JPH0732107Y2 - 無接点型ｉｃメモリカード - Google Patents
無接点型ｉｃメモリカードInfo
- Publication number
- JPH0732107Y2 JPH0732107Y2 JP3495689U JP3495689U JPH0732107Y2 JP H0732107 Y2 JPH0732107 Y2 JP H0732107Y2 JP 3495689 U JP3495689 U JP 3495689U JP 3495689 U JP3495689 U JP 3495689U JP H0732107 Y2 JPH0732107 Y2 JP H0732107Y2
- Authority
- JP
- Japan
- Prior art keywords
- upper case
- case member
- module
- contactless
- memory card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 230000015654 memory Effects 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 230000008878 coupling Effects 0.000 description 8
- 238000010168 coupling process Methods 0.000 description 8
- 238000005859 coupling reaction Methods 0.000 description 8
- 230000005674 electromagnetic induction Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3495689U JPH0732107Y2 (ja) | 1989-03-28 | 1989-03-28 | 無接点型ｉｃメモリカード |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3495689U JPH0732107Y2 (ja) | 1989-03-28 | 1989-03-28 | 無接点型ｉｃメモリカード |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02126249U JPH02126249U (en, 2012) | 1990-10-17 |
| JPH0732107Y2 true JPH0732107Y2 (ja) | 1995-07-26 |
Family
ID=31539889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3495689U Expired - Lifetime JPH0732107Y2 (ja) | 1989-03-28 | 1989-03-28 | 無接点型ｉｃメモリカード |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0732107Y2 (en, 2012) |
-
1989
- 1989-03-28 JP JP3495689U patent/JPH0732107Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02126249U (en, 2012) | 1990-10-17 |
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