JPH073658Y2 - 射出成形プリント基板 - Google Patents

射出成形プリント基板

Info

Publication number
JPH073658Y2
JPH073658Y2 JP14892386U JP14892386U JPH073658Y2 JP H073658 Y2 JPH073658 Y2 JP H073658Y2 JP 14892386 U JP14892386 U JP 14892386U JP 14892386 U JP14892386 U JP 14892386U JP H073658 Y2 JPH073658 Y2 JP H073658Y2
Authority
JP
Japan
Prior art keywords
injection
printed circuit
circuit board
molded
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP14892386U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6355568U (enExample
Inventor
健造 小林
宜弘 小沼
智也 加藤
久雄 中嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP14892386U priority Critical patent/JPH073658Y2/ja
Publication of JPS6355568U publication Critical patent/JPS6355568U/ja
Application granted granted Critical
Publication of JPH073658Y2 publication Critical patent/JPH073658Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
JP14892386U 1986-09-30 1986-09-30 射出成形プリント基板 Expired - Lifetime JPH073658Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14892386U JPH073658Y2 (ja) 1986-09-30 1986-09-30 射出成形プリント基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14892386U JPH073658Y2 (ja) 1986-09-30 1986-09-30 射出成形プリント基板

Publications (2)

Publication Number Publication Date
JPS6355568U JPS6355568U (enExample) 1988-04-14
JPH073658Y2 true JPH073658Y2 (ja) 1995-01-30

Family

ID=31063640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14892386U Expired - Lifetime JPH073658Y2 (ja) 1986-09-30 1986-09-30 射出成形プリント基板

Country Status (1)

Country Link
JP (1) JPH073658Y2 (enExample)

Also Published As

Publication number Publication date
JPS6355568U (enExample) 1988-04-14

Similar Documents

Publication Publication Date Title
US4912288A (en) Moulded electric circuit package
US5735037A (en) Method of making a handgrip with built-in heater for motorcycle
JPH0224197A (ja) メモリカードの製造方法
US6481101B2 (en) Manufacture of a wiring loom
JPH03136267A (ja) 半導体装置及びその製造方法
JPH02220314A (ja) フレキシブル基板内蔵の電子部品樹脂モールドケース及びその製造方法
JPH073658Y2 (ja) 射出成形プリント基板
JPH0274113A (ja) ブスバー回路板の製造方法
JPH054836B2 (enExample)
JP3379072B2 (ja) 三次元回路体の製造方法
JPH031992A (ja) Ｉｃカードおよびｉｃカード製造方法
JPH04221879A (ja) ジャンパー部を有するプリント回路基板およびその製法
JPH0726858Y2 (ja) プリント回路基板
JPH0563111B2 (enExample)
JP2657612B2 (ja) プリント回路基板とプリント回路基板用転写シートおよびプリント回路基板の製造方法
JPS6398194A (ja) 回路付き射出成形体の製造方法
JPH0758826B2 (ja) 立体印刷回路成形体の製造方法
JP2522740B2 (ja) 立体成形回路板の製造方法および製造装置
JPH0368554B2 (enExample)
JPH043772Y2 (enExample)
JPH05114664A (ja) 電子機器筐体の製造方法
JPH11207781A (ja) 立体回路基板の製造方法
JPH0267114A (ja) 配線回路を有する成形品
JPH0724325B2 (ja) 補強板一体型フレキシブル配線板の製造方法
JPH03243317A (ja) 電気回路インサート成形装置