JPH07275771A - Coating applicator for paste - Google Patents

Abstract

PURPOSE:To apply and form plural paste patterns of a desired form on a substrate simultaneously, with high precision and at high speed by making the control of the opposite distance between a nozzle and the substrate be independent of that of the horizontal relative movement of the two. CONSTITUTION:This applicator is provided with nozzles 1a, 1b, optical range finders 3a, 3b for individually measuring the opposite distance between an discharge port of each nozzle and the surface of a substrate 7, tables 6, 8 controlled by a main controller 14a and for horizontally and relatively moving each nozzle and the substrate 7, and an auxiliary controller 14b for individually controlling the opposite distance between the discharge port of each nozzle and the surface of the substrate 7 by using data of each optical range finder 3a, 3b on the relative movement.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate placed on a table by moving the substrate relative to the substrate while ejecting the paste from the nozzles. The present invention relates to a paste applicator for simultaneously applying and drawing a plurality of paste patterns having a desired shape.

[0002]

2. Description of the Related Art A substrate mounted on a table is opposed to a nozzle fixed to the tip of a paste accommodating cylinder in which a paste is accommodated, and the nozzle and the substrate are ejected while ejecting the paste from a paste ejection port of the nozzle. An example of a paste applicator using a discharge drawing technique for applying a paste in a desired pattern on a substrate by moving at least one of the two in the horizontal direction to change the relative positional relationship, It is described in JP-A-2-52742.

Such a paste applicator is equipped with one nozzle and a control device for controlling the positions of the nozzle and the substrate, and a paste paste discharge port at the tip of the nozzle is used to form a resistance paste on an insulating substrate used as the substrate. Is discharged to form a desired resistance paste pattern on the insulating substrate.

[0004]

By the way, since there is usually a slight undulation on the surface of the substrate on which the paste pattern is applied and drawn, not only the applied portion but also the applied width and applied height of the drawn paste. When high accuracy is required, the nozzle and the substrate are moved relatively in the horizontal direction, and the facing distance between the nozzle and the substrate surface is measured and controlled so that the distance falls within a desired range. There is a need to. In the prior art, all such operations are managed by one control device, but the drawing speed is slow because the control is complicated, and the production speed and the amount of production in the paste drawing process are large in the mass production plant. It tends to be decided. Therefore, in order to improve productivity, it is necessary to install multiple paste applicators, but in that case, the production line becomes complicated and it is necessary to expand the space of the production site.
The initial cost increases and the product price is forced to rise.

Therefore, an object of the present invention is to solve the above-mentioned problems of the prior art and to provide a paste coating machine capable of coating and drawing a plurality of paste patterns of a desired shape on a substrate simultaneously with high precision and at high speed. To provide.

[0006]

In order to achieve the above object, according to the present invention, a substrate is placed on a table so as to face a paste discharge port of a nozzle, and the paste stored in a paste storage cylinder is discharged as described above. In a paste coating machine that changes the relative positional relationship between the nozzle and the substrate while ejecting from the outlet onto the substrate, and forms and forms a paste pattern of a desired shape on the substrate, a plurality of nozzles and the nozzles A plurality of measuring means for individually measuring the facing distance between the paste ejection port and the surface of the substrate, a moving means for relatively moving the nozzles and the substrate in the horizontal direction, and the moving means for moving the nozzles relative to each other. The control means is provided for individually controlling the facing distance between the paste ejection port of each nozzle and the surface of the substrate by using the measurement data of each measurement means.

[0007]

In the present invention, the moving means for moving the nozzles and the substrate relatively in the horizontal direction and the controlling means for individually controlling the facing distance between the paste discharge port of each nozzle and the substrate surface are distinguished. However, since the control of the facing interval can be processed independently of the control of the relative movement in the horizontal direction, the facing interval can be increased by shortening the measurement cycle of each measuring means and increasing the number of measurements. Can be controlled with high precision, and therefore, the paste can be discharged onto the substrate while causing the nozzles to follow the undulations of the opposing substrate surfaces, and a plurality of paste patterns having a desired shape can be obtained at the same time.

[0008]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic perspective view showing an embodiment of a paste coating machine according to the present invention, in which 1a and 1b are nozzles,
2a and 2b are paste storage cylinders (or syringes), 3
a and 3b are optical rangefinders, 4a and 4b are Z-axis tables,
5 is an X-axis table, 6 is a Y-axis table, 7 is a substrate on which a paste pattern is drawn, 8 is a θ-axis table, 9 is a mount part, 10 is a Z-axis table support part, 11a and 11b are image recognition cameras, and 12a. , 12b is a nozzle support, 13 is a suction table for suction-fixing the substrate 7, 14a is a main controller,
14b is a sub-control device, 15 is an image processing device, 16 is an external storage device, 17 is an image monitor, and 18 is both control devices 14
A display for displaying the control processing status by a and 14b, 19 is a keyboard, 20a and 20b are lens barrels of the image recognition cameras 11a and 11b, 21a and 21c, respectively.
21e is a servo motor, and 22 is a camera support.
Note that the X-axis table and the Y-axis table of the Z-axis tables 4a and 4b for the Z-axis table support portion 10 are not shown in order to avoid complication of the drawing.

In FIG. 1, an X-axis table 5 is fixed on a gantry 9, and a Y-axis table 6 is mounted on the X-axis table 5 so as to be movable in the X-axis direction. The θ-axis table 8 is mounted on the Y-axis table 6 so as to be movable and rotatable in the Y-axis direction, and the suction table 13 is fixed on the θ-axis table 8. The substrate 7 is placed on the suction table 13.
However, it is adsorbed and fixed, for example, so that its sides are parallel to the X and Y axis directions.

The substrate 7 mounted on the suction table 13
Can be moved in the X and Y axis directions by the control drive of the main controller 14a. That is, the servo motor 21a
Is driven by the main controller 14a, the Y-axis table 6 moves in the X-axis direction, the substrate 7 moves in the X-axis direction, and the servo motor 21b shown in FIG. 3 is driven by the main controller 14a. , The θ-axis table 8 moves in the Y-axis direction, and the substrate 7 moves in the Y-axis direction. Therefore, the main controller 1
When the Y-axis table 6 and the θ-axis table 8 are moved by arbitrary distances by 4a, the substrate 7 is moved by an arbitrary distance in an arbitrary direction within a plane parallel to the gantry 9. It should be noted that the θ-axis table 8 can be rotated by an arbitrary amount in the θ direction around the center position thereof by the servo motor 21e.

A Z-axis table support portion 10 is installed on the pedestal portion 9, and Z-axis tables 4a and 4b are attached to the Z-axis table support portion 10 so as to be movable in the Z-axis direction (vertical direction). The nozzle 1a, the paste storage cylinder 2a, and the optical distance meter 3a are mounted on one Z-axis table 4a, and the nozzle 1b, the paste storage cylinder 2b, and the optical distance meter are mounted on the other Z-axis table 4b. 3b is mounted. Control drive of these Z-axis tables 4a and 4b in the Z-axis direction is performed by the sub-control device 14b. That is, when the servo motors 21c and 21d are driven by the sub-control device 14b, the Z-axis tables 4a and 4b move in the Z-axis direction, and along with this, the nozzles 1a and 1b and the paste storage cylinders 2a and 2b.
The optical rangefinders 3a and 3b move in the Z-axis direction. The nozzles 1a and 1b are respectively provided in the paste container 2
Nozzles 1a and 1b are provided at the tips of a and 2b.
And the lower ends of the paste storage cylinders 2a and 2b are slightly apart from each other via nozzle support members 12a and 12b having a connecting portion.

The optical distance meters 3a and 3b respectively measure the distance between the paste discharge port, which is the tip (lower end) of the nozzles 1a and 1b, and the upper surface of the substrate 7 by non-contact triangulation.

That is, since these optical rangefinders 3a and 3b have the same structure, only one of the rangefinders 3a will be described with reference to FIG. 2. The lower end of the optical rangefinder 3a is cut in a triangular shape. The light emitting element is provided on one of the two slopes facing the cut portion, and the light receiving element is provided on the other. The nozzle support 12a is attached to the tip of the paste storage cylinder 2a and extends below the cut portion of the optical distance meter 3a, and the nozzle 1a is provided on the lower surface of the tip.
Is attached. The light emitting element provided in the cut portion of the optical distance meter 3a irradiates the area immediately below the paste discharge port of the nozzle 1 as indicated by the alternate long and short dash line so that the light receiving element receives the reflected light from there. Has become. When the distance between the paste ejection port of the nozzle 1a and the substrate 7 (see FIG. 1) arranged below the ejection port is within a predetermined range, the light from the light emitting element is received by the light receiving element. As described above, when the positional relationship between the nozzle 1a and the optical distance meter 3a is set and the distance (opposing distance) between the paste discharge port of the nozzle 1a and the substrate 7 changes, the vicinity immediately below the discharge port At, the position of the irradiation point of the light from the light emitting element on the substrate 7 (hereinafter referred to as the measurement point) changes,
Therefore, since the light receiving state of the light receiving element changes, the nozzle 1
The distance between the paste ejection port of a and the substrate 7 can be measured.

As will be described later, when the substrate 7 moves in the X- and Y-axis directions to form a paste pattern, the irradiation point of light from the light emitting element on the substrate 7 (hereinafter referred to as measurement point). ) Crosses the already formed paste pattern, the nozzle 1a (1) by the optical rangefinder 3a (3b)
An error corresponding to the thickness of the paste pattern occurs in the measured value of the distance between the paste discharge port of b) and the surface of the substrate 7.
Therefore, in order to prevent the measurement point from crossing the paste pattern as much as possible, the paste is dropped from the nozzle 1a (1b) onto the substrate 7 (hereinafter referred to as the application point) in an oblique direction with respect to the X and Y axes. It is advisable to use the displaced position as the measurement point.

When the paste in the paste accommodating cylinder 2a (2b) is used up, the nozzle is replaced, and the nozzle 1a (so that the application point coincides with a certain set position on the substrate 7 where the paste is to be applied). 1b) is attached, but the paste storage cylinder 2a (2b) and the nozzle support 12a
(12b), the nozzle position may change before and after the nozzle replacement due to variations in the mounting accuracy of the nozzle 1a (1b). However, as shown in FIG. 2, the application point has an allowable range (Δ
When it is in (X, ΔY), the nozzle 1a (1b) is assumed to be normally attached. However, ΔX is the width in the X-axis direction of the allowable range, and ΔY is the width in the Y-axis direction. Then, the image recognition cameras 11a and 11b respectively confirm the positions of the nozzles 1a and 1b after the replacement, and check the nozzles 1a and 1b.
It is used to measure the distance between a and 1b.

The main and sub-control devices 14a and 14b are the optical rangefinders 3a and 3b and the image recognition camera 11, respectively.
When the data from a and 11b is supplied, the servo motors 21a to 21e are driven in response to the data. In addition, each of the motors 21
The data on the driving conditions of a to 21e are both control devices 1
It is fed back to 4a and 14b.

In this structure, the rectangular substrate 7
Is placed on the suction table 13, the suction table 13 holds the substrate 7 by vacuum suction. Then, by rotating the θ-axis table 8, each side of the substrate 7 is set to be parallel to each of the X axis and the Y axis. After that, the servo motor 21 is determined based on the measurement results of the optical rangefinders 3a and 3b.
By driving and controlling c and 21d, the Z-axis tables 4a and 4b move downward, and until the distance between the paste discharge ports of the nozzles 1a and 1b and the surface of the substrate 7 becomes a prescribed distance. The nozzles 1a and 1b are lowered from above the substrate 7.

After that, the paste supplied from the paste accommodating cylinders 2a, 2b through the nozzle supports 12a, 12b is discharged from the paste discharge ports of the nozzles 1a, 1b onto the substrate 7, and at the same time, the servo motors 21a, 21b.
The Y-axis table 6 and the θ-axis table 8 are appropriately moved by the drive control (see FIG. 3), whereby the paste is applied to the two positions on the substrate 7 at the same time in a pattern of a desired shape. Since the paste pattern to be formed can be converted by the distances in the X and Y axis directions, when the data for forming the pattern of the desired shape is input from the keyboard 19, the main controller 14a outputs this data to the servo motors 21a, 2a.
Drawing is automatically performed by converting the number of pulses given to 1b and outputting a command.

FIG. 3 shows both control devices 14a, 1 in FIG.
4b is a block diagram showing a specific example, in which parts corresponding to those in FIG. 1 are designated by the same reference numerals.

In the figure, 14a-1 and 14b-1
Is a microcomputer containing a ROM storing a processing program, a RAM storing various data, a CPU for calculating various data, and the like, 14a-2, 14b.
-2 is the image processing device 15 or the optical rangefinder 3a,
An external interface for connecting an external device such as 3b and connecting both control devices 14a and 14b, 1
4a-3 and 14b-3 are servo motors 21a to 21e.
Motor controller 14a-4 is a servomotor 21
X-axis driver that drives a, 14a-5 is a Y-axis driver that drives the servomotor 21b, 14a-6 is a θ-axis driver that drives the servomotor 21e, 14b-4, 14
Reference numeral b-5 is a Z-axis driver that drives the servomotors 21c and 21d, and E is an encoder.

A pattern drawing pattern from the keyboard 19
Data indicating the exchange of nozzles and nozzles, the data measured by the optical rangefinders 3a and 3b, and the data generated by the processing of the microcomputers 14a-1 and 14b-1. , Are stored in the RAM built in each of the microcomputers 14a-1 and 14b-1.

Next, the processing operation of both control devices 14a and 14b at the time of painting and painting the paste will be described. In the flow charts of FIG. 4 and subsequent figures, reference numeral S in the figure
Means step. Further, in each figure, the process flow having a single flow is executed by the main control device 14a, and when the process flow is double flow, the process flow on the left side is executed by the main control device 14a and the process flow on the right side is executed. The flow is to be executed in the sub control device 14b.

In FIG. 4, when the power is turned on (step 100), the initial setting of the paste applicator is executed (step 200). In this initial setting, as shown in FIG. 5, the Y-axis table 6 and the θ-axis table 8 are positioned at a predetermined origin position (step 211), and data regarding the paste pattern is set. Setting, that is, the data (NZL-N) of the nozzle to be used, the discharge pressure of the paste related to the height of the paste pattern, the height data of the nozzle, and the paste Discharge start position data and paste pattern
The position data and the like regarding the relationship between the board and the substrate 7 are set, and a process of temporarily storing these data in the RAM incorporated in the main controller 14a is performed (step 212), and the discharge end position data of the paste is recorded. Setting (step 213), Z
The axis tables 4a and 4b are positioned at a predetermined origin position (step 221), and the data about the paste pattern set in step 212 is transferred to the main controller 14.
A process of moving from the built-in RAM to the built-in RAM of the sub-control unit 14b and storing it (step 222) is performed, and data input for these settings is performed from the keyboard 19. In addition, the data NZ of the nozzle to be used
When L-N is 1, only nozzle 1a is used and nozzle 1
The paste pattern is not applied and drawn by b.

After the above initial setting process is completed, in FIG. 4, the substrate 7 for drawing the paste pattern is mounted on the suction table 13 and held by suction (step 300).
Substrate positioning processing (step 400) is performed.

The step 400 will be described in detail below with reference to FIG.

In FIG. 6, first, the positioning marks previously attached to the substrate 7 mounted on the suction table 13 are photographed by the image recognition cameras 11a and 11b (step 40).
1) The position of the center of gravity of the positioning mark within the visual fields of the image recognition cameras 11a and 11b is obtained by image processing (step 402). Then, the amount of deviation between the center of this field of view and the position of the center of gravity of the positioning mark is calculated (step 403), and this amount of deviation is used to move the Y-axis table 6 required to move the substrate 7 to the desired position. And the amount of movement of the θ-axis table 8 is calculated (step 404). Then, the calculated movement amounts are converted into the operation amounts of the servo motors 21a, 21b, 21e (step 405), and the servo motors 21a, 21b, 21e are driven according to the operation amounts, so that each table 6, 8 moves to move the substrate 7 toward the desired position (step 406).

When the movement is completed in this way, the substrate 7
Image recognition cameras 11a and 11b are provided for the upper positioning mark.
Then, the center (center of gravity) of the positioning mark in the field of view is measured (step 407), the deviation between the center of the field of view and the center of the mark is obtained, and the amount of displacement of the substrate 7 is calculated. The data is stored in the RAM of the microcomputer 14a (step 408). Then, it is confirmed whether or not the displacement amount is within a range of, for example, 1/2 or less of the allowable range described in FIG. 2 (step 409). Within this range,
This means that the process of step 400 is completed. If it is out of this range, the process returns to step 404 and the above-mentioned series of processes is performed again, and the process is repeated until the positional deviation amount of the substrate 7 falls within the range of the above value.

As a result, the substrate 7 is positioned so that the desired coating point on the substrate 7 from which the coating is to be started does not deviate beyond a predetermined range from directly below the paste discharge ports of the nozzles 1a and 1b. It was done.

In FIG. 4 again, when the process of step 400 is completed, the process proceeds to the paste film forming process of step 500. This will be described below with reference to FIG.

In FIG. 7, on the main controller 14a side,
First, the substrate 7 is moved to the coating start position (step 5
11). The board 7 is subjected to the board positioning process described above (see FIG.
Since the substrate 7 is positioned at the desired position in step 400), the substrate 7 can be accurately moved to the coating start position in step 511. On the other hand, the sub controller 14
On the b side, the nozzles 1a and 1b are moved to the set height position (step 521). That is, the facing distance from the paste discharge ports of the nozzles 1a and 1b to the surface of the substrate 7 is set to be equal to the thickness of the paste film to be formed.
Notification of completion of movement of the nozzles 1a and 1b (step 522)
In response to this, the main controller 14a moves to step 512, starts the pattern movement of the substrate from the coating start position, and the nozzles 1a and 1b start the ejection of the paste step 5
Move to 13. At the same time, on the side of the sub-control device 14b, the measured data of the facing distance between the paste discharge ports of the nozzles 1a and 1b and the substrate 7 by the optical distance meters 3a and 3b is input to measure the waviness of the surface of the substrate 7. (Step 523),
In addition, based on the measured data, the optical rangefinder 3a,
It is judged whether or not the above-mentioned measurement point of 3b crosses over the paste film (step 524). For example, when the measured data of the optical rangefinders 3a and 3b deviates from the set tolerance value of the facing distance, it is determined that the measurement point is on the paste film.

When the measuring points of the optical rangefinders 3a and 3b are not on the paste film, the Z-axis table 4 is based on the measured data.
Correction data for moving a and 4b is calculated (step 525). Then, the Z-axis tables 4a and 4b are driven to individually correct the heights of the nozzles 1a and 1b, and the positions of the nozzles 1a and 1b in the Z-axis direction are maintained at the set values (step 526). On the other hand, when it is determined that the measurement point is passing over the paste film, the heights of the nozzles 1a and 1b are not corrected, and the heights before the determination are maintained. When the measurement point is passing over the paste film having a slight width, the undulation of the substrate 7 hardly changes, so the nozzles 1a, 1
Even if the height correction of b is not performed, there is no change in the ejection shape of the paste, and a paste pattern having a desired thickness can be drawn.

Next, in the main controller 14a, it is judged whether or not the discharge of the paste is ended (step 51).
4) If the ejection has ended (step 515), it is determined in step 516 whether formation of the partial pattern has ended. Then, if the partial pattern is not completed, the process returns to the process of starting paste ejection (step 513), but if the partial pattern is completed, a nozzle rise notification is issued (step 517), and the sub-control device 14b. Performs nozzle rise processing (step 528).
The main controller 14a further determines whether formation of all patterns on the substrate 7 is completed (step 51).
8) If there is still a need for drawing, a process of moving the substrate 7 to the coating start position (step 511) and the nozzle 1
When the process returns to the process of setting the heights of a and 1b (step 521) and the above series of steps is repeated and all the patterns are completed, this paste film forming step (step 500)
To finish.

That is, step 514 is a processing operation for determining whether or not the end points of the paste patterns which have been continuously drawn until then are reached, and these end points are not necessarily drawn on the substrate 7. It is not the end point of the pattern of the entire desired shape. That is, the pattern of the entire desired shape may be composed of a plurality of partial patterns that are separated from each other, or the partial patterns may be discontinuous patterns. Therefore, whether or not the end point of all patterns including all of them has been reached The determination is made in step 518.
On the other hand, in the sub-control device 14b, it is always judged whether or not the nozzles 1a and 1b should be raised to the retracted position (step 527), and if it is not necessary to raise the nozzle, it returns to the substrate surface waviness measurement processing (step 523). Since the series of processes described above is repeated, the nozzle height correction process is restarted when the measurement point has finished passing over the paste film.

Each process in the above-mentioned paste film forming step (step 500) will be described in detail below.

First, the nozzle moving process of step 521 in FIG. 7 will be described with reference to FIG.

First, the value of the data NZL-N relating to the used nozzle which is set in step 212 of FIG. 5 and stored in the RAM of the sub-control device 14b in step 222 is compared and judged (step 521a), and the data is deselected. When the data NZL-N is 2, the nozzles 1b and 1a are sequentially moved to the set height (steps 521b and 521c), and when the data NZL-N is not 2, only the nozzle 1a is moved. It is moved (step 521c).

Next, the paste ejection process in the main controller 14a in step 512 of FIG. 7 will be described with reference to FIG.

Also in the paste discharge process, first, similarly to step 521a in FIG.
The values of L-N are compared and determined (step 512a), and when the data NZL-N is 2, the discharge of paste is sequentially started from the paste discharge ports of the nozzles 1b and 1a (step 512b, 512b). Step 512c), data NZL-
If N is not 2, ejection of the paste is started from only the nozzle 1a (step 512c).

Further, the substrate surface waviness measuring process in the sub controller 14b in step 523 of FIG. 7 will be described with reference to FIG.

First, similar to step 521a in FIG. 8 and step 512a in FIG.
The value of ZL-N is compared and judged (step 523a), and the
When the NZL-N is 2, the distances between the nozzles 1b and 1a and the surface of the substrate 7 are set to the optical distance meters 3b and 3b, respectively.
3a are sequentially measured (step 523b, step 523c), and when the data NZL-N is not 2, only the facing distance between the nozzle 1a and the surface of the substrate 7 is measured by the optical distance meter 3a (step). 523c). This measurement data corresponds to the microcomputer 14b-1 shown in FIG.
Stored in the built-in RAM and continue
It is used for the judgment processing (step 524) of whether it is on the storage film or the Z-axis correction data calculation processing (step 525).

That is, in the process of determining whether or not it is on the paste film in step 524, as shown in FIG.
It is judged whether or not the measurement point on the nozzle 1a side by the optical distance meter 3a is passing over the already drawn paste film (step 5).
24a), 1 is set to the flag NZLF1 if the vehicle is passing (step 524b), and if the vehicle is not passing, the flag NZL1
F1 is set to 0 (step 524c). Next, it is determined whether or not the measurement point on the nozzle 1b side by the optical distance meter 3b is passing over the already drawn paste film (step 524).
d) If the vehicle is passing, the flag NZLF2 is set to 1 (step 524e), and if not passing, the flag NZLF2 is set to 0 (step 524f). This judgment result is
It is used in the nozzle height correction processing described later.

In the Z-axis correction data calculation processing in step 525, first, as shown in FIG. 12, the value of data NZL-N relating to the nozzle used is compared and determined (step 525a), and the data is calculated. When NZL-N is 2, the correction data of the nozzles 1b and 1a are sequentially calculated (step 5).
25b, step 525c), if the data NZL-N is not 2, the correction data is calculated only for the nozzle 1a (step 525c). This calculation data is shown in FIG.
RAM with built-in microcomputer 14b-1 shown in FIG.
Stored in.

Finally, the nozzle height correction processing in step 526 of FIG. 7 will be described with reference to FIG.

First, it is determined whether or not the flag NZLF1 on the nozzle 1a side set in the determination process of FIG. 11 is set (step 526a), and when the flag NZLF1 is not present, that is, the measurement point passes over the paste film. If not, the routine proceeds to step 526b, where the calculated data obtained by the correction data calculation processing (step 525c in FIG. 12) of the nozzle 1a is the microcomputer 14b-1.
Then, the height of the nozzle 1a is corrected by reading from the RAM (step 526b). If the flag NZLF1 is set, the measurement point is passing over the paste film, so the process jumps to step 526c. Therefore, the height of the nozzle 1a is not corrected and the height before passing is maintained. Similarly, in step 526c, it is determined whether or not the flag NZLF2 on the nozzle 1b side set in the determination process of FIG. 11 is set. If the flag NZLF2 is 0 and the measurement point is not passing over the paste film, step 526c is performed. Proceeding to step 526d, the correction data calculation process for the nozzle 1b (step 525 in FIG. 12).
The calculated data obtained in step b) is read from the RAM to correct the height of the nozzle 1b, and when the flag NZLF2 is 1 and the measurement point is passing over the paste film, the nozzle is The height of 1b is not corrected and the height before passing is maintained, and the process ends.

Thus, the nozzle height correction process (step 5
26) is completed, the process proceeds to step 527 in FIG. 7 to determine whether or not there is a command to raise the nozzle to the retracted position. If there is no command, it means that the paste pattern is being applied and drawn. The process returns to the surface waviness measurement process (step 523) and the same process is repeated.

Now, as described above, when the paste film forming step (step 500) of the pattern of the desired shape is completed, the paste application drawing of the substrate 7 placed and held on the suction table 13 is completed. Is completed, the process proceeds to step 600 in FIG. 4 to discharge the substrate 7 from the suction table 13, and then in step 700, it is determined whether or not all the processes are stopped. That is, in the case where the paste is applied and drawn on the plurality of substrates 7 with the same pattern, the mass productivity is enhanced by returning to step 300 and repeating the series of processing up to step 700.

As described above, in the above embodiment, the main controller 14a which controls the relative positional relationship between the substrate 7 and the nozzles 1a and 1b in the horizontal direction to manage the drawing position of the paste pattern.
And a sub-control device 14b that controls the height of the nozzles 1a and 1b to manage the coating height of the paste. The sub-control device 14b functions as a main control device 14a that controls the whole. Although separated, both control devices 14a, 14
By exchanging a small amount of data regarding the elevation of the nozzle and the like between b, a series of steps for coating and drawing can be integrally controlled. Then, the sub control device 14b causes the nozzles 1a and 1b to
Since the processing other than the height management is not burdened, the height management cycle is shortened, that is, the optical rangefinders 3a, 3
It is possible to increase the number of times of measurement data and height correction by b, whereby the heights of the nozzles 1a and 1b can accurately follow the waviness of the surface of the substrate 7, respectively. Therefore, the width and height of the paste pattern drawn using the nozzles 1a and 1b are both desired. Further, since the measurement data obtained by the optical rangefinders 3a and 3b are stored in the storage means of the sub-control device 14b, the data can be exchanged at high speed and the processing delay does not occur.

On the other hand, regarding the main controller 14a,
Since the height correction processing of the nozzles 1a and 1b based on the measurement results of the optical rangefinders 3a and 3b is released, the Y and θ axis tables 6 and 8 are based on the data of the encoder E. It becomes possible to draw fine patterns by finely driving, and it becomes possible to execute management to control the whole as a whole.

That is, in the above-described embodiment, since control complexity can be avoided by division of labor, a plurality of paste patterns having a desired shape can be simultaneously drawn with high precision and at high speed, and fine control is possible. It is also easy to perform and increase reliability.

Further, in terms of device manufacturing, the processing software of the main control unit 14a and the sub-control unit 14b can be independent modules, which facilitates development and facilitates debugging work. High reliability can be secured.

For example, when forming a paste pattern having an open bottle cross-sectional shape in which the drawing start position and the drawing end position are close to each other, at the beginning and end of the pattern, the discharge pressure of the paste, the Y and θ axes are formed. The positions of the tables 6 and 8 and the heights of both nozzles 1a and 1b need to be matched, but in the above-described embodiment, the main and sub control devices 14a and 14b share these controls by autonomous distributed processing. Therefore, it is possible to easily draw a desired paste pattern in which the shapes of the start end and the end are not disturbed.

The initial setting process of the applicator (step 20)
In order to reduce the time required in 0), the external interface
An external storage device 16 connected to the face 14a-2 and loaded with storage means such as an IC card or a floppy disk or a hard disk stores various necessary data in advance, and these data are stored in advance. -Computer
It may be moved to the RAM of the data 14a-1 and 14b-1. In addition, the measured data is stored in the external storage device 16 and stored in the R of the microcomputers 14a-1 and 14b-1.
The storage capacity of the AM may be expanded, or the data about the determination result may be stored in the external storage device 16 for later use.

Further, in the above embodiment, the case where a plurality of paste patterns are drawn on one substrate has been described, but a plurality of substrates are suction-held on the suction table 13 and the same paste pattern is simultaneously applied to each substrate. -You may draw a picture. that time,
Driving and controlling the X and Y axis tables (not shown) of the Z axis tables 4a and 4b is convenient for aligning the substrates. Further, when the image recognition cameras 11a and 11b are provided with X and Y axis tables, these tables are driven and controlled according to the positioning marks of the boards of different sizes, and the image recognition is performed at a predetermined place. Since the cameras 11a and 11b can be moved, paste patterns can be drawn on substrates of various sizes.

[0055]

As described above, in the paste applicator according to the present invention, the control of the facing distance between the nozzle and the substrate surface is performed independently of the relative position control of the nozzle and the substrate in the horizontal direction. Therefore, it is possible to form a paste pattern while making a plurality of nozzles follow the undulations of the substrate surface facing each other, so that a plurality of paste patterns of a desired shape can be formed on the substrate simultaneously with high accuracy and at high speed. Can be applied and drawn. Therefore, in a mass production factory, the productivity can be easily increased and the product price can be significantly reduced without complicating the line or expanding the site space.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an embodiment of a paste applicator according to the present invention.

FIG. 2 is a perspective view showing a positional relationship between a nozzle and an optical distance meter of the embodiment.

FIG. 3 is a block diagram showing a specific example of a control device of the same embodiment.

FIG. 4 is a flowchart showing the overall operation of the same embodiment.

5 is a flowchart showing an initial setting process of the paste applicator in FIG.

6 is a flowchart showing a substrate positioning process in FIG.

7 is a flowchart showing a paste film forming process in FIG.

8 is a flowchart showing a nozzle moving process in FIG.

9 is a flowchart showing a paste ejection process in FIG.

10 is a flowchart showing a substrate surface waviness measurement process in FIG.

FIG. 11 is a flowchart showing a past film passage determination process in FIG. 7.

12 is a flowchart showing a Z-axis correction data calculation process in FIG.

FIG. 13 is a flowchart showing a nozzle height correction process in FIG.

[Explanation of symbols]

 1a, 1b Nozzle 2a, 2b Paste storage cylinder 3a, 3b Optical rangefinder 4a, 4b Z-axis table 5 X-axis table 6 Y-axis table 7 Substrate 8 θ-axis table 9 Stand part 10 Z-axis table support part 11a, 11b Image recognition camera 12a, 12b Nozzle support tool 13 Suction table 14a, 14b Control device 15 Image processing device 16 External storage device 17 Image monitor 18 Display 19 Key board 21a-21e Servo motor

Front Page Continuation (72) Inventor Fukuo Yoneda 5-2 Koyodai, Ryugasaki, Ibaraki Hitachi Techno Engineering Co., Ltd. Development Laboratory (72) Satoshi Yawata 5-2 Koyodai, Ryugasaki, Ibaraki Hitachi Techno Engineering Development Laboratory Co., Ltd. (72) Inventor Yukihiro Kawasumi 5-2, Koyodai, Ryugasaki City, Ibaraki Prefecture Hitachi Techno Engineering Co., Ltd. Development Laboratory

Claims (3)

[Claims] 1. A substrate is placed on a table so as to face a paste discharge port of a nozzle, and the nozzle and the substrate are separated from each other while discharging the paste stored in the paste storage cylinder from the discharge port onto the substrate. In a paste coating machine that changes the relative positional relationship and draws and forms a paste pattern of a desired shape on the substrate, individually measures the plurality of nozzles and the facing interval between the paste discharge port of each nozzle and the surface of the substrate. A plurality of measuring means, a moving means for relatively moving the nozzles and the substrate relative to each other in the horizontal direction, and a paste for the nozzles using the measurement data of the measuring means during the relative movement. A paste applicator comprising: a control unit that individually controls the facing distance between the ejection port and the surface of the substrate. 2. The method according to claim 1, wherein the plurality of nozzles individually discharge the paste onto the plurality of substrates mounted on the table, and the moving means comprises the A paste applicator, wherein the horizontal relative movements of the nozzles and the substrates are performed in the same amount and at the same time. 3. The paste applicator according to claim 1, wherein the control means includes a storage means for storing the measurement data of each of the measuring means.