JPH0726841Y2 - 半導体集積回路 - Google Patents

半導体集積回路

Info

Publication number
JPH0726841Y2
JPH0726841Y2 JP17743087U JP17743087U JPH0726841Y2 JP H0726841 Y2 JPH0726841 Y2 JP H0726841Y2 JP 17743087 U JP17743087 U JP 17743087U JP 17743087 U JP17743087 U JP 17743087U JP H0726841 Y2 JPH0726841 Y2 JP H0726841Y2
Authority
JP
Japan
Prior art keywords
ground
integrated circuit
bonding pads
wiring
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP17743087U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0180937U (US20100012521A1-20100121-C00001.png
Inventor
三左男 樋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP17743087U priority Critical patent/JPH0726841Y2/ja
Publication of JPH0180937U publication Critical patent/JPH0180937U/ja
Application granted granted Critical
Publication of JPH0726841Y2 publication Critical patent/JPH0726841Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP17743087U 1987-11-19 1987-11-19 半導体集積回路 Expired - Lifetime JPH0726841Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17743087U JPH0726841Y2 (ja) 1987-11-19 1987-11-19 半導体集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17743087U JPH0726841Y2 (ja) 1987-11-19 1987-11-19 半導体集積回路

Publications (2)

Publication Number Publication Date
JPH0180937U JPH0180937U (US20100012521A1-20100121-C00001.png) 1989-05-30
JPH0726841Y2 true JPH0726841Y2 (ja) 1995-06-14

Family

ID=31469094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17743087U Expired - Lifetime JPH0726841Y2 (ja) 1987-11-19 1987-11-19 半導体集積回路

Country Status (1)

Country Link
JP (1) JPH0726841Y2 (US20100012521A1-20100121-C00001.png)

Also Published As

Publication number Publication date
JPH0180937U (US20100012521A1-20100121-C00001.png) 1989-05-30

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