS59219152A (ja) | 研磨加工機 | |
| JPH09277102A (ja) | 丸チップ切削工具 | |
| JPH03121769A (ja) | 高精度スライシングマシン | |
| JPH0372442B2 (enExample) | ||
| JP2002036081A (ja) | ウェーハのノッチ位置決め装置および方法 | |
| JP2662361B2 (ja) | セラミック体の研削加工方法 | |
| JPH0354844Y2 (enExample) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |