JPH0735401Y2 - Dip型ic素子へのコンデンサ付加装置 - Google Patents
Dip型ic素子へのコンデンサ付加装置Info
- Publication number
- JPH0735401Y2 JPH0735401Y2 JP1372190U JP1372190U JPH0735401Y2 JP H0735401 Y2 JPH0735401 Y2 JP H0735401Y2 JP 1372190 U JP1372190 U JP 1372190U JP 1372190 U JP1372190 U JP 1372190U JP H0735401 Y2 JPH0735401 Y2 JP H0735401Y2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- capacitor
- chip
- dip type
- chip capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003990 capacitor Substances 0.000 title claims description 35
- 239000002184 metal Substances 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 description 7
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1372190U JPH0735401Y2 (ja) | 1990-02-16 | 1990-02-16 | Dip型ic素子へのコンデンサ付加装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1372190U JPH0735401Y2 (ja) | 1990-02-16 | 1990-02-16 | Dip型ic素子へのコンデンサ付加装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03106751U JPH03106751U (enrdf_load_stackoverflow) | 1991-11-05 |
JPH0735401Y2 true JPH0735401Y2 (ja) | 1995-08-09 |
Family
ID=31517119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1372190U Expired - Fee Related JPH0735401Y2 (ja) | 1990-02-16 | 1990-02-16 | Dip型ic素子へのコンデンサ付加装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0735401Y2 (enrdf_load_stackoverflow) |
-
1990
- 1990-02-16 JP JP1372190U patent/JPH0735401Y2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH03106751U (enrdf_load_stackoverflow) | 1991-11-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R323532 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |