JPH0726841Y2 - 半導体集積回路 - Google Patents
半導体集積回路Info
- Publication number
- JPH0726841Y2 JPH0726841Y2 JP17743087U JP17743087U JPH0726841Y2 JP H0726841 Y2 JPH0726841 Y2 JP H0726841Y2 JP 17743087 U JP17743087 U JP 17743087U JP 17743087 U JP17743087 U JP 17743087U JP H0726841 Y2 JPH0726841 Y2 JP H0726841Y2
- Authority
- JP
- Japan
- Prior art keywords
- ground
- integrated circuit
- bonding pads
- wiring
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17743087U JPH0726841Y2 (ja) | 1987-11-19 | 1987-11-19 | 半導体集積回路 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17743087U JPH0726841Y2 (ja) | 1987-11-19 | 1987-11-19 | 半導体集積回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0180937U JPH0180937U (US07754267-20100713-C00021.png) | 1989-05-30 |
JPH0726841Y2 true JPH0726841Y2 (ja) | 1995-06-14 |
Family
ID=31469094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17743087U Expired - Lifetime JPH0726841Y2 (ja) | 1987-11-19 | 1987-11-19 | 半導体集積回路 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0726841Y2 (US07754267-20100713-C00021.png) |
-
1987
- 1987-11-19 JP JP17743087U patent/JPH0726841Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0180937U (US07754267-20100713-C00021.png) | 1989-05-30 |
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