JPH0726853Y2 - Led表示装置 - Google Patents
Led表示装置Info
- Publication number
- JPH0726853Y2 JPH0726853Y2 JP1989064824U JP6482489U JPH0726853Y2 JP H0726853 Y2 JPH0726853 Y2 JP H0726853Y2 JP 1989064824 U JP1989064824 U JP 1989064824U JP 6482489 U JP6482489 U JP 6482489U JP H0726853 Y2 JPH0726853 Y2 JP H0726853Y2
- Authority
- JP
- Japan
- Prior art keywords
- lens
- led
- display device
- led chips
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989064824U JPH0726853Y2 (ja) | 1989-06-01 | 1989-06-01 | Led表示装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989064824U JPH0726853Y2 (ja) | 1989-06-01 | 1989-06-01 | Led表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH033762U JPH033762U (ko) | 1991-01-16 |
JPH0726853Y2 true JPH0726853Y2 (ja) | 1995-06-14 |
Family
ID=31596110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989064824U Expired - Lifetime JPH0726853Y2 (ja) | 1989-06-01 | 1989-06-01 | Led表示装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0726853Y2 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61205463A (ja) * | 1985-03-08 | 1986-09-11 | Shinwa Seisakusho:Kk | 生海苔連続軟化洗浄装置 |
JP2540829Y2 (ja) * | 1993-04-02 | 1997-07-09 | 信男 鈴木 | ガス発生装置およびガス発生装置用除じん装置 |
WO2007139781A2 (en) * | 2006-05-23 | 2007-12-06 | Cree Led Lighting Solutions, Inc. | Lighting device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4912881U (ko) * | 1972-05-11 | 1974-02-02 | ||
JPS5315269Y2 (ko) * | 1972-06-26 | 1978-04-21 | ||
JPS51154160U (ko) * | 1975-06-02 | 1976-12-08 | ||
JPS5950455U (ja) * | 1982-09-24 | 1984-04-03 | 三洋電機株式会社 | 発光ダイオ−ド装置 |
JPH0447747Y2 (ko) * | 1986-08-25 | 1992-11-11 | ||
JPS648762U (ko) * | 1987-07-07 | 1989-01-18 | ||
JPS6449987U (ko) * | 1987-09-22 | 1989-03-28 |
-
1989
- 1989-06-01 JP JP1989064824U patent/JPH0726853Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH033762U (ko) | 1991-01-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |