JPH0727635Y2 - 高周波混成集積回路 - Google Patents

高周波混成集積回路

Info

Publication number
JPH0727635Y2
JPH0727635Y2 JP1989040367U JP4036789U JPH0727635Y2 JP H0727635 Y2 JPH0727635 Y2 JP H0727635Y2 JP 1989040367 U JP1989040367 U JP 1989040367U JP 4036789 U JP4036789 U JP 4036789U JP H0727635 Y2 JPH0727635 Y2 JP H0727635Y2
Authority
JP
Japan
Prior art keywords
copper block
heat dissipation
integrated circuit
hybrid integrated
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989040367U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02131351U (enExample
Inventor
進 阪本
孝司 藤岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1989040367U priority Critical patent/JPH0727635Y2/ja
Publication of JPH02131351U publication Critical patent/JPH02131351U/ja
Application granted granted Critical
Publication of JPH0727635Y2 publication Critical patent/JPH0727635Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1989040367U 1989-04-04 1989-04-04 高周波混成集積回路 Expired - Lifetime JPH0727635Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989040367U JPH0727635Y2 (ja) 1989-04-04 1989-04-04 高周波混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989040367U JPH0727635Y2 (ja) 1989-04-04 1989-04-04 高周波混成集積回路

Publications (2)

Publication Number Publication Date
JPH02131351U JPH02131351U (enExample) 1990-10-31
JPH0727635Y2 true JPH0727635Y2 (ja) 1995-06-21

Family

ID=31550095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989040367U Expired - Lifetime JPH0727635Y2 (ja) 1989-04-04 1989-04-04 高周波混成集積回路

Country Status (1)

Country Link
JP (1) JPH0727635Y2 (enExample)

Also Published As

Publication number Publication date
JPH02131351U (enExample) 1990-10-31

Similar Documents

Publication Publication Date Title
US4314270A (en) Hybrid thick film integrated circuit heat dissipating and grounding assembly
JPH0727635Y2 (ja) 高周波混成集積回路
JP3616698B2 (ja) ヒートシンク付きステムの製造方法
JP2000286292A (ja) 支持体にろう付けされる電力部品とその取付け方法
JPH073848B2 (ja) 半導体装置
JPH10189803A (ja) 放熱板への絶縁基板取付構造
JPH05315467A (ja) 混成集積回路装置
JP3450465B2 (ja) 高周波パワーモジュール
JP2501950B2 (ja) 半導体装置
JP2765242B2 (ja) 集積回路装置
JPH11284119A (ja) 半導体集積デバイスの放熱構造
JPH039335Y2 (enExample)
JP2778790B2 (ja) 半導体装置の実装構造及び実装方法
JP2734688B2 (ja) 混成集積回路
JP2812107B2 (ja) 半導体装置
JPH09172114A (ja) 半導体フラットパッケージ
JPH0429573Y2 (enExample)
JPH06181395A (ja) 放熱形プリント配線板
JP2000156430A (ja) 半導体装置
JPS5844636Y2 (ja) 混成集積回路装置
JP2797269B2 (ja) 半導体装置
JP2888192B2 (ja) 表面実装部品の放熱構造
JPH0697686A (ja) 混成集積回路装置
JP3029378U (ja) 半導体装置
JP2540766B2 (ja) 半導体容器