JPH0723929Y2 - チップインダクタンス素子 - Google Patents
チップインダクタンス素子Info
- Publication number
- JPH0723929Y2 JPH0723929Y2 JP1989018418U JP1841889U JPH0723929Y2 JP H0723929 Y2 JPH0723929 Y2 JP H0723929Y2 JP 1989018418 U JP1989018418 U JP 1989018418U JP 1841889 U JP1841889 U JP 1841889U JP H0723929 Y2 JPH0723929 Y2 JP H0723929Y2
- Authority
- JP
- Japan
- Prior art keywords
- inductance element
- chip inductance
- lead wire
- substrate
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 75
- 239000000758 substrate Substances 0.000 claims description 51
- 238000005192 partition Methods 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 238000004804 winding Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 54
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 239000000463 material Substances 0.000 description 11
- 239000004698 Polyethylene Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- -1 polyethylene Polymers 0.000 description 9
- 229920000573 polyethylene Polymers 0.000 description 9
- 230000000903 blocking effect Effects 0.000 description 5
- 230000006378 damage Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989018418U JPH0723929Y2 (ja) | 1989-02-21 | 1989-02-21 | チップインダクタンス素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989018418U JPH0723929Y2 (ja) | 1989-02-21 | 1989-02-21 | チップインダクタンス素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02110309U JPH02110309U (en, 2012) | 1990-09-04 |
| JPH0723929Y2 true JPH0723929Y2 (ja) | 1995-05-31 |
Family
ID=31233051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989018418U Expired - Lifetime JPH0723929Y2 (ja) | 1989-02-21 | 1989-02-21 | チップインダクタンス素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0723929Y2 (en, 2012) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019021897A (ja) * | 2017-07-11 | 2019-02-07 | Tdk株式会社 | コイル装置 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0624970Y2 (ja) * | 1990-12-15 | 1994-06-29 | 太陽誘電株式会社 | 巻線部品用ドラムコア |
| JP4529381B2 (ja) * | 2003-05-27 | 2010-08-25 | 株式会社村田製作所 | 巻線部品および巻線の巻回方法 |
| JP5257849B2 (ja) * | 2009-06-24 | 2013-08-07 | Ｔｄｋ株式会社 | 樹脂封止型コイル部品及び樹脂封止型コイル部品の製造方法 |
| JP7288297B2 (ja) * | 2018-10-30 | 2023-06-07 | 太陽誘電株式会社 | コイル部品及び電子機器 |
| CN117773255A (zh) * | 2024-01-02 | 2024-03-29 | 湖南奇力新电子科技有限公司 | 一种nr电感端银面线槽口月牙形状缩锡焊接工艺 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS585320U (ja) * | 1981-07-01 | 1983-01-13 | ソニー株式会社 | インダクタンス素子 |
| JPS58187117U (ja) * | 1982-06-07 | 1983-12-12 | 東光株式会社 | 高周波コイル |
| JPH0534309Y2 (en, 2012) * | 1985-07-23 | 1993-08-31 |
-
1989
- 1989-02-21 JP JP1989018418U patent/JPH0723929Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019021897A (ja) * | 2017-07-11 | 2019-02-07 | Tdk株式会社 | コイル装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02110309U (en, 2012) | 1990-09-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |