JPH0720919Y2 - マイクロ波集積回路用パツケ−ジ - Google Patents
マイクロ波集積回路用パツケ−ジInfo
- Publication number
- JPH0720919Y2 JPH0720919Y2 JP1987006953U JP695387U JPH0720919Y2 JP H0720919 Y2 JPH0720919 Y2 JP H0720919Y2 JP 1987006953 U JP1987006953 U JP 1987006953U JP 695387 U JP695387 U JP 695387U JP H0720919 Y2 JPH0720919 Y2 JP H0720919Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- microwave integrated
- package
- frame
- line conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 43
- 229910052751 metal Inorganic materials 0.000 claims description 43
- 239000000919 ceramic Substances 0.000 claims description 33
- 239000004020 conductor Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 239000012212 insulator Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Waveguides (AREA)
- Microwave Amplifiers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987006953U JPH0720919Y2 (ja) | 1987-01-22 | 1987-01-22 | マイクロ波集積回路用パツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987006953U JPH0720919Y2 (ja) | 1987-01-22 | 1987-01-22 | マイクロ波集積回路用パツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63115228U JPS63115228U (enrdf_load_stackoverflow) | 1988-07-25 |
| JPH0720919Y2 true JPH0720919Y2 (ja) | 1995-05-15 |
Family
ID=30789953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987006953U Expired - Lifetime JPH0720919Y2 (ja) | 1987-01-22 | 1987-01-22 | マイクロ波集積回路用パツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0720919Y2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4817924B2 (ja) * | 2006-03-29 | 2011-11-16 | 株式会社東芝 | 半導体パッケージ |
| JP5886637B2 (ja) * | 2012-01-24 | 2016-03-16 | 京セラ株式会社 | 冷却基板、素子収納用パッケージ、および実装構造体 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58190046A (ja) * | 1982-04-30 | 1983-11-05 | Fujitsu Ltd | 半導体装置 |
-
1987
- 1987-01-22 JP JP1987006953U patent/JPH0720919Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63115228U (enrdf_load_stackoverflow) | 1988-07-25 |
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