JPH0726865Y2 - プリント板の金メッキ装置 - Google Patents
プリント板の金メッキ装置Info
- Publication number
- JPH0726865Y2 JPH0726865Y2 JP9222388U JP9222388U JPH0726865Y2 JP H0726865 Y2 JPH0726865 Y2 JP H0726865Y2 JP 9222388 U JP9222388 U JP 9222388U JP 9222388 U JP9222388 U JP 9222388U JP H0726865 Y2 JPH0726865 Y2 JP H0726865Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- gold plating
- plating
- tank
- electrode pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title claims description 52
- 229910052737 gold Inorganic materials 0.000 title claims description 29
- 239000010931 gold Substances 0.000 title claims description 29
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 238000005406 washing Methods 0.000 description 6
- 238000005238 degreasing Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9222388U JPH0726865Y2 (ja) | 1988-07-12 | 1988-07-12 | プリント板の金メッキ装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9222388U JPH0726865Y2 (ja) | 1988-07-12 | 1988-07-12 | プリント板の金メッキ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0213769U JPH0213769U (en, 2012) | 1990-01-29 |
JPH0726865Y2 true JPH0726865Y2 (ja) | 1995-06-14 |
Family
ID=31316676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9222388U Expired - Lifetime JPH0726865Y2 (ja) | 1988-07-12 | 1988-07-12 | プリント板の金メッキ装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0726865Y2 (en, 2012) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI671435B (zh) * | 2018-06-08 | 2019-09-11 | 台灣創智成功科技有限公司 | 電鍍裝置 |
-
1988
- 1988-07-12 JP JP9222388U patent/JPH0726865Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0213769U (en, 2012) | 1990-01-29 |
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